OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)

Article	Citations
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference	50
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"	45
IEEE Transactions on Semiconductor Manufacturing Publication Information	40
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters	35
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding	30
Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning	25
Scalable Multi-Site Test Architecture for Chiplet-Based Systems on ATE Platforms	25
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process	22
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments	20
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks	19
High-precision Acoustic Image Reconstruction for Uneven Surfaces using a YOLO-based Approach	18
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning	18
Call for Papers for IEEE Transactions on Materials for Electron Devices	17
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	17
Editorial	16
Level Set Simulation on Single Wafer Wet Processing Improvement	16
Single-Mask Fabrication of Sharp SiO_x Nanocones	15
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing	15
Run-to-run control of chemical mechanical polishing head with adjustable partition pressure based on deep reinforcement learning	15
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection	14
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects	14
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method	13
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots	13
Synthesis of Critical Patterns for Lithography Optimizations Through Machine Learning	12
Computational Study of Chemical Uniformity Impacts on Electrodeposition	12

Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps	12
Advanced Process Control System for Trench Shape of Power Devices	12
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication	12
Improving RF Magnetron Sputter Parameters for a Piezoelectric AlN Thin Film Deposition	11
Blank Page	11
IEEE Transactions on Semiconductor Manufacturing Publication Information	11
Analyzing the Impact of Inclined Airflow Within the EFEM on the Lateral Flow Around the FOUP Using Flow Visualization Techniques	11
Integration Challenges on 300-mm High Resistivity Silicon Substrates	10
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture	10
Source Pad Design Tradeoffs for a Power TrenchFET	10
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation	10
IEEE Transactions on Semiconductor Manufacturing Publication Information	9
Physics-Informed Machine Learning-Based Edge Detection for SEM Images	9
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO₂ Etch Process	9
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process	9
A Self-Powered Wireless Sensing Circuitry for On-Wafer In-Situ EUV Detection	9
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations	8
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations	8
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN	8
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 36	8
IEEE Transactions on Semiconductor Manufacturing Publication Information	8
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques	8
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes	8
IEEE Transactions on Semiconductor Manufacturing Publication Information	8
Journal of Lightwave Technology Special Issue on: OFS-29	8
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics	8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process	8
Evaluation of Thick Silicon Nitride Film Properties at 300 mm Scale for High-Q Photonic Devices	7
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors	7
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching	7
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon	7
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images	7
Table of Contents	7
Front Cover	7
New Quality Index to Improve Overlay Measurement Accuracy Based on Moiré Marks: Method for Quantifying Moiré Pattern Quality Using the Signal Shape Index	7
Characterizing Capacitor Top Plate Bias for More Accurate Electromagnetic Simulations	7
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication	7
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	7
Table of Contents	7
Editorial	7
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach	7
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study	7
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding	6
Call for Nominations: 2024 EDS Early Career Award	6
BCICTS 2023 Call for Papers	6
Macro and Micro-Scale Non-Contact Imaging of Electrically Active Extended Defects in 4H-SiC Merged PiN Schottky Diode Devices	6
IEEE Transactions on Semiconductor Manufacturing Publication Information	6
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition	6
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders	6
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)	6

Unsupervised Representation Learning and Explainable Clustering for Wafer Map Pattern Analysis	6
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification	6
IEEE Transactions on Semiconductor Manufacturing Publication Information	6
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints	6
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses	6
Suppressing Hexagonal Defects in Ex Situ Remote Plasma Dry Etch Processing	6
Guest Editorial Special Section on the 2025 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH)	5
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples	5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)	5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation	5
Improving Endpoint Detection Sensitivity in Plasma Etching With Small Openings	5
Editorial	5
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes	5
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)	5
IEEE Transactions on Semiconductor Manufacturing Information for Authors	5
Current Status of Bulk β-Ga₂O₃ and β-(AlxGa₁-ₓ)₂O₃ Crystal Growth	5
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects	5
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy	5
A Boundary-Aware Surrogate Model for Predicting Feature-Scale TiN Etching Profiles	5
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images	5
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab	5
Fast Global Sparse Principal Component Analysis for Sensor Reduction in Virtual Metrology	5
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis	5
Table of Contents	5
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater	5
Guest Editorial Special Section on Sustainability	5
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications	5
Editorial	4
Sustainable Technologies for Responsible Products and a More Sustainable Future	4
A Transformer-Based Sequence Prediction Architecture for Etch Profile Evolution in Semiconductor Manufacturing	4
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability	4
IEEE Transactions on Semiconductor Manufacturing Publication Information	4
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement	4
IEEE Transactions on Semiconductor Manufacturing Information for Authors	4
Blank Page	4
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation	4
TechRxiv: Share Your Preprint Research With the World!	4
Table of Contents	4
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics	4
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods	4
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning	4
Multi-Scale Content-Aware Enhancement Dual-Branch CNN for LED-Chip Defect Classification	4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices: Reliability of Advanced Nodes	4
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test	4
Automating Root Cause Analysis in Semiconductor Manufacturing Using Transformer Models With Explainable AI	4