Journal of Adhesion

Papers
(The H4-Index of Journal of Adhesion is 16. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)
ArticleCitations
Optimization of chitosan adhesive properties by means of genipin crosslinking78
Material-related and various dependences of adhesion force on piezo velocity revealed on an AFM at moderate humidity46
A discussion on the various aspects of the minimum pressing time for polyurethane adhesives36
Adhesive paperboard connections in architectural applications: modelling, characterization, and performance assessment29
Effect of graphene nanoplatelets on mode I fracture Toughness of epoxy adhesives under water aging conditions28
Experimental and numerical study of rate-dependent mode-I failure of a structural adhesive26
Low-velocity impact analysis of metal-composite joints with grain-refined A356 and reinforced epoxy adhesive using six node pentahedron cohesive elements23
Development of productive curing processes for the manufacturing of adhesively bonded milling tools21
Effects of aging temperature and humidity on the response of medium and high strength threadlockers21
Curing effects on forming and mechanical performance of clinch-adhesive joints of dissimilar materials between AA5754 Aluminum Alloy and Q235 steel20
Machine learning-based assessment of hygrothermal aging performance in CFRP-aluminum alloy adhesive bonded structures19
Failure mechanisms in pre-tensioned bonded hybrid joints19
Comparison between cure kinetics by means of dynamic rheology and DSC of formaldehyde-based wood adhesives17
A novel 3D fibre-reinforcement architecture for high performance natural fibre reinforced composite adhesively bonded joints17
Estimate residual strength of degraded bonded joints by combining analytical models with non-destructive evaluations17
Preparation of high strength silicone-based electrically conductive adhesives with excellent electrical conductivity at low content of Ag fillers16
Pull-out behavior of glulam connections with glued-in rod loaded parallel to the grain16
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