Soldering & Surface Mount Technology

Papers
(The TQCC of Soldering & Surface Mount Technology is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)
ArticleCitations
Study of the bonding force at the Au-Ag bump/TiW interface in wire bonding59
Effects of Sn grain orientation and microbump geometry on thermomigration failure in microbump joints16
Interfacial reactions in the Sn-9.0 wt.% Zn/Cu-Ti alloy (C1990 HP) couple15
The impact of intermetallic compound on microstructure, mechanical characteristics, and thermal behavior of the melt-spun Bi-Ag high-temperature lead-free solder14
Comparative study of tensile creep behaviour of lead-free solder alloys and conventional Sn–Pb solder12
Reworkable epoxy underfills with optimized curing and flow behavior for advanced electronic packaging11
Introduction of non-linear fracture mechanics in the modelling of a flip-chip component under drop impact11
Advancing packaging technology: computational fluid dynamics modeling for capillary underfill encapsulant in multi-chip heterogenous packages11
Exploring porosity effects of on mechanical behavior of sintered nanosilver for double-sided cooling packaging of high-power devices: a multiscale modeling10
Improved performance and long-term reliability of copper paste in electronic packaging by adding copper-coated Si particles9
Inhibition mechanism of palladium on intermetallic compounds in Au–Al bonding under high temperature storage9
Optimizing stencil printing parameters for multiple quality characteristics and diverse packages using a hybrid neural network and linear programming approach8
A comparative study of the mechanical properties of sintered submicron and micron Cu8
Effect of PVD-coated wall aperture roughness on the life span of fine-pitch stencil printing7
Chip warpage and stress analysis in power modules of different substrate configurations7
Influence of doping Si 3 N 4 nanoparticles on the properties and microstructure of Sn58Bi solder f7
Effects of Ni addition on wettability and interfacial microstructure of Sn-0.7Cu-xNi solder alloy7
Investigation of moisture-induced crack propagation in the soft-termination multi-layer ceramic capacitor during thermal reflow process6
A comparative study of conventional reflow and microwave hybrid heating reflow of Sn-3.0Ag-0.5Cu/Cu solder joints6
L-shaped epoxy reinforcement optimization for vibration reliability of microspring array pins in aerospace large-scale integrated circuits6
Warpage optimization of memory-computing integrated chiplets with 2.5D packaging subjected to electrical-thermal-vibration multistress coupling6
Study on the interfacial reactions between In-Ag alloys and electroless nickel-immersion gold metallization5
AI-Driven cross-scale modeling for SiP thermo-mechanical simulation5
A review: effect of copper percentage solder alloy after laser soldering4
The preparation and wettability of the Sn-9Zn-2.5Bi-1.5In solder paste for SMT process and high shear ball performance4
A temperature control method of hot-bar soldering based on extended Kalman filter4
Reliability analysis of TSV silicon perforated structures under thermal cyclic loading4
Numerical modelling of the delamination in multi-layered ceramic capacitor during the thermal reflow process4
Multi-parameter synergistic optimization and sintering densification of EHD-printed silver nanoparticle ink on alumina ceramic substrates4
Formation and growth mechanism of thin Cu6Sn5 films in Sn/Cu and Sn-0.1AlN/Cu structures using laser heating4
Microstructure, interface and shear strength on Sn-based solder joints induced from the change on solder size4
Study on reaction behavior of Sn37Pb/Ni- x Cu solid-liquid interface and mechanical properties of soldered joints4
Role of Cu percentage in the Sn-xCu alloy on the mechanical performance at Sn-xCu/ENIG interface produced by laser soldering4
Image segmentation on void regional formation in the flip-chip underfilling process by comparing YOLO and mask RCNN4
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