OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)

Article	Citations
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)	46
Call for Papers for a Special Issue of IEEE Transactions on Materials for Electron Devices: "Exploration of the Exciting World of Multifunctional Oxide-Based Electronic Devices: From Material to Syste	41
Fabrication of Porous Cu-Sn Microbumps for Low Temperature Cu-Cu Bonding	39
Table of Contents	33
IEEE Transactions on Semiconductor Manufacturing Information for Authors	31
BCICTS 2023 Call for Papers	28
Table of Contents	28
IEEE Transactions on Semiconductor Manufacturing Publication Information	27
Table of Contents	24
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"	24
Blank Page	23
Simulation and Experimental Analysis of Contactless Chip Pickup Process Based on a Vortex Flow Gripper	22
Fully Automated Wafer-Level Edge Coupling Measurement System for Silicon Photonics Integrated Circuits	21
IEEE Transactions on Semiconductor Manufacturing Information for Authors	19
Call for Papers for RFIC 2023	19
IEEE Transactions on Semiconductor Manufacturing Publication Information	19
IEEE Transactions on Semiconductor Manufacturing Information for Authors	17
2021 EDS Education Award Call for Nominations	16
IEEE Transactions on Semiconductor Manufacturing publication information	16
Front Cover	16
IEEE Transactions on Semiconductor Manufacturing Publication Information	15
Self-Assured Deep Learning With Minimum Pre-Labeled Data for Wafer Pattern Classification	13
Edge Effects of an Eddy-Current Thickness Sensor During Chemical Mechanical Polishing	13
Significant Lifetime Improvement of Negative Bias Thermal Instability by Plasma Enhanced Atomic Layer Deposition SiN in Stress Memorization Technique	12
A Lightweight Chip-Scale Chemical Mechanical Polishing Model Based on Polynomial Network	12

A Study on the Improvement of Safety and Efficiency of Clean Rooms in Semiconductor Factories Through Real Fire Experiments	12
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process	12
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning	12
3-D NAND Oxide/Nitride Tier Stack Thickness and Zonal Measurements With Infrared Metrology	12
Improving the Reliability of Through Silicon Vias: Reducing Copper Protrusion by Artificial Defect Manipulation and Annealing	12
Photoresist Spray Coating on Silicon Wafers With Acoustic Resonance Atomization	11
Why Contour Averaging Works for SEM Metrology: Analysis and Validation	11
Reducing Datacenter Compute Carbon Footprint by Harnessing the Power of Specialization: Principles, Metrics, Challenges and Opportunities	10
Quantitative Comparison of Simulation and Experiment Enabling a Lithography Digital Twin	10
Feature Extraction From Diffraction Images Using a Spatial Light Modulator in Scatterometry	9
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)	9
Elimination of Si-C Defect on Wafer Surface in High-Temperature SPM Process Through Nitrogen Purge in 300-mm Single-Wafer Chamber	9
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis	9
Boundless Engineering for Yield to Cope With the Complexity of High-Volume Manufacturing	9
Chamber and Recipe-Independent FDC Indicator in High-Mix Semiconductor Manufacturing	8
ℓ₁ Trend Filtering-Based Change Point Detection for Pumping Line Balance of Deposition Equipment	8
A Novel Foundry Yield Model Using Critical Area Analysis	8
Parametric Optimization for Moisture Infiltration Prevention Into a FOUP (Front Opening Unified Pod)	8
Influence and Suppression of Harmful Effects Due to By-Product in CVD Reactor for 4H-SiC Epitaxy	8
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process	8
Dynamic Down-Selection of Measurement Markers for Optimized Robust Control of Overlay Errors in Photolithography Processes	7
Double Coating Process Using the Single Photoresist and the Thickness Prediction	7
Automatic Defect Detection in Epitaxial Layers by Micro Photoluminescence Imaging	7
Preparation and Application of Sol-Gel Polishing Pad for Polishing CVD Single Crystal Diamond at High Speed	7
Study on Measurement Method of Microscopic ζ Potential	7
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods	7
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line	7
Planned Maintenance Schedule Update Method for Predictive Maintenance of Semiconductor Plasma Etcher	7
A Numerical Study on the Effects of Purge and Air Curtain Flow Rates on Humidity Invasion Into a Front Opening Unified Pod (FOUP)	6
Watermark Detection in CMOS Image Sensors Using Cosine-Convolutional Semantic Networks	6
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks	6
Modular Fluid Delivery System Architectures Drive Configurability Options, Enhance Semiconductor Manufacturing Equipment Productivity, and Improve Process Performance	6
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses	6
Bayesian Nonparametric Classification for Incomplete Data With a High Missing Rate: an Application to Semiconductor Manufacturing Data	6
Joint Dynamic Dispatching and Preventive Maintenance for Unrelated Parallel Machines With Equipment Health Considerations	6
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment	6
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning	6
Wafer Lot Assignment for Parallel-Producing Tools Based on Heuristic Clustering Algorithm	6
IEEE Transactions on Semiconductor Manufacturing Information for Authors	5
Table of contents	5
Observation and Suppression of Growth Pits Formed on 4H-SiC Epitaxial Films Grown Using Halide Chemical Vapor Deposition Process	5
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference	5
A Novel Multiscale Residual Aggregation Network-Based Image Super-Resolution Algorithm for Semiconductor Defect Inspection	5
Front Cover	5
IEEE Transactions on Semiconductor Manufacturing Information for Authors	5
IEEE Transactions on Semiconductor Manufacturing publication information	5
A Hybrid Method of Frequency and Spatial Domain Techniques for TFT-LCD Circuits Defect Detection	5
Supply Chain Planning for IC Design House Back-End Production Network With Turnkey Service	5
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater	5
Front Cover	5

Table of Contents	5
Call for Nominations for Editor-in-Chief: IEEE Transactions on Semiconductor Manufacturing	5
Effect of SiO₂ Interfacial Layer Reduction on MFSFET With 5 nm-Thick Ferroelectric Nondoped HfO₂ by Deposition Rate Control	5
Leveraging Machine Learning for Capacity and Cost on a Complex Toolset: A Case Study	5
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects	5
Attention Mechanism-Based Root Cause Analysis for Semiconductor Yield Enhancement Considering the Order of Manufacturing Processes	4
Table of Contents	4
Fuzzy Selection Model for Quality-Based IC Packaging Process Outsourcers	4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"	4
Table of contents	4
IEEE Transactions on Semiconductor Manufacturing Publication Information	4
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection	4
Modeling and Optimizing the Impact of Process and Equipment Parameters in Sputtering Deposition Systems Using a Gaussian Process Machine Learning Framework	4
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling	4
An Advanced Finite Element Model for BiCMOS Process Oriented Ultra-Thin Wafer Deformation	4
Investigation of Variation in On-Si On-Wafer TRL Calibration in Sub-THz	4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Solid-State Image Sensors"	4
The Effect of Si Surface Flattening Process on the MISFET With High-k HfN_x Multilayer Gate Dielectrics	4
Improving Liquid Film Thickness Uniformity of Semiconductor Etching Equipment Using Flow Field Visualization and CFD Simulation	4
A Hierarchical Spatial-Test Attention Network for Explainable Multiple Wafer Bin Maps Classification	4
Editorial	4
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge	4
Call for Papers for IEEE Transactions on Materials for Electron Devices	4
CMP Process Optimization Engineering by Machine Learning	4
Interface Characteristics, Erosion Behavior, and Thermal Shock Resistance of Al–Ta Alloy Coatings Produced by Arc Spraying	3
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)	3
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps	3
Editorial	3
Virtual Metrology Modeling for Wafer Edges via Graph Attention Networks	3
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method	3
Effective Variational-Autoencoder-Based Generative Models for Highly Imbalanced Fault Detection Data in Semiconductor Manufacturing	3
Level Set Simulation on Single Wafer Wet Processing Improvement	3
Advanced Process Control System for Trench Shape of Power Devices	3
Automated Visual Inspection of Defects in Transparent Display Layers Using Light-Field 3-D Imaging	3
Gas-Delivery Fluid-Mechanical Timescales in Semiconductor Manufacturing	3
Improved Color Defect Detection With Machine Learning for After Develop Inspections in Lithography	3
Editorial	3
Image-Based Defect Classification for TFT-LCD Array via Convolutional Neural Network	3
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication	3
Thermal and Electrical Analysis of the Electrostatic Chuck for the Etch Equipment	3
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab	3