Microelectronics Reliability

Papers
(The H4-Index of Microelectronics Reliability is 22. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)
ArticleCitations
Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module83
Reliability assessment of miniaturised electromechanical RF relays for space applications80
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation50
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer36
Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding34
Editorial Board32
Editorial Board30
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors27
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method27
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study26
DNN-based error level prediction for reducing read latency in 3D NAND flash memory25
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress25
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation25
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading24
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films24
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching24
Optical characterizations of “P-down” bonded InP pump lasers24
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules23
A programmable checker for automated 2.5D/3D IC latch-up verification and hot junctions detection23
A Π-shaped p-GaN HEMT for reliable enhancement mode operation23
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad23
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test23
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation22
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation22
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions22
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