Soldering & Surface Mount Technology

Papers
(The median citation count of Soldering & Surface Mount Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)
ArticleCitations
Interfacial IMC growth behavior of Sn-3Ag-3Sb-xIn solder on Cu substrate134
Damping properties of Sn58Bi and Sn3.0Ag0.5Cu solders with different thicknesses and preparation directions40
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple29
Thermal fatigue life prediction and intermetallic compound behaviour of SAC305 BGA solder joints subject to accelerated thermal cycling test19
Study of mechanical properties of indium-based solder alloys for cryogenic applications13
Design criteria for pad and stencil with high pick-and-Place yield13
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder9
Properties of Cu/SAC0307 mixed solder balls/Cu joints with different Zn-particles content at low-temperature under ultrasonic assisted8
A temperature control method of hot-bar soldering based on extended Kalman filter8
Temperature and current density prediction in solder joints using artificial neural network method8
Investigation of the mechanical properties of lead-free Sn-58Bi solder alloy with cobalt addition through flux doping6
Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly6
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN5
Simulation of jet printing of solder paste for surface mounted technology5
Investigation of the thermal properties, microstructure, and mechanical properties of Sn-3Ag-3Sb-xIn lead-free solder alloys5
Influence of the soldering paste type on optical and thermal parameters of LED modules5
Effect of Si3N4 nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding4
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating4
Effect of Cu, Ni, Ag addition on creeping properties of Sn5Sb-0.5Cu-0.1Ni-0.5Ag for high temperature packaging4
Robust vision detection of pipeline solder joints4
Numerical evaluation of the mechanical response of Sn-Ag-Cu lead-free solders of various silver contents4
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review4
Defect patterns study of pick-and-place machine using automated optical inspection data3
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere3
ZnO nanoparticles and compositional dependence of structural, thermal, mechanical and electrical properties of eutectic SAC355 lead-free solder3
Effect of the solder conductive particles and substrate widths on the current carrying capability for flex-on-board (FOB) assembly3
Surface energetic-based analytical filling time model for flip-chip underfill process3
Microstructures evolution and growth kinetics of intermetallic compounds in Cu/Sn/Cu system during ultrasonic soldering process3
Flow behavior during solder/Cu column friction plunge micro-welding3
Cu3Sn-microporous copper composite joint for high-temperature die-attach applications3
Data-driven electronic packaging structure inverse design with an adaptive surrogate model3
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages2
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering2
Microstructural and compositional evolution of SAC305/TiN composite solder under thermal stressing2
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage2
A study on the effects of electrical and thermal stresses on void formation and migration lifetime of Sn3.0Ag0.5Cu solder joints2
Improvement of SAC0307/Cu column friction plunge micro-welding quality by static constraint2
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling2
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact2
Investigation of solder beading phenomenon under surface-mounted electrolytic capacitors2
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints2
Optimisation of electroless nickel electroless palladium immersion silver (ENEPImAg) surface finish parameters using the Taguchi method for enhanced solder joint reliability2
Statistical-based simulation and reflow profile optimization for improving self-alignment performance − an experimental study2
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes2
Effect of rotating magnetic field on the microstructure and properties of Sn-Ag-Sb lead-free solder alloys2
Local solidification thermal parameters affecting the eutectic extent in Sn-Cu and Sn-Bi solder alloys2
Effect of sintering temperature on ratcheting-fatigue behavior of nanosilver sintered lap shear joint2
Influence of aging temperature on the properties of Cu/(SAC0307 powder +Zn-particles)/Al joints ultrasonic-assisted soldered at low temperature1
Effect of Ce and Sb doping on microstructure and thermal/mechanical properties of Sn-1.0Ag-0.5Cu lead-free solder1
Electrical, morphological, optical and mathematical simulations equations studies in CAZO, CZO, AZO and ZNO films1
Effect of isothermal storage on the microstructure and grain orientation of Cu/Cu3Sn/Cu solder joint1
Effects of soldering temperatures and composition on the microstructures and shear properties of Sn58Bi-xSAC0307/ENIG solder joints1
Mechanical, photoelectric and thermal reliability of SAC307 solder joints with Ni-decorated MWCNTs for flip-chip LED package component during aging1
Electronic component detection based on image sample generation1
Reflow profiling with the aid of machine learning models1
A study on the thermomechanical response of various die attach metallic materials of power electronics1
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints1
Early wetting and interfacial behavior of Sn-based solder on copper substrates with different roughness1
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques1
Electric current stressing enhanced damping properties in Sn5Sb solder1
Sn99Ag0.3Cu0.7–TiO2 composite solder joints and their influence on thermal parameters of power components1
IC solder joint inspection via adaptive statistical modeling1
Ag-based filler metal wetting behavior and brazed joint performance on SLMed Ti/TiB2 substrate1
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy1
Deep learning and analytical study of void regional formation in flip-chip underfilling process1
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process1
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance1
Low-cycle fatigue life assessment of SAC solder alloy through a FEM-data driven machine learning approach1
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate1
Effect of different soldering temperatures on the properties of COB light source1
Anand constitutive modeling of multilayer Silver-Tin transient liquid phase foils using tensile and creep testing1
Chip warpage and stress analysis in power modules of different substrate configurations1
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