OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Semiconductor Manufacturing is 18. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-06-01 to 2025-06-01.)

Article	Citations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"	48
IEEE Transactions on Semiconductor Manufacturing Publication Information	41
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks	36
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process	34
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference	33
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters	33
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning	30
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding	30
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning	30
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment	28
Call for Papers for IEEE Transactions on Materials for Electron Devices	25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	22
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection	22
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning	21
Computational Study of Chemical Uniformity Impacts on Electrodeposition	21
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)	19
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge	19
Level Set Simulation on Single Wafer Wet Processing Improvement	19
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method	18