Soldering & Surface Mount Technology

Papers
(The H4-Index of Soldering & Surface Mount Technology is 9. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)
ArticleCitations
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder53
Effects of Sn grain orientation and microbump geometry on thermomigration failure in microbump joints15
Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding15
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder13
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple12
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact11
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging11
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages11
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling10
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage9
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles9
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