IEEE Electrical Insulation Magazine

Papers
(The TQCC of IEEE Electrical Insulation Magazine is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)
ArticleCitations
News From Japan36
Locating Stator Coil Dissection Sites Using Partial Discharge Probes31
Nondestructive Terahertz and Millimeter Wave Imaging for Underfilm Corrosion18
IEEE Electrical Insulation Magazine, a Publication of DEIS15
Bulletin Board: In Memoriam Ray Bartnikas14
Bulletin Board: 2022 IPMHVC and EIC13
From the Editor12
Book Reviews [Two books reviewed]12
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles10
Table of Contents10
Table of Contents8
Meetings Calendar8
From the Editor8
Editorial8
Contents7
Table of Contents7
Advertisement7
Contents6
Table of Contents6
Book Reviews [3 books reviewed]6
Gas Formation from Arcing Faults in Transformers—Part II6
Advertisement5
Contents5
IEEE Electrical Insulation Magazine, a Publication of DEIS5
Bulletin Board: Report on the 16th Uhvnet Colloquium, May 9–10, 20245
Introducing IEEE Collabratec5
A Day in the Life of an Offshore Wind High-Voltage Laboratory4
From the Editor4
Inside front cover4
News From Japan4
Advertisement3
Bulletin Board: INSUCON 2023 Report3
Call for Papers3
Table of Contents3
Explore the many benefits of IEEE Access3
Table of Contents3
Call for Papers3
News From Japan3
Bulletin Board: Report on the 2nd Thematic School on Dielectrics 20213
News From Japan3
Book Reviews [3 books reviewed]3
Front Cover3
IEEE Electrical Insulation Magazine, a Publication of DEIS2
Book Reviews [7 books reviewed]2
News From Japan2
A Review of Failure Analysis and Detection Methods for Buffer Layers in High-Voltage Cables1
Meetings Calendar1
Advertisement1
Advertisement1
IEEE Electrical Insulation Magazine, a Publication of DEIS1
Empowering Women in Electrical Insulation: DEIS WIE's 2024 Vision1
Introducing IEEE Collabratec1
Advertisement1
History of the International Symposium on Discharges and Electrical Insulation in Vacuum (ISDEIV)—60 Years So Far1
Apparent Charge Measurement According to IEC 60270. How is it Done?1
Bulletin Board: In Memoriam Villgot Englund1
Bulletin Board: IEEE DEIS 4th International Conference on Dielectrics July 3-7 2022 Palermo, Italy1
Front Cover1
Table of Contents1
Enhancing High-Temperature Capacitive Energy Storage Performance of Dielectric Polymers via Electrical Conduction Suppression1
News From Japan1
Advertisement0
Editorial0
Meetings Calendar0
TechRxiv0
Overhead Lines and Wildfires: Role of Outdoor Insulators: Prepared by a Task Force of the IEEE DEIS Outdoor Insulation Technical Committee0
Creativity Is the Essence of Innovation: A Conversation with Mélanie Lévesque0
Bulletin Board: 2024 Graduate Fellowship0
Stories from China0
Stories From China0
Bulletin Board: 2023 IEEE Electrical Insulation Conference0
Advertisement0
Retrofilling Mineral Oil-Immersed Transformers with Alternative Insulating Liquids: A Review0
Particulates—Friends or Foes?0
Dielectric Measurements in the Frequency Domain—Dos and Don'ts0
Recruit a Member0
Front Cover0
Monitoring of Partial Discharges in HVDC Power Cables0
Editorial0
Testing Challenges in the Development of Innovative Extruded Insulation for HVDC Cables0
Young Professionals0
IEEE Access0
Antonios Tzimas: Following His Path with “Meraki”0
Editorial0
Front Cover0
Inside front cover0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Meetings Calendar0
The IEEE Electrical Insulation Magazine Is Looking for Two New Board Members0
Meetings Calendar0
Contents0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Inside front cover0
Stories From China0
Bulletin Board: IEEE Electrical Insulation Magazine Is Looking for Two New Board Members0
Bulletin Board: ICHVE 20220
Stories from China0
Feasibility of Space Charge Measurements on HVDC Cable Joints: Study Group—IEEE DEIS Technical Committee “HVDC Cable and Systems:”0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Meetings Calendar0
Dielectric Performance of Transformer Liquids–Summary of a CIGRE Study0
Editorial0
Conductivity and Dielectric Dissipation Factor (tan δ) Measurements of Insulating Oils of New and Aged Power Transformers—Comparison of Results Between Portable Square Wave and Conventional Bridge Met0
Front Cover0
IEEE Transactions on Dielectrics and Electrical Insulation0
From the Editor0
Inside front cover0
Front Cover0
Looking at the Bigger Picture with Hulya Kirkici0
Table of Contents0
IEEE Access0
TechRxiv: Share Your Preprint Research with the World!0
Luck and Dielectrics: A Conversation with Greg Stone0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Recruit a Member0
Editorial0
Advertisement0
Inside Front Cover0
From the Editor0
Enpay Transformer Components0
Introducing IEEE Collabratec0
From the Editor0
Book Reviews [3 books reviewed]0
Bulletin Board: DEIS Becoming Core Member of the Transportation Electrification Community0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Meetings Calendar0
Young Professionals0
Book Reviews [7 books reviewed]0
Meetings Calendar0
Assessment of In-Service Transformers Filled with Synthetic Ester at 33 kV and Below0
Bulletin Board: IEEE ICD 2026 Updates0
Bulletin Board: Get Your Work Published in IEEE Electrical Insulation Magazine0
Bulletin Board: Winners of IEEE DEIS Awards for 2021 and 20220
Meetings Calendar0
Advertisement0
Implementing Condition Monitoring for Medium Voltage Switchgear for the Distribution Network in Singapore0
Next-Generation Ester Dielectric Liquids: Some Key Findings and Perspectives0
Fabrication of Efficient Low-Voltage-Alternator Windings Using Polyester Resin Nanocomposite for Normal and Overloading Conditions0
Front-Cover0
Contents0
Advertisement0
Join Us at the IEEE International Workshop on Integrated Power Packaging (IWIPP) 2025!0
TechRxiv0
Stories From China0
Bulletin Board: IEEE Dielectrics and Electrical Insulation Society (DEIS) 2023 Call for Nominations DEIS Administrative Committee (AdCom)0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Young Professionals0
Bulletin Board: Fifth IEEE ICD0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Editorial0
Editorial0
Table of Contents0
Editorial0
Contents0
Advertisement0
Editorial0
Guide to Changes Made in Edition 4 of IEC 60270, Charge-Based Partial Discharge Measurements0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Table of Contents0
Book Reviews [Three books reviewed]0
Front-Cover0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Meetings Calendar0
Bulletin Board: IEEE Electrical Insulation Magazine Is Looking for Two New Board Members0
News from Japan0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
From the Editor0
From the Editor0
Isolated-Phase Bus—Design, Operation, Deterioration, and Failure0
Effect of Thermal Aging on Electrical Performance of Perfluoroalkoxy- and Polyamide-Imide-Coated Magnet Wire0
Table of Contents0
Book Reviews [Three books reviewed]0
Bulletin Board: DEIS Webinars0
Young Professionals0
Stories From China0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Meetings Calendar0
From the Editor0
Editorial0
Front-Cover0
Bulletin Board: Would you be interested in a 4-day Summer School on Extra-High Voltage DC Transmission?0
Young Professionals0
Young Professionals0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Front Cover0
TechRxiv0
Book Reviews [Two Books Reviewed]0
Contents0
Report of 2023 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP)0
From the Editor0
[Front inside cover]0
From the Editor0
TechRxiv0
Table of Contents0
Bulletin Board: Invitation to the IEEE EIC 2025 Conference0
Editorial0
From the Editor0
Inside Front Cover0
Editorial0
Bulletin Board: APEC 20240
From the Editor0
Review of Detection Methods for Typical Faults in Transformer Bushings*0
Call for Papers0
IEEE Collabratec0
Young Professionals0
Dielectric Interfaces in High-Voltage Technology: Overview and Theoretical Approaches to the Modeling of Functional and Breakdown Behavior0
Thermal Index Estimation of Thermally Upgraded Kraft Paper in Mineral Oil and Natural Ester Insulating Liquids Under Accelerated Aging Conditions0
Bulletin Board: Report on ICDL 2022 University of Seville, Spain May 29-June 2, 20220
Table of Contents0
“Your Life Is Short and Important”—A Conversation with Dr. Toshikatsu Tanaka0
Contents0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Trends in Diagnostics and Monitoring of High-Voltage Insulation0
Bulletin Board: In Memoriam KD Srivastava0
Front Cover0
Young Professionals0
Book Reviews [3 books reviewed]0
ICPADM 2021 Report0
Advertisement0
IEEE Access0
Bulletin Board: 2025 DEIS Eric O. Forster Award0
Initiation of Electrical Discharge at the Triple Junction of the Lightning Protection of an Aircraft Radome0
Review of Numerical Simulation of Charge Transport in Polymer Insulation Under a High Electric Field and Its Application*0
Young Professionals0
One of the Most Influential Reference Resources for Engineers Around the World.0
Ieee Transactions on Dielectrics and Electrical Insulation0
IEEE Electrical Insulation Magazine0
News from Japan0
Author's Guide for IEEE Electrical Insulation Magazine Technical Articles0
Inside front cover0
On-Line Partial Discharge Detection on Transformer Cable Sealing Ends in Singapore's Transmission Network0
News From Japan0
Editorial0
Bulletin Board: Call for Nominations: 2025 IEEE Eric O. Forster Distinguished Service Award0
Editorial0
IEEE Transactions on Dielectrics and Electrical Insulation0
Contents0
Technological Development of a Composite Insulator for High Voltage Transmission Line Monitoring0
News From Japan0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Meetings Calendar0
News from Japan0
Inside front cover0
Proceedings of the IEEE0
IEEE Electrical Insulation Magazine, a Publication of DEIS0
Editorial0
Editorial0
Inside Front Cover0
From the Editor0
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