Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)
ArticleCitations
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers95
A Review of Mechanism and Technology of Hybrid Bonding34
Viability of Cryogenic Cooling to Reduce Processor Power Consumption24
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation23
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing18
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer17
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components16
Hybrid Substrates for Heterogeneous Integration16
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope15
Convection Cooling of Power Electronics Operating in Deep-Space13
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling13
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics12
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging12
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