IEEE Transactions on Semiconductor Manufacturing

Papers
(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)
ArticleCitations
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process46
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference41
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"40
Fast and High-Precision Temperature Control in Semiconductor Vertical Furnace via Iterative Experiments36
IEEE Transactions on Semiconductor Manufacturing Publication Information36
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters35
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding35
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks32
Defect Reduction and Line Width Roughness Improvement by Using a Post Precoat Treatment in Waferless Chamber Conditioning32
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning26
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment25
Call for Papers for IEEE Transactions on Materials for Electron Devices23
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"23
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)23
Level Set Simulation on Single Wafer Wet Processing Improvement21
Advanced Process Control System for Trench Shape of Power Devices20
Single-Mask Fabrication of Sharp SiOx Nanocones19
Editorial19
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots18
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing17
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection17
Computational Study of Chemical Uniformity Impacts on Electrodeposition15
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge14
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning13
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method13
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps13
Improving RF Magnetron Sputter Parameters for a Piezoelectric AlN Thin Film Deposition13
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication12
Synthesis of Critical Patterns for Lithography Optimizations Through Machine Learning12
Blank Page11
IEEE Transactions on Semiconductor Manufacturing Publication Information11
Grain Morphology Effects on Void Formation and Electromigration-Induced Failure in Copper Interconnects11
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process10
Source Pad Design Tradeoffs for a Power TrenchFET10
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Integration Challenges on 300-mm High Resistivity Silicon Substrates10
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation10
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture10
Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process9
2021 Index IEEE Transactions on Semiconductor Manufacturing Vol. 349
Physics-Informed Machine Learning-Based Edge Detection for SEM Images9
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 369
A Self-Powered Wireless Sensing Circuitry for On-Wafer In-Situ EUV Detection9
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO₂ Etch Process9
IEEE Transactions on Semiconductor Manufacturing Publication Information9
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations8
Optimization and Application of TiO2 Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell8
Deep Learning Approach to Inverse Grain Pattern of Nanosized Metal Gate for Multichannel Gate-All-Around Silicon Nanosheet MOSFETs8
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes8
IEEE Transactions on Semiconductor Manufacturing Publication Information8
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process8
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics8
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations8
IEEE Transactions on Semiconductor Manufacturing Publication Information8
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN8
Journal of Lightwave Technology Special Issue on: OFS-298
Front Cover7
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing7
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication7
Table of Contents7
Editorial7
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching7
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach7
New Quality Index to Improve Overlay Measurement Accuracy Based on Moiré Marks: Method for Quantifying Moiré Pattern Quality Using the Signal Shape Index7
Evaluation of Thick Silicon Nitride Film Properties at 300 mm Scale for High-Q Photonic Devices6
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon6
Table of Contents6
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study6
Characterizing Capacitor Top Plate Bias for More Accurate Electromagnetic Simulations6
A Real-Time Monitoring Framework for Wafer Fabrication Processes With Run-to-Run Variations6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors6
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images6
Call for Papers 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference6
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders5
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"5
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification5
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods5
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects5
Macro and Micro-Scale Non-Contact Imaging of Electrically Active Extended Defects in 4H-SiC Merged PiN Schottky Diode Devices5
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line5
BCICTS 2023 Call for Papers5
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding5
IEEE Transactions on Semiconductor Manufacturing Publication Information5
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater5
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses5
Unsupervised Representation Learning and Explainable Clustering for Wafer Map Pattern Analysis5
Current Status of Bulk β-Ga₂O₃ and β-(AlxGa₁-ₓ)₂O₃ Crystal Growth5
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints5
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition5
Call for Nominations: 2024 EDS Early Career Award5
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)5
Editorial5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)5
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation5
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)4
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab4
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy4
Improving Endpoint Detection Sensitivity in Plasma Etching With Small Openings4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images4
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications4
TechRxiv: Share Your Preprint Research With the World!4
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices: Reliability of Advanced Nodes4
Editorial4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes4
Table of Contents4
Guest Editorial Special Section on the 2025 International Conference on Compound Semiconductor Manufacturing Technology (CS-MANTECH)4
Blank page4
IEEE Transactions on Semiconductor Manufacturing Publication Information4
Guest Editorial Special Section on Sustainability4
Double Coating Process Using the Single Photoresist and the Thickness Prediction4
Table of contents4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability4
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics3
Effects of the Applied Power of Remote Plasma System With Green Alternative Chamber Cleaning Gas of Carbonyl Fluoride3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation3
Production-Level Artificial Intelligence Applications in Semiconductor Supply Chains3
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning3
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement3
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography3
Sustainable Technologies for Responsible Products and a More Sustainable Future3
Front Cover3
Editorial3
Blank Page3
Understanding and Improving Virtual Metrology Systems Using Bayesian Methods3
Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production3
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning3
Editorial3
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