Microelectronics Reliability

Article	Citations
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	58
Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	40
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	40
Editorial Board	39
Editorial Board	32
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	31
Reliability assessment of miniaturised electromechanical RF relays for space applications	31
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	30
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	29
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	28
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	27
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	27
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	26
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	26
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	26
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	26
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	26
Current balancing of parallel-connected silicon carbide (SiC) MOSFET power devices using peak detection via PCB sensors	24
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	24
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	23
A physics-based electromigration model for advanced interconnects	23
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer	23
Evaluating switch lifetime in soft-switched single-stage differential-mode SST	22
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	22
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	22

Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	21
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	21
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	21
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	21
Effect of microstructural variability on fatigue simulations of solder joints	21
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	20
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	20
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	20
Design optimization of a packaged thermoelectric generator for electrically active implants	20
Editorial Board	20
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	20
The characterization of low-k thin films and their fracture analysis in a WLCSP device	20
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	20
Mission profile-based digital twin framework using functional mock-up interfaces for assessing system's degradation behaviour	19
Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs	19
Performance assessment and RUL prediction of power converters under the multiple components degradation	19
Tilt- and warpage measurement as inline quality assessment tool	18
Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects	17
Micro-Raman and SEM analyses of failed GaN HEMT multilayer architecture	17
Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu	17
Condition monitoring for detection of humidity-induced failures in control electronics of power converters	17
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress	17
Editorial Board	17
Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process	17
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices	16
Sintering of mixed Cu Ag nanoparticles pretreated by formic acid vapor for Cu Cu low temperature bonding	16
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	16
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	16
In-field test solution for enhancing safety in automotive applications	15
Self-healing solder joints in power electronics: Experimental validation of die-attach void effects on reliability	15
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions	15
Evaluation of the helium hermeticity reliability of copper through-glass vias	15
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	15
Investigation of electromagnetic force effect in IGBT modules	15
Prognosis of LED lumen degradation using Bayesian optimized neural network approach	15
Theoretical performance and reliability optimization of graphene based electrically doped tunnel FET under interface trap charge constraints: A device-level approach	15
Effect of load sequence interaction for low ∆T's on the reliability of bonded aluminum wires in IGBTs	15
A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters	14
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling	14
Exploring the radiant impact of irradiance on the electrical resistance of organic thin film	14
Editorial Board	14
New temperature-independent aging indicator for power semiconductor devices – Application to IGBTs	14
An efficient structure to improve the reliability of deep neural networks on ARMs	14
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness	14
Composite powders with carbon nanotubes for laser printing of electronics	14
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain	14
Interlayer capacitance extraction for profiling interface states in LaB₆/H-diamond Schottky diodes	13
Investigation on vibration induced fretting in degraded contact interface	13
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis	13
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding	13

Electron-beam-induced current (EBIC) imaging technique to quicken polysilicon defect localization in MOSFETs	13
Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method	13
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability	13
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer	13
Detailed total ionizing dose effects on LDMOS transistors	13
Electroplated Ni-P film for power devices without cracks induced by high temperature heating	13
Impact of aging on temperature measurements performed using a resistive temperature sensor with sensor-to-microcontroller direct interface	13
Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs	13
Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures	13
Editorial Board	12
DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate	12
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm	12
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure	12
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations	12
Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere	12
Editorial Board	12
An FPGA-based architecture for time-resolved polarization probing of FeRAM fatigue	12
Accurate and efficient simulation of PCB warpage during manufacturing processes using partitioned equivalent model	12
Comparative analysis of mechanical and thermal stresses in ITO and AZO thin films on flexible PET substrates for flexible electronic applications	12
Optical, electrical, and mechanical reliability of 1700 PPI Micro-LED device	12
NSFET performance optimization through SiGe channel design - A simulation study	12
High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor	12
Design of compact-diode-SCR with low-trigger voltage for full-chip ESD protection	12
A quantitative analysis and testing assessment method for functional damage state of electronic circuits under impact loads	12
Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules	12
Accelerated lifetime estimation and failure analysis of micromachined humidity sensors under high temperature and high humidity conditions	12
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle	11
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging	11
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process	11
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach	11
Application-aware aging analysis and mitigation for SRAM Design-for-Relability	11
Performance investigation and impact of trap charges on novel lateral dual gate oxide-bilateral tunnelling based field effect transistor	11
Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications	11
Characterization of a novel radiation hardened by design (RHD14) bit-cell based on 20-nm FinFET technology using TCAD simulations	11
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation	11
Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors	11
Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics	11
Uncertainty quantification in microelectronic packaging using feedback-enhanced adaptive polynomial chaos expansion	11
Toward a multi-physical approach to connection ageing in power modules	11
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor	11
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe	11
Reliability evaluation of FPGA based pruned neural networks	11
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds	11
An Eigendecomposition-based dynamic characteristics design method of three-phase grid-connected inverters with considering reliability	10
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver	10
Editorial Board	10
Material level analytical model of total ionizing dose induced DC characteristics shift for FDSOI IC design	10
ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results	10
Novel testability modelling and diagnosis method considering the supporting relation between faults and tests	10
Aging modelling of Li-ion battery systems based on accelerated tests	10
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures	10
Failure rate analysis of radiation tolerant design techniques on SRAM-based FPGAs	10
Electrothermal power cycling of GaN and SiC cascode devices	10
Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks	10
A PMOS-embedded low-voltage triggered silicon controlled rectifier ESD protection device for 3.3V I/O application	10
Evaluation of bonding techniques for ultrasound transducers	10
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method	10
Vulnerability evaluation on 16 nm FinFET Ultrascale+ MPSoC using fault injection and proton irradiation	10
Orbital validation for tin whisker suppression by conformal coating	10
Evaluation of the impact of defects on threshold voltage drift employing SiO2 pMOS transistors	10
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages	10
An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation	10
A high-efficiency aging test with new data processing method for semiconductor device	10
Research on ESD failure voltage model of the T-shaped wiring structure in GOA products	10
Thermal reliability of Cu sintering joints for high-temperature die attach	9
Micro-additives and their impact on tensile and fracture performance of solder	9
An informer network-based circuit boards fault detection method using infrared temperature series	9
Experimental analysis on stochastic behavior of preswitching time in STT-MRAM	9
Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment	9
Design of soft error correction flip-flop cells for highly reliable applications	9
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures	9
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	9
A shared page-aware machine learning assisted method for predicting and improving multi-level cell NAND flash memory life expectancy	9
Editorial Board	9
Optimization and reliability of ultrasonic wedge bonding performance of copper wires on gold pads for MEMS devices	9
Influence of electron beam irradiation induced charging-effect on nanoprobing localization of a crystal defect in MOSFET	9
Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs	9
Hybrid domain-based fast transient thermal evaluation method for power semiconductor modules in EV motor drive	9
Fault-tolerant multiplier using self-healing technique	9
Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter	9

Software-controlled pipeline parity in GPU architectures for error detection	9
The effect of Si3N4/Al2O3 stacked structure of AlGaN/GaN HEMTs	9
Effect of Ag addition on the microstructure and distribution of second-phase particles in tin-based solder alloys	9
Thermo-mechanical optimization of ceramic substrate with through ceramic vias by Taguchi-Grey method	9
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position	9
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions	9
Microelectronics Reliability: Publisher’s note	9
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults	9
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods	9
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs	9
Influence of normal load, electric current and sliding speed on tribological performance of electrical contact interface	9
Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity	9
Radiation effect in FD-SOI nanowire FETs due to high dose rate gamma-ray under variable irradiation temperatures	9
The thickness and width of the intrinsic region effected electrical properties of GaAs p-i-n photodiodes	9
Vulcanization failure mechanism analysis of lead-frame LED package	8
Characterization of single-event transients induced by high LET heavy ions in 16 nm bulk FinFET inverter chains	8
Experimental study of transient dose rate effect on radiation-hardened digital signal processor	8
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study	8
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	8
New methodology for optimal preconditioning of GaN HEMT devices	8
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier	8
Single event burnout of SiC MOSFET induced by atmospheric neutrons	8
Epitaxial hillocks defects caused by subsurface damage from InAs substrate	8
Developed non-destructive verification methods for accelerated temperature cycling of power MOSFETs	8
Advanced power cycling test strategies on discrete SiC MOSFETs in different operating modes and the impact on lifetime	8
Aggravated NBTI reliability due to hard-to-detect open defects	8
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC	8
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	8
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	8
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	8
OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs	8
BP neural network for non-invasive IGBT junction temperature online detection	8
Towards development of an intelligent failure analysis system based on infrared thermography	8
Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs	8
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter	8
Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior	8
Editorial Board	8
A review on warpage measurement metrologies for advanced electronic packaging	8
Characteristics and avalanche investigation of SiC VDMOSFETs with enhanced P-Based implantation	8
Implementation of high failure current Schottky-embedded DDSCR	7
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	7
TID evaluation based on variabilities of space radiation and device failure dose in typical navigation satellite orbits	7
A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact	7
Understanding board level vibrations in automotive electronic modules	7
Robust resistive switching characteristics of AlOx CBRAM using simple and cost-effective thermal evaporation process	7
Mobile ions entering the IGBT gate oxide - electrical detection and failure localization by lock-in thermography	7
Impact of neutron irradiation on SiC power MOSFETs after stress tests qualification	7
Squeeze-out and bond strength of patterned Cu Sn SLID seal-frames	7
Two-step sub-modeling framework for thermomechanical fatigue analysis of solder joints in DRAM module	7
Influence of Interface Traps on MOSFET thermal coefficients and its effects on the ZTC current	7
The behaviour of 350 V GaN HEMTs during heavy ion irradiations	7
A cost-effective repair scheme for clustered TSV defects in 3D ICs	7
Research progress on the stability of transparent conductive films for silver nanowires	7
System in package: Advanced FA techniques to minimize analysis time and cost	7
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	7
Sixer: A low-overhead, fully-distributed test scheme with guaranteed delivery of packets in networks-on-chip	7
Time-dependent statistical NBTI model for aging assessment in circuit level implemented with open model interface	7
Process-induced warpage and stress estimation of through glass via embedded interposer carrier with ring-type framework	7
Warpage measurements to support the development of mmWave modules	7
Fatigue performance and microstructure of lead-free solder joints in BGA assembly at room temperature	7
Editorial Board	7
Thermal and electrical characterization of flexible microheaters: Influence of material choice and geometry	7
Reliability estimation of complex systems based on a Wiener process with random effects and D-vine copulas	7
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	7
The sensitivity analysis of geometric parameters on the power cycling reliability of bond wires	7
Morphological characterization of 325 mesh-grinding-induced defects on silicon wafer surface	7
A screening test of GaN-HEMTs for improvement of breakdown voltage uniformity	7
Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites	7
Humidity related failure mechanism of IGBTs considering dynamic avalanche	7
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	7
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	7
Dynamic EFI and circuit analysis case studies on integrated circuit buried via void defects	7
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm	7
Analysis of the transient dose rate effect on clock resources of JXCV5SX95T FPGA	7
Effects of Ga alloying on microstructure and comprehensive performances of Sn–9Zn–2Bi alloys for the microelectronics industry	7
Prediction of failure in time (FIT) of electrical connectors with short term tests	7
Improved failure analysis in scanning acoustic microscopy via advanced signal processing techniques	7
Electro-thermal stress minimisation of motor-drive inverter switches by hybrid modulation strategy technique	7
Improvement of sensitivity for power cycle degradation by a new device structure	7
Error correction improvement based on weak-bit-flipping for resistive memories	7
Reliability assessment of graphene channel vertical TFET: Role of trap-assisted tunneling	7
Development of eutectic gallium-indium-based transparent conductive electrodes on flexible substrates for touch sensor integration	7
Charge deposition analysis of heavy-ion-induced single-event burnout in low-voltage power VDMOSFET	7
Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach	7
Editorial Board	7
Automated endpointing in microelectronics failure analysis using laser induced breakdown spectroscopy	7
Evidence of resistive switching in SiNx thin films for MEMS capacitors: The role of metal contacts	7
Simulation of transient dose rate effect on analog phase locked loop	6
FEM-based analysis of avalanche ruggedness of high voltage SiC Merged-PiN-Schottky and Junction-Barrier-Schottky diodes	6
SRP-YOLOX: An improved deep convolutional neural network for automated via detection	6
New decoding techniques for modified product code used in critical applications	6
Adhesion experiments on Cu-Damascene processed interconnect structures for mode III loading	6
Silver-coated copper particles as a new raw material for manufacturing electrical contacts	6
Optimizing the performance of the ZnO-based varistors using the neural networks technique	6
Investigation of the dielectric properties of Au/Bi4Ti3O12-SiO2/n-Si (MFIS) type structures depending on gamma-irradiation	6