Soldering & Surface Mount Technology

Papers
(The median citation count of Soldering & Surface Mount Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)
ArticleCitations
Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding59
Effects of Sn grain orientation and microbump geometry on thermomigration failure in microbump joints16
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple15
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder14
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder12
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging11
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact11
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages11
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling10
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles9
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage9
Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach8
A comparative study of the mechanical properties of sintered submicron and micron Cu8
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing7
Chip warpage and stress analysis in power modules of different substrate configurations7
Influence of doping Si 3 N 4 nanoparticles on the properties and microstructure of Sn58Bi solder f7
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy7
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process6
A comparative study of conventional reflow and microwave hybrid heating reflow of Sn-3.0Ag-0.5Cu/Cu solder joints6
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits6
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling6
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation5
Study on the interfacial reactions between In-Ag alloys and electroless nickel-immersion gold metallization5
Study on reaction behavior of Sn37Pb/Ni- x Cu solid-liquid interface and mechanical properties of soldered joints4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering4
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN4
A review: effect of copper percentage solder alloy after laser soldering4
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance4
A temperature control method of hot-bar soldering based on extended Kalman filter4
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process4
Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates4
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating4
Microstructure, interface and shear strength on Sn-based solder joints induced from the change on solder size4
Comparative study of machine learning method and response surface methodology in BGA solder joint parameter optimization3
Directional transfer and low-temperature interconnect packaging of nano metal materials3
A 3D coaxial transition with continuous ground wall fabricated by a 12-inch wafer-level packaging method for radio frequency applications3
Simulation and structural optimization of key structural mechanical properties of TR modules with quasi-coaxial structure under high-impact loads3
Numerical investigation of thermal fatigue crack growth behavior in SAC305 BGA solder joints3
Analysis of micromorphological evolution of lead-free solder joints under random vibration3
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach3
Numerical simulation and multi objectives optimization of fillet height in reinforced SAC305 solder joints for ultrafine capacitor assemblies3
Machine learning in solder joint engineering: a review of microstructure informatics, reliability prediction, and accelerated design3
A review of development and applications of SiC power devices in packaging and interconnect technology3
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint2
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb- x In lead-free solder alloys2
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping2
Synergistically promoted direct bonding of nanotwinned copper at 200 °C viareductive solvents2
Mesoscopically understanding stress distribution and sensitivity in layered-porous sintered silver for high-power electronics2
Wettability and microstructure transformations of YAG ceramic brazing to kovar alloy with AgCuTi filler alloy2
A study on the thermomechanical response of various die attach metallic materials of power electronics2
Electric current stressing enhanced damping properties in Sn5Sb solder2
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly2
Comparative analysis of the fatigue life of the FLASH under joint error conditions2
Influence of annealing temperature on 3D surface stereometric analysis in C-Ni films2
Research on controllable heat dissipation of system in ceramic package2
The research on the application of self-propagating interconnection technology in silicon optical transceiver module for aerospace2
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints2
Statistical-based simulation and reflow profile optimization for improving self-alignment performance − an experimental study2
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach2
Deep learning and analytical study of void regional formation in flip-chip underfilling process2
Developing ILU dispensing parameter model void size predictor on asymmetrical BGA flip-chip underfilling process2
Thermal aging effects on the properties of the Cu/(SAC0307 powder + Zn-particles)/Cu joint ultrasonic-assisted soldered at low-temperature2
Effect of adding Ni nanoparticles on the melting characteristics, mechanical properties and intermetallic compound growth of Sn58Bi solder2
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder1
Optimisation of electroless nickel electroless palladium immersion silver (ENEPImAg) surface finish parameters using the Taguchi method for enhanced solder joint reliability1
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test1
Robust low-temperature soldering of Cu plates via a novel Ni@Cu10Ni alloy mesh reinforced SAC305 composite solder1
Reflow profiling with the aid of machine learning models1
Nanocopper-based low-temperature interconnection technology: advances in material systems, sintering mechanisms and packaging applications1
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere1
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding1
Experiments on the effect of sintering pressure on the creep response of sintered silver material1
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature1
Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder1
Effects of electron irradiation and thermal cycling on electrical properties of GaN HEMT1
Guest editorial: 24th international conference on electronic packaging technology1
Effect of different beam distances in laser soldering process: a numerical and experimental study1
Effects of soldering temperature and preheating temperature on the properties of Sn–Zn solder alloys using wave soldering1
Effect of thermal aging on microstructure and mechanical properties of indium-doped Sn-Ag-Cu lead free solder alloys1
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