Microelectronics Reliability

Article	Citations
Lithium-ion battery performance degradation evaluation in dynamic operating conditions based on a digital twin model	52
A lithium-ion battery remaining useful life prediction method based on the incremental capacity analysis and Gaussian process regression	52
Thermal performance of heat sink using nano-enhanced phase change material (NePCM) for cooling of electronic components	47
Soft errors in DNN accelerators: A comprehensive review	46
FlexGripPlus: An improved GPGPU model to support reliability analysis	44
Defect inspection of flip chip solder joints based on non-destructive methods: A review	41
A comparative study of thermal fatigue life of Eutectic Sn-Bi, Hybrid Sn-Bi/SAC and SAC solder alloy BGAs	38
Development of low temperature Cu Cu bonding and hybrid bonding for three-dimensional integrated circuits (3D IC)	32
Challenges to overcome breakdown limitations in lateral β-Ga2O3 MOSFET devices	31
Microstructure evolution and hardness of MWCNT-reinforced Sn-5Sb/Cu composite solder joints under different thermal aging conditions	29
Surge current capability of ultra-wide-bandgap Ga2O3 Schottky diodes	24
Flip Chip integration of ultra-thinned dies in low-cost flexible printed electronics; the effects of die thickness, encapsulation and conductive adhesives	23
Physics of failure of die-attach joints in IGBTs under accelerated aging: Evolution of micro-defects in lead-free solder alloys	23
Lithium-ion battery SoH estimation based on incremental capacity peak tracking at several current levels for online application	21
Effect of micromorphology on corrosion and mechanical properties of SAC305 lead-free solders	21
Accelerative reliability tests for Sn3.0Ag0.5Cu solder joints under thermal cycling coupling with current stressing	20
A simulation-based analysis of effect of interface trap charges on dc and analog/HF performances of dielectric pocket SOI-Tunnel FET	19
Ultrasonic monitoring performance degradation of lithium ion battery	19
An improved lifetime prediction method for metallized film capacitor considering harmonics and degradation process	18
Characterisation & modelling of perovskite-based synaptic memristor device	18
The investigation of current condition mechanism of Al/Y2O3/p-Si Schottky barrier diodes in wide range temperature and illuminate	18
An interpretable remaining useful life prediction scheme of lithium-ion battery considering capacity regeneration	18
Impact of interface trap charges on electrical performance characteristics of a source pocket engineered Ge/Si heterojunction vertical TFET with HfO2/Al2O3 laterally stacked gate oxide	18
A comprehensive solution for modeling moisture induced delamination in electronic packaging during solder reflow	17
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	17

Ionizing radiation damage in 65 nm CMOS technology: Influence of geometry, bias and temperature at ultra-high doses	17
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier	17
Improved deep learning based telemetry data anomaly detection to enhance spacecraft operation reliability	17
IGBT aging monitoring and remaining lifetime prediction based on long short-term memory (LSTM) networks	16
Recovery investigation of NBTI-induced traps in n-MOSFET devices	16
Constituents and performance of no-clean flux for electronic solder	16
Ionizing radiation hardness tests of GaN HEMTs for harsh environments	16
Design optimization of multi-resonant piezoelectric energy harvesters	16
A hybrid system-level prognostics approach with online RUL forecasting for electronics-rich systems with unknown degradation behaviors	16
Evaluation of thermal conductivity for sintered silver considering aging effect with microstructure based model	16
Heavy-ion induced single event effects and latent damages in SiC power MOSFETs	16
Fault diagnosis and prognosis based on physical knowledge and reliability data: Application to MOS Field-Effect Transistor	16
Experimental analysis on estimating junction temperature and service life of high power LED array	15
Separation of electron and hole trapping components of PBTI in SiON nMOS transistors	15
Effect of critical properties of epoxy molding compound on warpage prediction: A critical review	15
Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation	15
Impact of crystalline orientation of lead-free solder joints on thermomechanical response and reliability of ball grid array components	14
Reliability analysis of a fault-tolerant RISC-V system-on-chip	14
Comparison study of gold coatings prepared by traditional and modified galvanic replacement deposition for corrosion prevention of copper	14
Electrical characterization of SiC MOS capacitors: A critical review	14
Design of low power, variation tolerant single bitline 9T SRAM cell in 16-nm technology in subthreshold region	14
Deep learning-based image analysis framework for hardware assurance of digital integrated circuits	14
A low cost fault-attack resilient AES for IoT applications	14
Analyzing the impact of soft errors in VGG networks implemented on GPUs	14
Stress/strain characterization in electronic packaging by micro-Raman spectroscopy: A review	14
Prediction of IGBT junction temperature using improved cuckoo search-based extreme learning machine	13
Recent review on failures in silicon carbide power MOSFETs	13
Gate-switching-stress test: Electrical parameter stability of SiC MOSFETs in switching operation	13
Accelerated aging test for gate-oxide degradation in SiC MOSFETs for condition monitoring	13
Investigation of critical factors effect to predict leakage current and time to failure due to ECM on PCB under humidity	13
Combined experimental-FEM investigation of electrical ruggedness in double-sided cooled power modules	13
Machine learning for board-level drop response of BGA packaging structure	13
Inkjet-printed HF antenna made on PET substrate	13
Achieving microstructure refinement and superior mechanical performance of Sn-2.0Ag-0.5Cu-2.0Zn (SACZ) solder alloy with rotary magnetic field	13
Analysis of the aging mechanism occurring at the bond-wire contact of IGBT power devices during power cycling	12
Prediction of solar particle events with SRAM-based soft error rate monitor and supervised machine learning	12
A reliability evaluation method for multi-performance degradation products based on the Wiener process and Copula function	12
A 3-D thermal network model for the temperature monitoring of thermal grease as interface material	12
Thermal stress reduction strategy for high-temperature power electronics with Ag sintering	12
Threading dislocations in GaN high-voltage switches	12
Effect of temperature and humidity conditioning on copper leadframe/mold compound interfacial delamination	12
Performance and reliability of Al2O3 nanoparticles doped multicomponent Sn-3.0Ag-0.5Cu-Ni-Ge solder alloy	12
Impact of inter-metallic compound thickness on thermo-mechanical reliability of solder joints in solar cell assembly	12
Energy based modeling for temperature cycling induced tin silver copper solder interconnect fatigue life	12
Molecular dynamic study for concentration-dependent volume relaxation of vacancy	12
Accumulative total ionizing dose (TID) and transient dose rate (TDR) effects on planar and vertical ferroelectric tunneling-field-effect-transistors (TFET)	12
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging	12
Gate-damage accumulation and off-line recovery in SiC power MOSFETs with soft short-circuit failure mode	12
Hydrothermal growth method for the deposition of ZnO films: Structural, chemical and optical studies	12
Influence of microstructure inhomogeneity on the current density and temperature gradient in microscale line-type Sn58Bi solder joints under current stressing	12

Three-phase SiC inverter with active limitation of all MOSFETs junction temperature	12
Fault diagnosis of cracks in crystalline silicon photovoltaic modules through I-V curve	12
Effects of anisotropy on the reliability of TSV microstructure	11
Thermal analysis of the design parameters of a QFN package soldered on a PCB using a simulation approach	11
Ab initio investigations in amorphous silicon dioxide: Proposing a multi-state defect model for electron and hole capture	11
Lock-V: A heterogeneous fault tolerance architecture based on Arm and RISC-V	11
Experimental and modeling studies of automotive-qualified OLEDs under electrical stress	11
Mechanistic study of copper wire-bonding failures on packaging devices in acidic chloride environments	11
Two phase cooling with nano-fluid for highly dense electronic systems-on-chip – A pilot study	11
An SEU-hardened ternary SRAM design based on efficient ternary C-elements using CNTFET technology	11
A physical lifetime prediction methodology for IGBT module by explicit emulation of solder layer degradation	11
Power cycling failure analysis of double side cooled IGBT modules for automotive applications	11
Parametric system-level models for position-control of novel electromagnetic free flight microactuator	11
Electromigration in solder joints: A cross-sectioned model system for real-time observation	11
Temperature-dependent electrical characteristics of neutron-irradiated GaN Schottky barrier diodes	11
A humidity-induced novel failure mechanism in power semiconductor diodes	11
Finite element method modeling of temperature gradient-induced Cu atomic thermomigration in Cu/Sn/Cu micro solder joint	11
Low actuation voltage cantilever-type RF-MEMS shunt switches for 5G applications	11
Experimental characterization of rolled annealed copper film used in flexible printed circuit boards: Identification of the elastic-plastic and low-cycle fatigue behaviors	11
Investigations of short-circuit failure in double trench SiC MOSFETs through three-dimensional electro-thermal-mechanical stress analysis	11
A numerical study on the effect of the fixation methods on the vibration fatigue of electronic packages	11
A novel Bayesian multivariate linear regression model for online state-of-health estimation of Lithium-ion battery using multiple health indicators	11
Reliability analysis of multilayer polymer aluminum electrolytic capacitors	10
A simulation-based methodology for aiding advanced driver assistance systems hazard analysis and risk assessment	10
Reliability assessment on 16 nm ultrascale+ MPSoC using fault injection and fault tree analysis	10
Effects of bismuth additions on mechanical property and microstructure of SAC-Bi solder joint under current stressing	10
Wafer defect pattern classification with detecting out-of-distribution	10
Vertical GaN devices: Process and reliability	10
Gate leakage current sensing for in situ temperature monitoring of p-GaN gate HEMTs	10
Mechanical reliability of Cu cored solder ball in flip chip package under thermal shock test	10
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	10
Performance prediction of current-voltage characteristics of Schottky diodes at low temperatures using artificial intelligence	10
Evaluation of thermomechanical fatigue lifetime of BGA lead-free solder joints and impact of isothermal aging	10
Reliability of automotive and consumer MEMS sensors - An overview	10
Microstructure, resistivity, and shear strength of electrically conductive adhesives made of silver-coated copper powder	10
Tensile characterization and constitutive modeling of sintered nano-silver particles over a range of strain rates and temperatures	10
Three-parameter Weibull distribution with upper limit applicable in reliability studies and materials testing	10
In situ investigation of atmospheric corrosion behavior of copper under thin electrolyte layer and static magnetic field	10
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	10
Dielectric investigation of In4Se96-xSx semiconductor: Relaxation and conduction mechanism	10
A survey of the structure, fabrication, and characterization of advanced organic light emitting diodes	10
Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules	10
Thermal fatigue analysis of gold wire bonding solder joints in MEMS pressure sensors by thermal cycling tests	10
Modelling and analysis of vibration on power electronic module structure and application of model order reduction	10
Novel lockstep-based fault mitigation approach for SoCs with roll-back and roll-forward recovery	10
From early microstructural evolution to intergranular crack propagation in SAC solders under thermomechanical fatigue	10
A novel on-wafer approach to test the stability of GaN-based devices in hard switching conditions: Study of hot-electron effects	9
Online junction temperature estimation using integrated NTC thermistor in IGBT modules for PMSM drives	9
Improving the reliability of SRAM-based PUFs under varying operation conditions and aging degradation	9
Design optimization of a miniaturized thermoelectric generator via parametric model order reduction	9
Influence of post-bonding heating process on the long-term reliability of Cu/Al contact	9
Interfacial trap charge and self-heating effect based reliability analysis of a Dual-Drain Vertical Tunnel FET	9
Positive and negative charge trapping GaN HEMTs: Interplay between thermal emission and transport-limited processes	9
Role of the AlGaN barrier on the long-term gate reliability of power HEMTs with p-GaN gate	9
Reliability assessment of film capacitors oriented by dependent and nonlinear degradation considering three-source uncertainties	9
Understanding and eliminating thermo-mechanically induced radial cracks in fully metallized through-glass via (TGV) substrates	9
Effect of intermetallic compound thickness on mechanical fatigue properties of copper pillar micro-bumps	9
Modeling and fault diagnosis of multi-phase winding inter-turn short circuit for five-phase PMSM based on improved trust region	9
A power transfer model-based method for lithium-ion battery discharge time prediction of electric rotatory-wing UAV	9
Gate drive circuit for current balancing of parallel-connected SiC-JFETs under avalanche mode	9
Real-time estimation of junction temperature in IGBT inverter with a simple parameterized power loss model	9
Effect of aging time and loading rate on fracture behavior of Cu/Sn-0.7Cu solder joints	9
Reliability based design optimization applied to the high electron mobility transistor (HEMT)	9
Stabilizing the sintered nanopore bondline by residual organics for high temperature electronics	9
Impact of unpreventable induced interface trapped charges on HZO based FDSOI NCFET	9
Improving GPU register file reliability with a comprehensive ISA extension	9
Analyses on the large size PBGA packaging reliability under random vibrations for space applications	9
A high-efficiency aging test with new data processing method for semiconductor device	8
Simulation studies on the transient dose rate effect of analog delay locked loops	8
FEM-based combined degradation model of wire bond and die-attach for lifetime estimation of power electronics	8
Multiple failure mode identification of SiC planar MOSFETs in short-circuit operation	8
Measurement and simulation of short circuit current sharing under parallel connection: SiC MOSFETs and SiC Cascode JFETs	8
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization	8
Effects of alloying elements in high reliability copper wire bond material for high temperature applications	8
Microstructural characterization of alloyed palladium coated copper wire under high temperature	8
Exploration of gate trench module for vertical GaN devices	8
Oxidation and wetting characteristics of lead-free Sn-0.7Cu solder alloys with the addition of Fe and Bi	8
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	8
New power module concept in PCB-embedded technology with silver sintering die attach	8
Hot-Carrier degradation in P- and N-channel EDMOS for smart power application	8

Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times	8
MEMS capacitive microphone with various materials in acoustic plate under shock loading	8
Comparisons of SnO2 gas sensor degradation under elevated storage and working conditions	8
Numerical simulation of reliability of 2.5D/3D package interconnect structure under temperature cyclic load	8
Passivation-layer thickness and field-plate optimization to obtain high breakdown voltage in AlGaN/GaN HEMTs with short gate-to-drain distance	8
OFF-state trapping phenomena in GaN HEMTs: Interplay between gate trapping, acceptor ionization and positive charge redistribution	8
Reliability analysis and condition monitoring of SAC+ solder joints under high thermomechanical stress conditions using neuronal networks	8
Crack identification and evaluation in BEoL stacks of two different samples utilizing acoustic emission testing and nano X-ray computed tomography	8
Physical security of deep learning on edge devices: Comprehensive evaluation of fault injection attack vectors	8
High-level fault injection to assess FMEA on critical systems	8
Time-dependent dielectric breakdown of gate oxide on 4H-SiC with different oxidation processes	8
A lifetime assessment and prediction method for large area solder joints	8
1200V 4H-SiC trench MOSFET with superior figure of merit and suppressed quasi-saturation effect	8
Physical mechanisms for gate damage induced by heavy ions in SiC power MOSFET	8
Health monitoring of mechanically fatigued flexible lithium ion battery by electrochemical impedance spectroscopy	8
Evaluating the soft error sensitivity of a GPU-based SoC for matrix multiplication	8
In-situ temperature-dependent characterization of copper through glass via (TGV)	8
A method to extract lumped thermal networks of capacitors for reliability oriented design	8
Fault diagnosis of PID in crystalline silicon photovoltaic modules through I-V curve	8
Double-node-upset aware SRAM bit-cell for aerospace applications	7
Remaining useful life prediction in embedded systems using an online auto-updated machine learning based modeling	7
A comparative analysis of printed circuit drying methods for the reliability of assembly process	7
Reliability prediction of FinFET FPGAs by MTOL	7
Power cycling tests under driving ΔTj = 125 °C on the Cu clip bonded EV power module	7
Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement	7
Efficiency droop in green InGaN/GaN light emitting diodes: Degradation mechanisms and initial characteristics	7
Multiscale warpage behaviour in a Fan-Out Panel during thermal cycles	7
Analysis of drain current transient stability of AlGaN/GaN HEMT stressed under HTOL & HTRB, by random telegraph noise and low frequency noise characterizations	7
Packaging design for improving the uniformity of Chip scale package (CSP) LED luminescence	7
Pursuing computationally efficient wear-out prediction of PV inverters: The role of the mission profile resolution	7
Experimental setup to monitor non-destructive single events triggered by ionizing radiation in power devices	7
Co-relation scan attack analysis (COSAA) on AES: A comprehensive approach	7
Wear-out failure of an IGBT module in motor drives due to uneven thermal impedance of power semiconductor devices	7
Effect of short-circuit degradation on the remaining useful lifetime of SiC MOSFETs and its failure analysis	7
A unified viscoplastic model for characterizing the softening behavior of the Sn3.0Ag0.5Cu solder under monotonic and cyclic loading conditions	7
Influence of CdTe solar cell properties on stability at high temperatures	7
Degradation mechanisms-based reliability modeling for metallized film capacitors under temperature and voltage stresses	7
Modelling stress evolution and voiding in advanced copper nano-interconnects under thermal gradients	7
Research of single-event burnout and hardened GaN MISFET with embedded PN junction	7
High-energy proton irradiation effects on GaN hybrid-drain-embedded gate injection transistors	7
Analysis of total ionizing dose response of optimized fin geometry workfunction modulated SOI-FinFET	7
Accelerated aging for gate oxide of SiC MOSFETs under continuous switching conditions by applying advanced HTGB test	7
CFD modeling of additive manufacturing liquid cold plates for more reliable power press-pack assemblies	7
New definition of critical energy for SiC MOSFET robustness under short circuit operations: The repetitive critical energy	7
Towards virtual twin for electronic packages in automotive applications	7
Damage based PoF model of solder joints under temperature cycling and electric coupling condition	7
A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters	7
Comphy v3.0—A compact-physics framework for modeling charge trapping related reliability phenomena in MOS devices	7
Effects of multi-cracks and thermal-mechanical coupled load on the TSV reliability	7
MEMS gyroscope fault detection and elimination for an underwater robot using the combination of smooth switching and dynamic redundancy method	7
Effect of voids on thermomechanical cracking in lead-free Sn3Ag0.5Cu interconnections of power modules	7
Study on the influence of fretting wear on electrical performance of SMA connector	7
Shear strength of die attachments prepared using dry nanosilver film by a time-reduced sintering process	7
GaN-based high-periodicity multiple quantum well solar cells: Degradation under optical and electrical stress	7
Failure mechanism of lead-free component boards in thermomechanical test based on recrystallization enhanced cracking	7
Multimodal fault-tolerant control for single-phase cascaded off-grid PV-storage system with PV failure using hybrid modulation	7
Design guideline on board-level thermomechanical reliability of 2.5D package	7
Bending reliability of transparent electrode of printed invisible silver-grid/PEDOT:PSS on flexible epoxy film substrate for powder electroluminescent device	7
Comparative evaluation of reliability assessment methods of power modules in motor drive inverter	7
BTI saturation and universal relaxation in SiC power MOSFETs	7
Effect of temperature on the low cycle fatigue properties of BGA solder joints	7
UIS performance and ruggedness of stand-alone and cascode SiC JFETs	7
Capture and emission time map to investigate the positive VTH shift in p-GaN power HEMTs	7
Reliability analysis in GeTe and GeSbTe based phase-change memory 4 kb arrays targeting storage class memory applications	6
Pulsed infrared thermal imaging as inline quality assessment tool	6
Fatigue crack evolution and effect analysis of Ag sintering die-attachment in SiC power devices under power cycling based on phase-field simulation	6
Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation	6
Alternative manufacturing process of 3-dimensional interconnect device using thermoforming process	6
A methodology to calculate the equivalent static loading for simulating electronic assemblies under impact	6
Lifetime performance index of electronic products	6
An ion beam layer removal method of determining the residual stress in the as-fabricated TSV-Cu/TiW/SiO2/Si interface on a nanoscale	6
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	6
Modeling of MEMS Electrothermal Microgripper employing POD-DEIM and POD method	6
A novel online 4-point rainflow counting algorithm for power electronics	6
Wire-bond contact degradation modeling for remaining useful lifetime prognosis of IGBT power modules	6
Study on atomic migration of copper through-silicon-vias with Bosch scallops	6
Mechanical integrity of back-end-of-line with Ru nanowires and airgaps	6
Mitigating single event upset of FPGA for the onboard bus control of satellite	6
Constitutive equations for strain rate and temperature dependent mechanical behaviour of porous Ag-sintered joints in electronic packages	6
Heavy-ion induced gate damage and thermal destruction in double-trench SiC MOSFETs	6
Soft error hardened voltage bootstrapped Schmitt trigger design for reliable circuits	6
Evaluation based on performance and failure of PV system in 10 years field-aged 1 MW PV power plant	6
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	6
Research on the damage mechanism of the PIN limiter diode SMP1330 under EMP	6
Non-destructive automatic die-level defect detection of counterfeit microelectronics using machine vision	6
A non-invasive SiC MOSFET Junction temperature estimation method based on the transient light Emission from the intrinsic body diode	6
Towards a safe failure mode under short-circuit operation of power SiC MOSFET using optimal gate source voltage depolarization	6
Monitoring of parameter stability of SiC MOSFETs in real application tests	6
Engineering application research on reliability prediction of the combined DC-DC power supply	6
Improving avalanche robustness of SiC MOSFETs by optimizing three-region P-well doping profile	6
Analyzing and increasing soft error resilience of Deep Neural Networks on ARM processors	6
Prediction of software reliability	6
Single event effects of SiC diode demonstrated by pulsed-laser two photon absorption	6
Investigation of the mechanical properties of corroded sintered silver layers by using Nanoindentation	6
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	6