Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 13. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-06-01 to 2025-06-01.)
ArticleCitations
Multiphysics Coupling in IGBT Modules: A Review100
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs42
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components28
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer25
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling21
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation19
Converging Jet Impingement for Enhanced Liquid Cooling16
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling16
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis15
Hybrid Bonding for Ultra-High-Density Interconnect15
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics14
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits14
Special Issue Dedicated to Professor Avram Bar-Cohen13
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