OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)

Article	Citations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"	49
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference	49
IEEE Transactions on Semiconductor Manufacturing Publication Information	48
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning	45
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks	40
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters	39
Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning	37
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding	37
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment	34
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments	29
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process	26
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	24
Scalable Multi-Site Test Architecture for Chiplet-Based Systems on ATE Platforms	24
Level Set Simulation on Single Wafer Wet Processing Improvement	22
Call for Papers for IEEE Transactions on Materials for Electron Devices	22
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing	19
Editorial	19
Single-Mask Fabrication of Sharp SiO_x Nanocones	19
Advanced Process Control System for Trench Shape of Power Devices	18
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection	17
Computational Study of Chemical Uniformity Impacts on Electrodeposition	16
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method	16
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects	16
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning	15
Run-to-run control of chemical mechanical polishing head with adjustable partition pressure based on deep reinforcement learning	15

Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps	14
Analyzing the Impact of Inclined Airflow Within the EFEM on the Lateral Flow Around the FOUP Using Flow Visualization Techniques	14
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)	14
Improving RF Magnetron Sputter Parameters for a Piezoelectric AlN Thin Film Deposition	14
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication	13
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots	13
Blank Page	12
IEEE Transactions on Semiconductor Manufacturing Publication Information	12
Synthesis of Critical Patterns for Lithography Optimizations Through Machine Learning	12
Integration Challenges on 300-mm High Resistivity Silicon Substrates	11
Source Pad Design Tradeoffs for a Power TrenchFET	11
Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process	11
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation	11
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture	11
A Self-Powered Wireless Sensing Circuitry for On-Wafer In-Situ EUV Detection	11
Blank Page	11
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process	10
IEEE Transactions on Semiconductor Manufacturing Publication Information	10
IEEE Transactions on Semiconductor Manufacturing Publication Information	10
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 36	10
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO₂ Etch Process	10
Physics-Informed Machine Learning-Based Edge Detection for SEM Images	10
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations	9
Journal of Lightwave Technology Special Issue on: OFS-29	9
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations	9
IEEE Transactions on Semiconductor Manufacturing Publication Information	9
Editorial	8
Table of Contents	8
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics	8
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes	8
Characterizing Capacitor Top Plate Bias for More Accurate Electromagnetic Simulations	8
New Quality Index to Improve Overlay Measurement Accuracy Based on Moiré Marks: Method for Quantifying Moiré Pattern Quality Using the Signal Shape Index	8
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN	8
Optimization and Application of TiO₂ Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell	8
Front Cover	8
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach	8
Evaluation of Thick Silicon Nitride Film Properties at 300 mm Scale for High-Q Photonic Devices	8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process	8
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching	8
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques	8
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study	7
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon	7
Call for Nominations: 2024 EDS Early Career Award	7
Suppressing Hexagonal Defects in Ex Situ Remote Plasma Dry Etch Processing	7
IEEE Transactions on Semiconductor Manufacturing Publication Information	7
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors	7
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images	7
Table of Contents	7
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification	7
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition	7

Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing	7
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication	7
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	7
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding	7
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints	7
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects	6
IEEE Transactions on Semiconductor Manufacturing Information for Authors	6
Unsupervised Representation Learning and Explainable Clustering for Wafer Map Pattern Analysis	6
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders	6
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater	6
Why Contour Averaging Works for SEM Metrology: Analysis and Validation	6
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods	6
Table of Contents	6
BCICTS 2023 Call for Papers	6
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis	6
Fast Global Sparse Principal Component Analysis for Sensor Reduction in Virtual Metrology	6
Current Status of Bulk β-Ga₂O₃ and β-(AlxGa₁-ₓ)₂O₃ Crystal Growth	6
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)	6
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy	6
Improving Endpoint Detection Sensitivity in Plasma Etching With Small Openings	6
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses	6
Macro and Micro-Scale Non-Contact Imaging of Electrically Active Extended Defects in 4H-SiC Merged PiN Schottky Diode Devices	6
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)	6
TechRxiv: Share Your Preprint Research With the World!	5
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics	5
Automating Root Cause Analysis in Semiconductor Manufacturing Using Transformer Models with Explainable AI	5
IEEE Transactions on Semiconductor Manufacturing Publication Information	5
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab	5
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images	5
IEEE Transactions on Semiconductor Manufacturing Information for Authors	5
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices: Reliability of Advanced Nodes	5
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement	5
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability	5
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods	5
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples	5
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications	5
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)	5
Guest Editorial Special Section on the 2025 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH)	5
Table of Contents	5
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test	5
A Transformer-based Sequence Prediction Architecture for Etch Profile Evolution in Semiconductor Manufacturing	5
Guest Editorial Special Section on Sustainability	5
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes	5
Editorial	5
Blank Page	4
Multi-Scale Content-Aware Enhancement Dual-Branch CNN for LED-Chip Defect Classification	4
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography	4
Editorial	4
Avalanche Capability Improvement by Optimizing p+ Contact Resistance for N-Channel Trench Power MOSFETs	4
Front Cover	4
Effects of the Applied Power of Remote Plasma System With Green Alternative Chamber Cleaning Gas of Carbonyl Fluoride	4
Sustainable Technologies for Responsible Products and a More Sustainable Future	4
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production	4
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning	4
Comprehensive Study of the Impact of LWR on Device Performance in VLSI Technology	4
Multi-Scale Adaptive Inspection Framework for Voids in MOSFETs	4
Editorial	4
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation	4
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning	4
IEEE Transactions on Semiconductor Manufacturing Information for Authors	4
Mechanistic Analysis of the Effect of Gap on Convex Curves of Wafer in Double-Sided Polishing	4
Study on Mechanical Cleavage Mechanism of GaAs via Anisotropic Stress Field and Experiments	4