IEEE Transactions on Semiconductor Manufacturing

Papers
(The median citation count of IEEE Transactions on Semiconductor Manufacturing is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)
ArticleCitations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"51
IEEE Transactions on Semiconductor Manufacturing Publication Information42
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks37
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process36
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference35
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments33
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment32
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters31
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding31
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning31
Call for Papers for IEEE Transactions on Materials for Electron Devices25
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"22
Computational Study of Chemical Uniformity Impacts on Electrodeposition22
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection22
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)21
Level Set Simulation on Single Wafer Wet Processing Improvement21
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method20
Advanced Process Control System for Trench Shape of Power Devices19
Single-Mask Fabrication of Sharp SiOx Nanocones18
Editorial17
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning16
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing16
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication15
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots15
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps14
IEEE Transactions on Semiconductor Manufacturing Publication Information13
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge13
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects13
Test Structure for Measuring the Selectivity in XeF2 and HF Vapour Etch Processes12
Blank Page12
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO2 Etch Process12
Physics-Informed Machine Learning Based Edge Detection for SEM Images12
Correlation Between Trench Angle and Wafer Warpage in Trench Field Plate Power MOSFETs and its Application to Quality Control11
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture11
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation10
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process10
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Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process10
Integration Challenges on 300mm High Resistivity Silicon Substrates10
Source Pad Design Tradeoffs for a Power TrenchFET9
IEEE Transactions on Semiconductor Manufacturing Publication Information9
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes9
IEEE Transactions on Semiconductor Manufacturing Publication Information9
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations9
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 369
2021 Index IEEE Transactions on Semiconductor Manufacturing Vol. 349
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process9
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations8
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching8
IEEE Transactions on Semiconductor Manufacturing Publication Information8
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques8
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN7
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon7
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics7
Optimization and Application of TiO2 Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell7
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing7
Table of Contents7
Journal of Lightwave Technology Special Issue on: OFS-297
Front Cover7
Evaluation of Thick Silicon Nitride Film Properties at 300 mm Scale for High-Q Photonic Devices7
Deep Learning Approach to Inverse Grain Pattern of Nanosized Metal Gate for Multichannel Gate-All-Around Silicon Nanosheet MOSFETs7
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images6
Table of Contents6
Rapid Resolution of Parametric Failures in the Process Development Period by Integrating Device Physics and Big Data6
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints6
Call for Nominations: 2024 EDS Early Career Award6
Minimizing Convolutional Neural Network Training Data With Proper Data Augmentation for Inline Defect Classification6
A Real-Time Monitoring Framework for Wafer Fabrication Processes With Run-to-Run Variations6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors6
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach6
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition6
IEEE Transactions on Semiconductor Manufacturing Publication Information6
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding6
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"6
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication6
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study6
Call for Papers 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference6
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification6
New Process Integration of Sequential Phosphorus-Doped Silicon for Trench Field Plate Power MOSFETs6
Editorial6
IEEE Transactions on Semiconductor Manufacturing Information for Authors5
Table of contents5
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis5
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders5
Manufacturing of 3D Helical Microswimmer by AFM Micromanipulation for Microfluidic Applications5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)5
Unsupervised Representation Learning and Explainable Clustering for Wafer Map Pattern Analysis5
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects5
Table of Contents5
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)5
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses5
Double Coating Process Using the Single Photoresist and the Thickness Prediction5
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line5
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater5
Improving Endpoint Detection Sensitivity in Plasma Etching with Small Openings5
Editorial5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation5
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods5
BCICTS 2023 Call for Papers5
A Novel Foundry Yield Model Using Critical Area Analysis5
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process5
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling4
TechRxiv: Share Your Preprint Research With the World!4
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools4
Guest Editorial Special Section on Sustainability4
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab4
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications4
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Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images4
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples4
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability4
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test4
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics4
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy4
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)4
Sustainable Technologies for Responsible Products and a More Sustainable Future3
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning3
A Self-Test Method of Structural Failures of Uncooled Infrared Focal Plane Array3
Front Cover3
The Modeling of Post-Annealing and Etching Processes of ALD SiO2 Using Intermediate Variables Considering Digital Twin Model Reusability3
Guest Editorial Special Section on the IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)3
An Autoencoder-Based Approach for Fault Detection in Multi-Stage Manufacturing: A Sputter Deposition and Rapid Thermal Processing Case Study3
Enhancing Current Gain in Polysilicon Emitter Bipolar Transistors Through Emitter-Base Interface Engineering3
Comprehensive Study of the Impact of LWR on Device Performance in VLSI Technology3
Effects of the Applied Power of Remote Plasma System With Green Alternative Chamber Cleaning Gas of Carbonyl Fluoride3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production3
Blank Page3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation3
Editorial3
Analysis of Image Hashing in Wafer Map Failure Pattern Recognition3
Mechanistic Analysis of the Effect of Gap on Convex Curves of Wafer in Double-Sided Polishing3
Fast Optical Proximity Correction Using Graph Convolutional Network With Autoencoders3
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Model-Based OPC With Adaptive PID Control Through Reinforcement Learning3
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography3
Editorial3
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Study on Mechanical Cleavage Mechanism of GaAs via Anisotropic Stress Field and Experiments3
Avalanche Capability Improvement by Optimizing p+ Contact Resistance for N-channel Trench Power MOSFETs3
Data Visualization of Anomaly Detection in Semiconductor Processing Tools3
Production-Level Artificial Intelligence Applications in Semiconductor Supply Chains3
Product Design Enhancement With Test Structures for Non-Contact Detection of Yield Detractors2
Wafer Scratch Pattern Reconstruction for High Diagnosis Accuracy and Yield Optimization2
Vacancy-Type Defects in HfO2 Layers and Their Role in Amorphous-to-Crystalline Transition Studied by Monoenergetic Positron Beams2
BCICTS 2022 CALL FOR PAPERS2
Efficient Dual-Attention-Based Knowledge Distillation Network for Unsupervised Wafer Map Anomaly Detection2
Quantitative Comparison of Simulation and Experiment Enabling a Lithography Digital Twin2
3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology2
A Novel Multiscale Residual Aggregation Network-Based Image Super-Resolution Algorithm for Semiconductor Defect Inspection2
Wafer Lot Assignment for Parallel-Producing Tools Based on Heuristic Clustering Algorithm2
Joint Dynamic Dispatching and Preventive Maintenance for Unrelated Parallel Machines With Equipment Health Considerations2
IEEE Transactions on Semiconductor Manufacturing publication information2
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing2
Simulations of Modified Shallow Water Equation and Reaction Kinetics of Poly Etching on Single Wafer Process2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Table of Contents2
Table of Contents2
Significant Lifetime Improvement of Negative Bias Thermal Instability by Plasma Enhanced Atomic Layer Deposition SiN in Stress Memorization Technique2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing2
An Alternative PECVD Chamber Cleaning Gas of COF2 for Low-GWP Consideration2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Editorial2
Group-Exclusive Feature Group Lasso and Applications to Automatic Sensor Selection for Virtual Metrology in Semiconductor Manufacturing2
IEEE Transactions on Semiconductor Manufacturing Information for Authors2
Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging2
Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process2
Chamber and Recipe-Independent FDC Indicator in High-Mix Semiconductor Manufacturing2
Metal Contamination Behavior on Silicon Dioxide Surface Rinsed With Deionized Water Containing Ultra-Trace Metal during Single-Wafer Cleaning2
Pioneering Fast and Safe Low-k Silicon Dioxide Synthesis for Modern Integrated Circuits1
Optimization of Void Defects at TiN/Si:HfO2 Interface for 3-D Ferroelectric Memory1
DeePattern: Layout Pattern Generation With Transforming Convolutional Auto-Encoder1
Spatial and Channel-Wise Co-Attention-Based Twin Network System for Inspecting Integrated Circuit Substrate1
Atomic Layer Processes for Material Growth and Etching—A Review1
Integrated Test Pattern Extraction and Generation for Accurate Lithography Modeling1
Prediction of Highly Imbalanced Semiconductor Chip-Level Defects in Module Tests Using Multimodal Fusion and Logit Adjustment1
A Fine-Grained, End-to-End Feature-Scale CMP Modeling Paradigm Based on Fully Convolutional Neural Networks1
A Real-Time Automatic Structural-Loss Detection and Stopping Rule of Semiconductor Single-Crystal-Silicon-Growth <100> and <111>1
SnS₂ and ZnO Nanocomposite Prepared by Dispersion Method for Photodetector Application1
Yield Methodology and Heater Process Variation in Phase Change Memory (PCM) Technology for Analog Computing1
Sequential Residual Learning for Multistep Processes in Semiconductor Manufacturing1
Iterative Learning-Based Predictive Control Method for Electronic Grade Silicon Single Crystal Batch Process1
Fabrication of the Highly Ordered Silicon Nanocone Array With Sub-5 nm Tip Apex by Tapered Silicon Oxide Mask1
Improved Color Defect Detection With Machine Learning for After Develop Inspections in Lithography1
Correlated Bayesian Co-Training for Virtual Metrology1
Automatic Defect Classification Using Semi-Supervised Learning With Defect Localization1
A Hierarchical Spatial-Test Attention Network for Explainable Multiple Wafer Bin Maps Classification1
Virtual Metrology for Etch Profile in Silicon Trench Etching With SF₆/O₂/Ar Plasma1
Customer Order Behavior Classification Via Convolutional Neural Networks in the Semiconductor Industry1
Nano-Scale Depth Profiles of Electrical Properties of Phosphorus Doped Silicon for Ultra-Shallow Junction Evaluation1
IEEE Transactions on Semiconductor Manufacturing publication information1
On Uses of Noise Analysis for the Uncertainty Quantification of Line Edge Roughness Estimation1
Optimal Cyclic Scheduling of Wafer-Residency-Time-Constrained Dual-Arm Cluster Tools by Configuring Processing Modules and Robot Waiting Time1
Improvement of Multi-Lines Bridge Defect Classification by Hierarchical Architecture in Artificial Intelligence Automatic Defect Classification1
Fast and Precise Temperature Control for a Semiconductor Vertical Furnace via Heater-Cooler Integration1
The Research on Screening Method to Reduce Chip Test Escapes by Using Multi-Correlation Analysis of Parameters1
IEEE Transactions on Semiconductor Manufacturing Information for Authors1
A Practical Approach for Managing End-of-Life Systems in Semiconductor Manufacturing Using Health Index1
A Case Study on Sputtered Chromium Sacrificial Layer for Ti2O3 Microstructure Fabrication1
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, Processing and Integration for Neuromorphic Devices and In-Memory Computing"1
Eco-Friendly Dry-Cleaning and Diagnostics of Silicon Dioxide Deposition Chamber1
Image-Based Defect Classification for TFT-LCD Array via Convolutional Neural Network1
High Accuracy Simulation of Silicon Oxynitride Film Grown by Plasma Enhanced Chemical Vapor Deposition1
Modeling and Designing a GaN-Growth Reactor With Halogen-Free Vapor Phase Epitaxy: NH3 Decomposition at the Catalytic Surface of Components to Replicate Parasitic Polycrystal Formation1
E-Test Validation of Space Error Budget and Metrology1
ML-Guided Curvilinear OPC: Fast, Accurate, and Manufacturable Curve Correction1
Application of Plasma Information-Based Virtual Metrology (PI-VM) for Etching in C₄F₈/Ar/O₂ Plasma1
Plasma Pretreatment System for the Reduction of By-Product Particles in Semiconductor Manufacturing1
Front cover1
Applying Data Augmentation and Mask R-CNN-Based Instance Segmentation Method for Mixed-Type Wafer Maps Defect Patterns Classification1
Practical Q-Learning-Based Route-Guidance and Vehicle Assignment for OHT Systems in Semiconductor Fabs1
Front Cover1
Optimizing Scanning Acoustic Tomography Image Segmentation With Segment Anything Model for Semiconductor Devices1
Integrated Scheduling of Jobs, Tools, Machines, and Two Different Set of Transbots1
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, Processing and Integration for Neuromorphic Devices and In-Memory Computing"1
Wireless Measurement of the Degradation Rates of Thin Film Bioresorbable Metals Using Reflected Impedance1
Process Control in Semiconductor Manufacturing Based on Deep Distributional Soft Actor-Critic Reinforcement Learning1
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Process-Aware Digital Twins by Deep Learning for DUV Photolithography and Plasma Etch1
Ar/N2 gas Flow Rate Dependence on the Ferroelectric HfNx Thin Film Formation by ECR-Plasma Sputtering1
IEEE Transactions on Semiconductor Manufacturing Information for Authors0
Shape and Roughness Extraction of Line Gratings by Small Angle X-Ray Scattering: Statistics and Simulations0
Adversarial Defect Detection in Semiconductor Manufacturing Process0
Blank Page0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "From Mega to nano: Beyond one Century of Vacuum Electronics"0
A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP)0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on Ultrawide Band Gap Semiconductor Devices for RF, Power and Optoelectronic Applications0
An Advanced Finite Element Model for BiCMOS Process Oriented Ultra-Thin Wafer Deformation0
Optimization of RF Frequencies in Dual-Frequency Capacitively Coupled Plasma Apparatus Using Genetic Algorithm (GA) and Plasma Simulation0
Identifying Good-Dice-in-Bad-Neighborhoods Using Artificial Neural Networks0
Editorial0
Table of Contents0
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing0
A Lightweight Chip-Scale Chemical Mechanical Polishing Model Based on Polynomial Network0
Reducing Datacenter Compute Carbon Footprint by Harnessing the Power of Specialization: Principles, Metrics, Challenges and Opportunities0
Call for Papers for a Special Issue of IEEE Transactions on Materials for Electron Devices: "Exploration of the Exciting World of Multifunctional Oxide-Based Electronic Devices: From Material to Syste0
Self-Assured Deep Learning With Minimum Pre-Labeled Data for Wafer Pattern Classification0
A Dry Etch Approach To Reduce Roughness and Eliminate Visible Grind Marks in Silicon Wafers Post Back-Grind0
The Environmental Footprint of IC Production: Review, Analysis, and Lessons From Historical Trends0
Parametric Optimization for Moisture Infiltration Prevention Into a FOUP (Front Opening Unified Pod)0
Study on Measurement Method of Microscopic ζ Potential0
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"0
Bayesian Nonparametric Classification for Incomplete Data With a High Missing Rate: an Application to Semiconductor Manufacturing Data0
Simulation and Experimental Analysis of Contactless Chip Pickup Process Based on a Vortex Flow Gripper0
Planned Maintenance Schedule Update Method for Predictive Maintenance of Semiconductor Plasma Etcher0
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