Soldering & Surface Mount Technology

Papers
(The median citation count of Soldering & Surface Mount Technology is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)
ArticleCitations
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder53
Effects of Sn grain orientation and microbump geometry on thermomigration failure in microbump joints15
Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding15
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder13
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple12
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging11
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages11
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact11
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling10
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles9
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage9
A comparative study of the mechanical properties of sintered submicron and micron Cu8
Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach8
Chip warpage and stress analysis in power modules of different substrate configurations7
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy7
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint7
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process6
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing6
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling6
A comparative study of conventional reflow and microwave hybrid heating reflow of Sn-3.0Ag-0.5Cu/Cu solder joints6
Influence of doping Si 3 N 4 nanoparticles on the properties and microstructure of Sn58Bi solder f6
Study on the interfacial reactions between In-Ag alloys and electroless nickel-immersion gold metallization5
A temperature control method of hot-bar soldering based on extended Kalman filter5
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating4
Study on reaction behavior of Sn37Pb/Ni- x Cu solid-liquid interface and mechanical properties of soldered joints4
Microstructure, interface and shear strength on Sn-based solder joints induced from the change on solder size4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering4
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading4
Numerical simulation and multi objectives optimization of fillet height in reinforced SAC305 solder joints for ultrafine capacitor assemblies4
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance4
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN4
A review: effect of copper percentage solder alloy after laser soldering4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process4
Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates3
Directional transfer and low-temperature interconnect packaging of nano metal materials3
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach3
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly3
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints3
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications3
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping3
A review of development and applications of SiC power devices in packaging and interconnect technology3
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization3
Analysis of micromorphological evolution of lead-free solder joints under random vibration3
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb- x In lead-free solder alloys3
Guest editorial: 24th international conference on electronic packaging technology2
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach2
Electric current stressing enhanced damping properties in Sn5Sb solder2
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint2
Research on controllable heat dissipation of system in ceramic package2
Wettability and microstructure transformations of YAG ceramic brazing to kovar alloy with AgCuTi filler alloy2
Effect of different beam distances in laser soldering process: a numerical and experimental study2
Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents2
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints2
Comparative analysis of the fatigue life of the FLASH under joint error conditions2
Influence of annealing temperature on 3D surface stereometric analysis in C-Ni films2
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature2
The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospace2
Mesoscopically understanding stress distribution and sensitivity in layered-porous sintered silver for high-power electronics2
Deep learning and analytical study of void regional formation in flip-chip underfilling process2
Statistical-based simulation and reflow profile optimization for improving self-alignment performance − an experimental study2
A study on the thermomechanical response of various die attach metallic materials of power electronics2
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder2
Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process2
0.43847298622131