IEEE Transactions on Semiconductor Manufacturing

Papers
(The TQCC of IEEE Transactions on Semiconductor Manufacturing is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-06-01 to 2025-06-01.)
ArticleCitations
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design"48
IEEE Transactions on Semiconductor Manufacturing Publication Information41
Investigations of Fast Vacuum Pump-Down Processes Between Parallel Isothermal Disks36
Minimization of Particle Deposition on Wafers Caused by the Pressure Change in the Vacuum Chamber Through a Pressure Control Regulation Process34
Call for Nominations for Editor-in-Chief: IEEE Electron Device Letters33
Guest Editorial Special Section on the 2022 SEMI Advanced Semiconductor Manufacturing Conference33
Fabrication of Porous Cu–Sn Microbumps for Low-Temperature Cu–Cu Bonding30
Adaptive Weight Tuning of EWMA Controller via Model-Free Deep Reinforcement Learning30
Defect Reduction And Line Width Roughness Improvement By Using A Post Precoat Treatment In Waferless Chamber Conditioning30
Machine Learning-Based Process-Level Fault Detection and Part-Level Fault Classification in Semiconductor Etch Equipment28
Call for Papers for IEEE Transactions on Materials for Electron Devices25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"22
Nondestructive Detection of Buried and Latent Defects by Negative Mode E-Beam Inspection22
Computational Study of Chemical Uniformity Impacts on Electrodeposition21
TestDNA-E: Wafer Defect Signature for Pattern Recognition by Ensemble Learning21
A Comparative Study on Velocity Fields, Humidity and Oxygen Concentration in a Front Opening Unified Pod (FOUP) During Purge19
Level Set Simulation on Single Wafer Wet Processing Improvement19
The Effect of Purge Flow Rate and Wafer Arrangement on Humidity Invasion Into a Loaded Front Opening Unified Pod (FOUP)19
A Yield Prediction Method Based on Nonparametric Statistical and Comparison With a Networks Method18
Advanced Process Control System for Trench Shape of Power Devices16
TCAD-Enabled Machine Learning—An Efficient Framework to Build Highly Accurate and Reliable Models for Semiconductor Technology Development and Fabrication16
Single-Mask Fabrication of Sharp SiOx Nanocones15
Editorial15
Semi-Supervised Learning for Simultaneous Location Detection and Classification of Mixed-Type Defect Patterns in Wafer Bin Maps14
The Mechanism of an Etching-Back to Reduce the Density of Cone Defect in STI During the Manufacturing14
IEEE Transactions on Semiconductor Manufacturing Publication Information13
Hotspot Prediction: SEM Image Generation With Potential Lithography Hotspots13
DPFEE-Net: Enhancing Wafer Defect Classification Through Dual-Path Neural Architecture12
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Test Structure for Measuring the Selectivity in XeF2 and HF Vapour Etch Processes12
In-Situ Plasma Monitoring Using Multiple Plasma Information in SiO2 Etch Process12
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Correlation Between Trench Angle and Wafer Warpage in Trench Field Plate Power MOSFETs and its Application to Quality Control11
Wafer Bin Map Recognition With Autoencoder-Based Data Augmentation in Semiconductor Assembly Process11
Automatic Classification of C-SAM Voids for Root Cause Identification of Bonding Yield Degradation10
Source Pad Design Tradeoffs for a Power TrenchFET10
IEEE Transactions on Semiconductor Manufacturing Publication Information9
A Warpage Prediction Model for Trench Field-Plate Power MOSFET in 300mm-Diameter Process9
2021 Index IEEE Transactions on Semiconductor Manufacturing Vol. 349
Integration Challenges on 300mm High Resistivity Silicon Substrates9
IEEE Transactions on Semiconductor Manufacturing Publication Information9
Systematic Search for Stabilizing Dopants in ZrO₂ and HfO₂ Using First-Principles Calculations8
2023 Index IEEE Transactions on Semiconductor Manufacturing Vol. 368
Commonality Analysis for Detecting Failures Caused by Inspection Tools in Semiconductor Manufacturing Processes8
Wafer Dicing Vibration Investigation on Novel Wafer Mounting Techniques8
Streamlining Semiconductor Manufacturing of 200 mm and 300 mm Wafers: A Longitudinal Case Study on the Lot-to-Order-Matching Process8
Perspectives on Black Silicon in Semiconductor Manufacturing: Experimental Comparison of Plasma Etching, MACE, and Fs-Laser Etching7
IEEE Transactions on Semiconductor Manufacturing Publication Information7
Table of Contents7
Journal of Lightwave Technology Special Issue on: OFS-297
Research Toward Wafer-Scale 3D Integration of InP Membrane Photonics With InP Electronics7
Optimization and Application of TiO2 Hollow Microsphere Modified Scattering Layer for the Photovoltaic Conversion Efficiency of Dye-Sensitized Solar Cell7
Deep Learning Approach to Inverse Grain Pattern of Nanosized Metal Gate for Multichannel Gate-All-Around Silicon Nanosheet MOSFETs7
IEEE EDS Robert Bosch Micro and Nano Electro Mechanical Systems Award: Call for Nominations7
Recognition and Classification of Mixed Defect Pattern Wafer Map Based on Multi-Path DCNN7
Front Cover7
Data-Driven Production Planning Models for Wafer Fabs: An Exploratory Study6
Deep Clustering and Regression Ensemble Network for Lot Cycle Time Prediction in Semiconductor Wafer Fabrication6
RA-UNet: A New Deep Learning Segmentation Method for Semiconductor Wafer Defect Analysis on Fine-Grained Scanning Electron Microscope (SEM) Images6
Guest Editorial Process-Level Machine Learning Applications in Semiconductor Manufacturing6
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach6
Nitrogen-Doped Czochralski Silicon Wafers as Materials for Conventional and Scaled Insulated Gate Bipolar Transistors6
Defect Detection of Photovoltaic Panels to Suppress Endogenous Shift Phenomenon6
A Real-Time Monitoring Framework for Wafer Fabrication Processes With Run-to-Run Variations6
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Wide and Ultrawide Band Gap Semiconductor Devices for RF and Power Applications"6
Rapid Resolution of Parametric Failures in the Process Development Period by Integrating Device Physics and Big Data6
Call for Nominations: 2024 EDS Early Career Award5
Table of Contents5
Fabrication of On-Silicon Aperture Coupled Patch Antenna Through Micromachining and Cu-Cu Thermocompression Bonding5
IEEE Transactions on Semiconductor Manufacturing Publication Information5
Double Coating Process Using the Single Photoresist and the Thickness Prediction5
Multiobjective Order Promising for Outsourcing Supply Network of IC Design Houses5
Quantitative 3-D Flow Visualization of Conventional Purge Flow Within a Front Opening Unified Pod (FOUP)5
Semantic Context Information Modeling With Neural Networks in Customer Order Behavior Classification5
Minimizing Convolutional Neural Network Training Data With Proper Data Augmentation for Inline Defect Classification5
Editorial5
Manufacturing of 3D Helical Microswimmer by AFM Micromanipulation for Microfluidic Applications5
A Modified Lasso Model for Yield Analysis Considering the Interaction Effect in a Multistage Manufacturing Line5
Overlay Measurement Algorithm for Moiré Targets Using Frequency Analysis5
Anomaly Detection in Batch Manufacturing Processes Using Localized Reconstruction Errors From 1-D Convolutional AutoEncoders5
New Process Integration of Sequential Phosphorus-Doped Silicon for Trench Field Plate Power MOSFETs5
Automatic Pico Laser Trimming System for Silicon MEMS Resonant Devices Based on Image Recognition5
Call for Papers 6th IEEE Electron Devices Technology and Manufacturing (EDTM) Conference5
Unrelated Parallel Machine Photolithography Scheduling Problem With Dual Resource Constraints5
BCICTS 2023 Call for Papers5
Shear Force Classification Before Wire Bonding Based on Probe Mark 2-D Images Using Machine Learning Methods5
Why Contour Averaging Works for SEM Metrology: Analysis and Validation5
Table of contents4
A Novel Foundry Yield Model Using Critical Area Analysis4
Integrated Electrochemical Technology for Efficient Metal Recovery in Semiconductor Wastewater4
Guest Editorial Special Section on Sustainability4
Chemical Mechanical Polishing of Single-Crystalline Diamond Epitaxial Layers for Electronics Applications4
Efficient and Refined Deep Convolutional Features Network for the Crack Segmentation of Solar Cell Electroluminescence Images4
TechRxiv: Share Your Preprint Research With the World!4
Quality-Oriented Statistical Process Control Utilizing Bayesian Modeling4
Editorial4
DSH to Extend-DSH: Chip-Level Chemical Mechanical Planarization (CMP) Model Upgrade Based on Decoupling Regression Strategy4
Prevention of Moisture Invasion by Flow Isolation Device (FID) for Mask Automatic Storage System (Stocker Room) in a Semiconductor Fabrication Plant (Fab)4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Guest Editorial Introduction to the Joint Special Issue on Semiconductor Design for Manufacturing (DFM)4
Coherent Fourier Scatterometry for Detection of Killer Defects on Silicon Carbide Samples4
Table of Contents4
Defect Localization Approach for Wafer-to-Wafer Hybrid Bonding Interconnects4
Adaptive Cautious Regularized Run-to-Run Controller for Lithography Process4
Deep Learning-Based Multi-Horizon Forecasting for Automated Material Handling System Throughput in Semiconductor Fab4
Surface Reconstruction for Enhancing the Overlay Modeling Optimization Procedure in Photolithography Processes4
IEEE Transactions on Semiconductor Manufacturing Information for Authors4
Guest Editorial Special Section on the IEEE 33rd International Conference on Microelectronic Test Structures (ICMTS)3
Editorial3
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Density-Based Spatial Clustering of Applications With Noise (DBSCAN) for Probe Card Production for Advanced Quality Control of Wafer Probing Test3
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Understanding and Improving Virtual Metrology Systems Using Bayesian Methods3
Real-Time Change Detection for Automated Test Socket Inspection Using Advanced Computer Vision and Machine Learning3
Front Cover3
An Autoencoder-Based Approach for Fault Detection in Multi-Stage Manufacturing: A Sputter Deposition and Rapid Thermal Processing Case Study3
Comprehensive Study of the Impact of LWR on Device Performance in VLSI Technology3
Comparative Study of Nondestructive Mapping of Conformal-Coating Thickness on Microelectronics by Terahertz Time-of-Flight Tomography3
Editorial3
Performance Evaluation of Supervised Learning Model Based on Functional Data Analysis and Summary Statistics3
A Diffusion-Model-Based Methodology for Virtual Silicon Data Generation3
Practical Reinforcement Learning for Adaptive Photolithography Scheduler in Mass Production3
Sustainable Technologies for Responsible Products and a More Sustainable Future3
IEEE Transactions on Semiconductor Manufacturing Information for Authors3
Data Visualization of Anomaly Detection in Semiconductor Processing Tools3
Model-Based OPC With Adaptive PID Control Through Reinforcement Learning3
A Self-Test Method of Structural Failures of Uncooled Infrared Focal Plane Array3
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on New simulation methodologies for next-generation TCAD tools3
Geometry-Based Curvilinear Mask Process Correction for Enhanced Pattern Fidelity, Contrast, and Manufacturability3
Development of SiGe Indentation Process Control for Gate-All-Around FET Technology Enablement3
Effects of the Applied Power of Remote Plasma System With Green Alternative Chamber Cleaning Gas of Carbonyl Fluoride3
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