IEEE Electron Device Letters

Papers
(The H4-Index of IEEE Electron Device Letters is 43. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)
ArticleCitations
Table of Contents115
IEEE Electron Device Letters Publication Information83
Table of Contents83
Front Cover77
Blank Page75
Modulation of Ciss of a 4H-SiC Planar MOSFET With a Shorter Sidewall and a Thicker Gate74
High-Efficiency Metal-Insulator-Metal Electron Emitter Based on Porous Alumina Film74
Rapid On-Wafer Quality Screening of AlGaN/GaN Superlattice Castellated Field Effect Transistors Using Short-Term Stress and Electroluminescence70
Ultrathin Interfacial Layer and Pre-Gate Annealing to Suppress Virtual Gate Formation in GaN-Based Transistors: The Impact of Trapping and Fluorine Inclusion67
Self-Curable Synaptor With Tri-Node Charge- Trap FinFET for Semi-Supervised Learning66
RFIC 2023 Call for Papers65
Table of Contents64
EDS Meetings Calendar62
Blank Page61
Front Cover59
IEEE Electron Device Letters Information for Authors59
IEEE Electron Device Letters Information for Authors56
Exploration of the exciting world of multifunctional oxide-based electronic devices: from material to system-level applications56
Table of Contents56
EDS Meetings Calendar55
Guar Gum-WTe2 Nanohybrid-Based Biomemristor Synapse With Short- and Long-Term Plasticity55
High-Performance SAW Device Based on Zinc-Oxide Substrate With Electric Field Regulating Graphene Film Conductivity for Signal Amplifier55
A Flexible Graphene-Based Fabric Ultrasound Source for Machine Learning Enhanced Information Encryption54
GaN Optopairs With Asymmetric Spiral Patterns for High-Resolution 360° Angle Detection54
Asymmetric Interference Behavior in 3D NAND Cell and the Reverse Trend Induced by Undercut of Sacrificial Nitride Film53
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices: Reliability of Advanced Nodes52
Demonstration of a Scalable Magnetron Array Through Extracavity Coupling51
New Insights Into Low-Temperature Thermal Stability and PBTI in Back-Gated IGZO/HfO 2 Transistors Related to Oxygen Migration50
Inserting Interfacial Layer for Atomic-Scaled Hydrogen Control to Enhance Electrical Properties of InZnO TFTs50
Short-Length, High-Efficiency S-Band Coaxial Cavity Relativistic Multibeam Klystron Amplifier for Potential High Power Microwave Application50
Front Cover50
Hot Carrier Degradation Reduction in Metal Oxide Thin-Film Transistors by Implementing a Lightly Doped Drain-Like Structure49
Terahertz Electronic Metadevices: Principles Behind the Ultra-High Cutoff Frequency49
Axisymmetric Transformer in Glass IPD Technology and Its Application to Miniaturized On-Chip Bandpass Filters48
Localized Thermal Effect Enhanced NBTI in Multifin pFinFETs Under Low Drain Bias47
A Compact Model of Amorphous InGaZnO TFTs to Predict Temperature-Dependent Characteristics45
First Experiment of a 600-GHz CW Gyrotron Developed as Light Source for EMF Exposure Assessment45
Thermal Process and Dopant Diffusion Model of a-InGaZnO TFTs for VT Prediction Using Lateral Carrier Density Profiling Technique45
A Novel Insulated Gate Trigger Thyristor Integrated With Gate Transient Voltage Suppressor for Ultrahigh di/dt Pulse Switching44
High-Voltage β-Ga2O3 RF MOSFETs With a Shallowly-Implanted 2DEG-Like Channel44
A 1-V Supply a-InGaZnO-Based Voltage Reference With Enhancement- and Depletion-Mode Thin-Film Transistors44
Characteristics of Hybrid Structured Organic Light-Emitting Diodes Display: Coupled Rigidity With Flexibility44
Symmetric Phase-Engineered Hf 1-x Zr x O 2 Enab43
A Low-Capacitance Long-Strip Electrode Design for Fast-Switching Vertical SiC PCSS43
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