OOIR: Observatory of International Research

Papers

(The TQCC of Soldering & Surface Mount Technology is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-05-01 to 2024-05-01.)

Article	Citations
Detection of solder paste defects with an optimization‐based deep learning model using image processing techniques	90
Effects of doping trace Ni element on interfacial behavior of Sn/Ni (polycrystal/single-crystal) joints	39
An intelligent system for reflow oven temperature settings based on hybrid physics-machine learning model	20
Microstructural evolution and micromechanical properties of SAC305/CNT/CU solder joint under blast wave condition	10
Effect of Zn-powder content on the property of Cu/SAC0307 powder/Cu joint under ultrasonic assisted at low temperature	9
Effects of alloying element on mechanical properties of Sn-Bi solder alloys: a review	9
Effect of microwave operating power and reflow time on the microstructure and tensile properties of Sn–3.0Ag–0.5Cu/Cu solder joints	8
The formation of intermetallic layer structure of SAC405/Cu and SAC405/ENImAg solder joint interfaces	8
Effect of TiO₂ nanoparticles on the microstructure, mechanical and thermal properties of rapid quenching SAC355 lead-free solder alloy	7
The influence of soldering process parameters on the optical and thermal properties of power LEDs	7
Development of holmium doped eutectic Sn-Ag lead-free solder for electronic packaging	7
Thermomechanical fatigue lifetime evaluation of solder joints in power semiconductors using a novel energy based modeling	7
Thermal-mechanical reliability analysis of WLP with fine-pitch copper post bumps	6
Solder void size reduction in semiconductor package by vacuum reflow and pressure cure processes	5
Influence of aging on microstructure and hardness of lead-free solder alloys	5
Low-voiding solder pastes in LED assembly	5
Application of multi-quality parameter design in the optimization of underfilling process – a case study of a vehicle electronic module	5
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process	4
Study of mechanical properties of indium-based solder alloys for cryogenic applications	4
Spatial analysis of underfill flow in flip-chip encapsulation	4
Micromechanical response of SAC305 solder alloy under gamma radiation via nanoindentation approach	4
Role of aging temperature on thermomechanical fatigue lifetime of solder joints in electronic systems	4
Effects of Sn-Ag-x leveling layers on the microstructure and mechanical properties of SnBi low-temperature solder joints	3
Performance of 96.5Sn–3Ag–0.5Cu/fullerene composite solder under isothermal ageing and high-current stressing	3
Effect of Si₃N₄ nanowires doping on microstructure and properties of Sn58Bi solder for Cu bonding	3

Model updating of a temperature field simulation of a printed circuit board assembly based on the Kriging model	3
Microstructure evolution and shear strength of full Cu₃Sn- microporous copper composite joint by thermo-compression bonding	3
Cu-Cu joint with Sn-58Bi/Porous Cu/Sn-58Bi transient liquid phase bonding under formic acid atmosphere	3
Life prediction in c-Si solar cell interconnections under in-situ thermal cycling in Kumasi in Ghana	3
Optimized cerium addition for microstructure and mechanical properties of SAC305	3
Wetting characteristics of Sn-5Sb-CuNiAg lead-free solders on the copper substrate	3
Effect of Sb additions on the creep behaviour of low temperature lead-free Sn–8Zn–3Bi solder alloy	3