Soldering & Surface Mount Technology

Papers
(The H4-Index of Soldering & Surface Mount Technology is 9. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)
ArticleCitations
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder30
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple29
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact21
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling18
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages14
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage11
Chip warpage and stress analysis in power modules of different substrate configurations10
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing10
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy10
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles9
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