Journal of Adhesion

Papers
(The H4-Index of Journal of Adhesion is 16. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-05-01 to 2025-05-01.)
ArticleCitations
Curing effects on forming and mechanical performance of clinch-adhesive joints of dissimilar materials between AA5754 Aluminum Alloy and Q235 steel80
Material-related and various dependences of adhesion force on piezo velocity revealed on an AFM at moderate humidity66
Development of productive curing processes for the manufacturing of adhesively bonded milling tools65
Experimental and numerical study of rate-dependent mode-I failure of a structural adhesive41
Optimization of chitosan adhesive properties by means of genipin crosslinking33
Adhesive paperboard connections in architectural applications: modelling, characterization, and performance assessment27
A discussion on the various aspects of the minimum pressing time for polyurethane adhesives20
Effects of aging temperature and humidity on the response of medium and high strength threadlockers20
Failure mechanisms in pre-tensioned bonded hybrid joints20
Effect of graphene nanoplatelets on mode I fracture Toughness of epoxy adhesives under water aging conditions19
A novel 3D fibre-reinforcement architecture for high performance natural fibre reinforced composite adhesively bonded joints18
Machine learning-based assessment of hygrothermal aging performance in CFRP-aluminum alloy adhesive bonded structures18
Viscoelastic behavior of pressure-sensitive adhesive based on block copolymer and kraft lignin18
Pull-out behavior of glulam connections with glued-in rod loaded parallel to the grain18
Parametric investigation of bonded composite joints under Mode II using a new methodology based on design of experiments17
Estimate residual strength of degraded bonded joints by combining analytical models with non-destructive evaluations16
Comparison between cure kinetics by means of dynamic rheology and DSC of formaldehyde-based wood adhesives16
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