IEEE Transactions on Electron Devices

Papers
(The H4-Index of IEEE Transactions on Electron Devices is 41. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)
ArticleCitations
Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications92
TechRxiv: Share Your Preprint Research with the World!86
Table of Contents82
IEEE Transactions on Electron Devices Information for Authors80
Blank Page74
Sc₀.₁Al₀.₉N-Based Bimorph Piezoelectric MEMS Microphones With Tractive Structures73
IEEE Transactions on Electron Devices Information for Authors73
Enhancing Broadband 4H-SiC Photodetectors With Gold Nanoparticles: Expanding Sensitivity From UV to SWIR Spectrum72
Theoretical and Experimental Investigations on Input Couplers for a G-Band Gyro-TWT72
Semiconductor Device Modeling for Circuit and System Design70
Achieving Optimal Impact Ionization-Limited Breakdown Voltages in Scaled mm-Wave InP/GaInAsSb DHBTs66
Enabling High-Sensitivity Calorimetric Flow Sensor Using Vanadium Dioxide Phase-Change Material With Predictable Hysteretic Behavior58
Evaluation and Establishment of an Empirical Model for the Dynamic Ron Effect of GaN Power Device in Hard Switching Mode56
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing55
Design and Experiment of a Compact Circular Waveguide TM₀₁ to TE₀₁ Mode Converter53
Table of Contents53
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Wide Band Gap Semiconductors for Automotive Applications52
CRESCENT-1D: A 1-D Solver of Coupled Charge and Light Transport in Heterostructures for the Design of Near-Field Thermophotonic Engines51
Fast Electron Gun Design Methodology Based on Fitting the Beam-Edge Potential Profiles51
Achieving 1-nm-Scale Equivalent Oxide Thickness Top-Gate Dielectric on Monolayer Transition Metal Dichalcogenide Transistors With CMOS-Friendly Approaches49
Design-Oriented Analytical Model for Nanowire Biosensors Including Dynamic Aspects49
Dual-Band Terahertz Harmonic Gyrotron Driven by Axis-Encircling Electron Beam47
Investigation of Bottom Gate Connection in Double-Gate a-IGZO TFTs for Optimizing Compensation Performance of AMOLED Displays47
Impact of a Moderately Doped Contact Layer on Breakdown Voltage in AlGaN/GaN Gated-Anode Diodes for Microwave Rectification46
The Implications of Collisions on the Spatial Profile of Electric Potential and the Space-Charge-Limited Current46
High-Q Switchable BAW Resonators With 5-V Switching Voltages and Through GaN Vias45
Physical Compact Model for Source-Gated Transistors for DC Application45
Materials, processing and integration for neuromorphic devices and in-memory computing44
Failure Mechanism of 1200-V SiC MOSFET With Embedded Schottky Barrier Diode Under Short-Circuit Condition44
From Mega to nano: Beyond one Century of Vacuum Electronics44
IEEE ELECTRON DEVICES SOCIETY43
Blank Page43
Plasma Jet Printing: An Introduction43
1.2-kV Vertical GaN PIN Rectifier With Ion-Implanted Floating Guard Rings42
IEEE Transactions on Electron Devices information for authors42
Experimental Demonstration of Holey Silicon-Based Thermoelectric Cooling42
Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications42
An Accurate Drain Current Model of Multichannel Cylindrical High-K HfO2-/Si3N4-Based GAA-MOSFET for SRAM Application42
Introducing IEEE Collabratec41
New Erratic Program Disturbance Mechanism of 2T-SONOS Embedded Nonvolatile Memory41
Table of Contents41
Awards Flyer41
IEEE Transactions on Electron Devices information for authors41
Dielectrics for 2D electronics41
0.08527684211731