Microelectronics Reliability

Article	Citations
Single event burnout failures caused in silicon and silicon carbide power devices by single alpha particles emitted from radioactive nuclides	88
Boosting the thermal stability of paralleled GaAs HBTs through temperature-dependent ballasting resistors: A proof-of-concept study	88
Microstructure evolution and mechanical behavior of copper through‑silicon via structure under thermal cyclic loading	55
Design optimization of a packaged thermoelectric generator for electrically active implants	38
Investigation of microstructure, thermal properties, and mechanical performances of Ni-added Sn-5.0Sb-0.5Cu/Cu solder joints	37
Influence of phosphorus diffusion on the SiO2/4H-SiC (0001) interface during poly gate formation process	36
A Π-shaped p-GaN HEMT for reliable enhancement mode operation	31
Simulation assessment of solder joint reliability for fully assembled printed circuit boards	29
Investigating the solder mask defects impact on leakage current on PCB under condensing humidity conditions	29
Breakdown voltage and TDDB performance improvement by optimizing the PECVD dielectric film characteristics in MIM capacitors	29
DC and RF/analog performances of split source horizontal pocket and hetero stack TFETs considering interface trap charges: A simulation study	29
Effect of solder junction void variation in power semiconductor package on power cycle lifetime	26
Highly reliable Cu Cu low temperature bonding using SAC305 solder with rGO interlayer	26
Effect of high-temperature storage on the thermal conductivity of Cu nanoparticles/Bi-Sn hybrid bonding	26
A novel in-situ approach to monitor the variations in the on-resistance of power transistors during switching operation	26
Electrical deterioration of 4H-SiC MOS capacitors due to bulk and interface traps induced by proton irradiation	26
The characterization of low-k thin films and their fracture analysis in a WLCSP device	25
Modeling of the impact of mechanical stress resulted from wafer probing and wire bonding on circuit under pad	25
Optical characterizations of “P-down” bonded InP pump lasers	24
Multistate time lag dynamic Bayesian networks model for reliability prediction of smart meters	24
DNN-based error level prediction for reducing read latency in 3D NAND flash memory	24
Effect of microstructural variability on fatigue simulations of solder joints	24
A physics-based electromigration model for advanced interconnects	23
Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching	23
Current balancing of parallel-connected silicon carbide (SiC) MOSFET power devices using peak detection via PCB sensors	23

Interface traps in the sub-3 nm technology node: A comprehensive analysis and benchmarking of negative capacitance FinFET and nanosheet FETs - A reliability perspective from device to circuit level	22
Calibration methods and power cycling of double-side cooled SiC MOSFET power modules	22
High temperature reliability of pressureless sintered Cu joints for power SiC die attachment	22
Quantitative analysis of void initiation in thermo-mechanical fatigue of polycrystalline copper films	22
A remaining useful life prediction method of aluminum electrolytic capacitor based on wiener process and similarity measurement	22
Aging investigation of the latest standard dual power modules using improved interconnect technologies by power cycling test	21
Editorial Board	20
Soft sensor design for estimation of thermal behavior of encapsulating materials in power electronic module	20
Elucidating the large variation in ion diffusivity of microelectronic packaging materials	20
Editorial Board	20
Failure analysis on capacitor failures using simple circuit edit passive voltage contrast method	20
Study on annealing effect of bipolar transistors at different temperatures after total dose irradiation	19
Reliability assessment of miniaturised electromechanical RF relays for space applications	19
Editorial Board	19
New reliability model for power SiC MOSFET technologies under static and dynamic gate stress	19
Investigation of the role of pre-existing oxide in the initial degradation mechanism in AlGaN/GaN HEMTs under ON-state stress	19
Correlative multimodal imaging and targeted lasering for automated high-precision IC decapsulation	19
Effect of indentation depth and strain rate on mechanical properties of Sn0.3Ag0.7Cu	18
Performance assessment and RUL prediction of power converters under the multiple components degradation	18
Thermal-mechanical analysis of copper pillar pitch size during reflow soldering assembly process	18
Tilt- and warpage measurement as inline quality assessment tool	18
Ultra-fast recovery transients in GaN MIS-HEMT submitted to OFF-state stress	18
Investigation on the microstructure, mechanical properties and chlorine resistance of fine aluminum alloy wires	18
Condition monitoring for detection of humidity-induced failures in control electronics of power converters	18
Micro-Raman and SEM analyses of failed GaN HEMT multilayer architecture	18
Mission profile-based digital twin framework using functional mock-up interfaces for assessing system's degradation behaviour	17
Investigation of electromagnetic force effect in IGBT modules	17
Thermal aging of power module assemblies based on ceramic heat sink and multilayers pressureless silver sintering	17
Editorial Board	17
Impact of proton-induced total ionizing dose effects on electrical characteristics and safe operating area of trench field-stop IGBT devices	17
Correction factors to strength of thin silicon die in three- and four-point bending tests due to nonlinear effects	17
Investigations on acceptable breakdown voltage variation of parallel-connected SiC MOSFETs applied to olid-state circuit breakers	16
Research on sintering process and thermal conductivity of hybrid nanosilver solder paste based on molecular dynamics simulation	16
Sintering of mixed Cu Ag nanoparticles pretreated by formic acid vapor for Cu Cu low temperature bonding	16
Repetitive short circuit capability of SiC MOSFET at specific low gate-source voltage bias for more robust extreme operation	16
Numerical modeling of FS-trench IGBTs by TCAD and its parameter extraction method	16
Microstructure and mechanical behavior of SnBi-xAg and SnBi-xAg@P-Cu solder joints during isothermal aging	16
Effect of indium content and carrier distribution on the efficiency and reliability of InGaN/GaN-based multi quantum well light emitting diode	15
Prognosis of LED lumen degradation using Bayesian optimized neural network approach	15
Evaluation of the helium hermeticity reliability of copper through-glass vias	15
Effect of Sb content on the phase structure and interface structure of Sn1.0Ag0.5Cu lead-free solder	15
Evaluation of SEU impact on convolutional neural networks based on BRAM and CRAM in FPGAs	15
In-field test solution for enhancing safety in automotive applications	15
Influence mechanism of solder aging and thermal network model optimization of multi-chip IGBT modules	15
Impact of aging on temperature measurements performed using a resistive temperature sensor with sensor-to-microcontroller direct interface	14
Morphology and reliability aspects of 40 nm eSTM™ architecture	14
New temperature-independent aging indicator for power semiconductor devices – Application to IGBTs	14
Detailed total ionizing dose effects on LDMOS transistors	14
Effect of load sequence interaction for low ∆T's on the reliability of bonded aluminum wires in IGBTs	14
Failure degradation similarities on power SiC MOSFET devices submitted to short-circuit stress and accelerated switching conditions	14

A fault-tolerant reconfiguration system based on pilot switch for grid-connected inverters	14
Non-destructive fault diagnosis of electronic interconnects by learning signal patterns of reflection coefficient in the frequency domain	14
Constructal design for the layout of multi-chip module based on thermal-flow-stress coupling calculation	14
Online monitoring of IGBT modules based on creating the non-interventional monitoring environment	14
Editorial Board	14
Effects of the hardness and roughness on the plastic deformation properties of electroplated gold bumps during thermocompression bonding	14
Proceedings of the 32nd European Symposium on the Reliability of Electron Devices, Failure Physics and Analysis	14
Accuracy estimation of low-current voltage drop method for junction temperature monitoring under DC power cycling	13
Application of deuterium oxide (D2O) isotope tracing technique for encapsulated QFN failure analysis	13
Composite powders with carbon nanotubes for laser printing of electronics	13
Enhanced reliability of phosphor-converted white light-emitting diodes based on a laser-cured silicone encapsulant layer	13
Cluster-aware allocation of spare TSVs for enhanced reliability in 3D ICs	13
Electroplated Ni-P film for power devices without cracks induced by high temperature heating	13
An efficient structure to improve the reliability of deep neural networks on ARMs	13
Crosstalk optimization and gate oxide reliability analysis in intercalation doped MLGNR with reduced vertical thickness	13
Long-term (8000 h) reliability and failures of high-power LEDs for outdoor lighting stressed at high ambient temperatures	13
Electron-beam-induced current (EBIC) imaging technique to quicken polysilicon defect localization in MOSFETs	13
Sintering of SiC chip via Au80Sn20 solder and its joint strength and thermomechanical reliability	13
Temperature effects on the conducted emission of a high-side switch	13
Multi-objective optimal design of thermal-vibration stress and return loss of TSV interconnect structures based on response surface-NSWOA optimization algorithm	13
Exploring the radiant impact of irradiance on the electrical resistance of organic thin film	13
Compatibility study of no-clean flux residue and conformal coatings using two electrode electrochemical impedance method	13
Accelerated lifetime estimation and failure analysis of micromachined humidity sensors under high temperature and high humidity conditions	12
Editorial Board	12
Design of compact-diode-SCR with low-trigger voltage for full-chip ESD protection	12
Editorial Board	12
Investigation on vibration induced fretting in degraded contact interface	12
Research on equivalent modeling and model testing verification methods for material mechanics parameters of TXV structure	12
DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate	12
NSFET performance optimization through SiGe channel design - A simulation study	12
Performance investigation and impact of trap charges on novel lateral dual gate oxide-bilateral tunnelling based field effect transistor	12
Optimization of the drain-side configuration in ESD-protection SCR-LDMOS for high holding-voltage applications	12
Optical, electrical, and mechanical reliability of 1700 PPI Micro-LED device	12
Editorial Board	12
Methodology of backside preparation applied on a MRAM to lead a logical investigation with a near-field probe	12
Microstructure and diffusion mechanisms in nano-Cu sintered joints during aging: Effects of joint size, porosity, and aging atmosphere	12
Shear strength and fracture analysis of Sn-9Zn-2.5Bi-1.5In and Sn-3.0Ag-0.5Cu pastes with Cu-substrate joints under different reflow times	12
Characterization of a novel radiation hardened by design (RHD14) bit-cell based on 20-nm FinFET technology using TCAD simulations	11
Physics-informed Markov chains for remaining useful life prediction of wire bonds in power electronic modules	11
Hot electron effects in AlGaN/GaN HEMTs during hard-switching events	11
Testing and simulation of lifetime for wire bond interconnections with varying bond foot angle	11
Dynamic wetting and spreading mechanisms of SAC305 with added Au elements in the laser jet weld ball bonding process	11
Enhanced gate biasing resilience in asymmetric and double trench SiC MOSFETs towards generalized highly reliable power electronics	11
Electrical characterization and temperature reliability of 4H-SiC Schottky barrier diodes after Electron radiation	11
Amalgam illogical controller design using amended moth system for heat reduction in insulated gate bipolar transistor	11
Self-propagating exothermic reaction assisted Cu clip bonding for effective high-power electronics packaging	11
Underfill material property dependence of lifetime and mechanical behavior of BGA package: EBSD and FEM investigations	11
Experiments, constitutive modeling, and simulations on the creep behavior of the AgSn transient liquid phase metallic bonds	11
Carbon ion implantation as healing strategy for improved reliability in phase-change memory arrays	11
ESD Human Body Model step stress distributions of GaN HEMTs and the correlation with one level test results	11
The effect of Si3N4/Al2O3 stacked structure of AlGaN/GaN HEMTs	11
High-power microwave pulse induced failure on InGaP/GaAs heterojunction bipolar transistor	11
On the sizing of PV inverters with reactive power capability to regulate power factor: A reliability approach	11
Toward a multi-physical approach to connection ageing in power modules	11
Experimental study and signal analysis of acoustic emission from power MOSFET	11
Reliability evaluation of FPGA based pruned neural networks	11
Design of an energy-efficient soft error resilient RHBD SRAM cell with high read stability and minimum write errors	11
Aging modelling of Li-ion battery systems based on accelerated tests	11
A PMOS-embedded low-voltage triggered silicon controlled rectifier ESD protection device for 3.3V I/O application	11
Application-aware aging analysis and mitigation for SRAM Design-for-Relability	11
On-line temperature measurement during power cycle of PCB-embedded diode	10
Research on ESD failure voltage model of the T-shaped wiring structure in GOA products	10
Thermo-mechanical optimization of ceramic substrate with through ceramic vias by Taguchi-Grey method	10
Calibration and efficient evaluation of electromigration lifetime for interconnect wire sizing of multi-port networks	10
Failure rate analysis of radiation tolerant design techniques on SRAM-based FPGAs	10
Vulnerability evaluation on 16 nm FinFET Ultrascale+ MPSoC using fault injection and proton irradiation	10
Novel testability modelling and diagnosis method considering the supporting relation between faults and tests	10
A high-efficiency aging test with new data processing method for semiconductor device	10
An online junction temperature detection circuit for SiC MOSFETs considering threshold voltage drift compensation	10
An Eigendecomposition-based dynamic characteristics design method of three-phase grid-connected inverters with considering reliability	10
Terminal strength test of TO-220 packaged Schottky barrier diode using finite element method	10
Influence of LDD spacers on total ionizing dose response of the transconductance for bulk MOSFETs working at cryogenic temperatures	10
A shared page-aware machine learning assisted method for predicting and improving multi-level cell NAND flash memory life expectancy	10
Software-controlled pipeline parity in GPU architectures for error detection	10
Assessing thermal resistance as a degradation metric for solder bump arrays in discrete SiC MOSFET packages	10
Material level analytical model of total ionizing dose induced DC characteristics shift for FDSOI IC design	10
Impact of heat treatment on the lifetime of wire-bonded power modules	10
Evaluation of the impact of defects on threshold voltage drift employing SiO2 pMOS transistors	9
A non-volatile and radiation-hardened SRAM based on fourteen transistors and two perpendicular anisotropy magnetic tunnel junctions	9
Influence of electron beam irradiation induced charging-effect on nanoprobing localization of a crystal defect in MOSFET	9

Hybrid domain-based fast transient thermal evaluation method for power semiconductor modules in EV motor drive	9
Physics-of-failure based lifetime modelling for SiC based automotive power modules using rate- and temperature-dependent modelling of sintered silver	9
Microelectronics Reliability: Publisher’s note	9
Long-term capacitance variation characteristics, law extraction, single and collaborative prediction of film capacitors at room temperature and humidity	9
Crack propagation in ultrasonic-bonded copper wires investigated by power cycling and accelerated mechanical fatigue interconnection test methods	9
Analysis of the impact of power loss due to snail trails in a 95-kWp photovoltaic power system	9
The thickness and width of the intrinsic region effected electrical properties of GaAs p-i-n photodiodes	9
Electrothermal power cycling of GaN and SiC cascode devices	9
Thermal cycling reliability of electronic components in bolted assemblies: A study of the influence of bolt position	9
Influence of different test strategies on the power cycling test results of 6.5 kV SiC MOSFETs	9
Application of artificial neural networks to the identification of weak electrical regions in large area MIM structures	9
Isolation properties and failure mechanisms of vertical Pt / n-GaN SBDs	9
Epitaxial hillocks defects caused by subsurface damage from InAs substrate	9
Exploring the fracture mechanism of multilayer ceramic capacitors via combined simulation and experiment	9
Thermal reliability of Cu sintering joints for high-temperature die attach	9
Design of soft error correction flip-flop cells for highly reliable applications	9
Evaluation of bonding techniques for ultrasound transducers	9
Influence of normal load, electric current and sliding speed on tribological performance of electrical contact interface	9
Orbital validation for tin whisker suppression by conformal coating	9
Thermomechanical model of an oxide-confined GaAs-based VCSEL emitter	9
Experimental analysis on stochastic behavior of preswitching time in STT-MRAM	9
Impact of an AlGaN spike in the buffer in 0.15 μm AlGaN/GaN HEMTs during step stress	9
Failure mechanism and life estimate of metallized film capacitor under high temperature and humidity	9
Fault-tolerant multiplier using self-healing technique	9
Large area bare Cu-Cu interconnection using micro-Cu paste at different sintering temperatures and pressures	9
Towards development of an intelligent failure analysis system based on infrared thermography	9
Editorial Board	9
Investigation of ESD protection devices for SiC-based monolithic integrated circuits	8
Evaluating reliability through soft error triggered exceptions at ARM Cortex-A9 microprocessor	8
Characterization of single-event transients induced by high LET heavy ions in 16 nm bulk FinFET inverter chains	8
Developed non-destructive verification methods for accelerated temperature cycling of power MOSFETs	8
Improved HV-H3TRB robustness of a 1700 V IGBT chip set in standard power modules	8
Study on high power microwave nonlinear effects and degradation characteristics of C-band low noise amplifier	8
Impact reliability analysis of a rigid-flex PCB system under acceleration loads	8
Single event burnout of SiC MOSFET induced by atmospheric neutrons	8
Evaluating softcore GPU in SRAM-based FPGA under radiation-induced effects	8
Improvement of sensitivity for power cycle degradation by a new device structure	8
Cost-effective reliability enhancement for video stitching applications based on error-tolerance	8
A review on warpage measurement metrologies for advanced electronic packaging	8
Advanced power cycling test strategies on discrete SiC MOSFETs in different operating modes and the impact on lifetime	8
Analysis of solder joint degradation and output power drop in silicon photovoltaic modules for reliability improvement	8
OFF-state breakdown and threshold voltage stability of vertical GaN-on-Si trench MOSFETs	8
Origin of trap assisted tunnelling in ammonia annealed SiC trench MOSFETs	8
Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs	8
Observation framework of errors in microprocessors with machine learning location inference of radiation-induced faults	8
BP neural network for non-invasive IGBT junction temperature online detection	8
Modelling thermomechanical degradation of moulded electronic packages using physics-based digital twin	8
Editorial Board	8
Aggravated NBTI reliability due to hard-to-detect open defects	8
Vulcanization failure mechanism analysis of lead-frame LED package	8
Wavelet-based rapid identification of IGBT switch breakdown in voltage source converter	8
Characteristics and avalanche investigation of SiC VDMOSFETs with enhanced P-Based implantation	8
Micro-additives and their impact on tensile and fracture performance of solder	8
Prediction of the electrochemical migration induced failure on power PCBs under humidity condition — A case study	8
Hot-carrier evaluation of a zero-cost transistor developed via process optimization in an embedded non-volatile memory CMOS technology	8
Fault and self-repair for high reliability in die-to-die interconnection of 2.5D/3D IC	8
Changes in the extraction and collection efficiency of GaN-based MQW solar cells under optical step-stress	8
Editorial Board	7
Comparative study: AutoDPR-SEM for enhancing CNN reliability in SRAM-based FPGAs through autonomous reconfiguration	7
Comprehensive investigation on different ions of geostationary orbit induced single event burnout in GaN HEMT power devices	7
A reliability assessment methodology of system-in-package based virtual qualification	7
Evidence of resistive switching in SiNx thin films for MEMS capacitors: The role of metal contacts	7
Robust resistive switching characteristics of AlOx CBRAM using simple and cost-effective thermal evaporation process	7
Design and power optimization of a QCA-based universal reversible logic gate architecture using cell interaction approach	7
Interphase effect on the effective moisture diffusion in epoxy–SiO2 composites	7
Research progress on the stability of transparent conductive films for silver nanowires	7
The sensitivity analysis of geometric parameters on the power cycling reliability of bond wires	7
Preliminary 2D elastoplastic modeling of gate cracking in SiC MOSFETs under short-circuit conditions across a wide temperature-range using rankine's damage energetic approach	7
A survey on two-dimensional Error Correction Codes applied to fault-tolerant systems	7
Automated endpointing in microelectronics failure analysis using laser induced breakdown spectroscopy	7
Humidity related failure mechanism of IGBTs considering dynamic avalanche	7
TCAD investigation of the transport of carriers deposited by alpha particles in silicon carbide power Schottky devices	7
Editorial Board	7
Experimental and simulative study of warpage behavior for fan-out wafer-level packaging	7
System in package: Advanced FA techniques to minimize analysis time and cost	7
Prediction of failure in time (FIT) of electrical connectors with short term tests	7
Degradation modeling of InGaAs/InP avalanche photodiodes using calibrated technology computer-aided design	7
Study on the optimization of bending-vibration coupling stress of QFN solder joints based on Taguchi orthogonal experimental design and Harris Hawks Optimization algorithm	7
Revisiting the effectiveness of diamond heat spreaders on multi-finger gate GaN HEMT using chip-to-package-level thermal simulation	7
Development of eutectic gallium-indium-based transparent conductive electrodes on flexible substrates for touch sensor integration	7
Analysis of the transient dose rate effect on clock resources of JXCV5SX95T FPGA	7
Impact of neutron irradiation on SiC power MOSFETs after stress tests qualification	7
A screening test of GaN-HEMTs for improvement of breakdown voltage uniformity	7
Error correction improvement based on weak-bit-flipping for resistive memories	7
Implementation of high failure current Schottky-embedded DDSCR	7
Process-induced warpage and stress estimation of through glass via embedded interposer carrier with ring-type framework	7
Reduced-order model for solder balls – Potential of projection-based approaches for representing viscoplastic behavior	7
Warpage measurements to support the development of mmWave modules	7
New methodology for optimal preconditioning of GaN HEMT devices	7
Analysis of the stress state in QFN package during four point bending and temperature experiments utilizing piezoresistive stress sensor	7
Interfacial fracture behavior of polyimide/copper in RDL structures for advanced electronic packaging	7
Long-term positive and negative gate bias stress tests on parallel connected SiC MOSFETs at −40 °C and 175 °C	7
The behaviour of 350 V GaN HEMTs during heavy ion irradiations	7
Electro-thermal stress minimisation of motor-drive inverter switches by hybrid modulation strategy technique	7
Over-voltage and cross-conduction hard switching stress on schottky gate-type p-GaN HEMT in half-bridge operation. Experimental and physical approaches	7