IEEE Transactions on Semiconductor Manufacturing

Papers
(The H4-Index of IEEE Transactions on Semiconductor Manufacturing is 19. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)
ArticleCitations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"51
IEEE Transactions on Semiconductor Manufacturing Publication Information42
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks37
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process36
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference35
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments33
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment32
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters31
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding31
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning31
Call for Papers for IEEE Transactions on Materials for Electron Devices25
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"22
Computational Study of Chemical Uniformity Impacts on Electrodeposition22
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection22
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)21
Level Set Simulation on Single Wafer Wet Processing Improvement21
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method20
Advanced Process Control System for Trench Shape of Power Devices19
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