Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)
ArticleCitations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components39
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs29
Multiphysics Coupling in IGBT Modules: A Review20
Converging Jet Impingement for Enhanced Liquid Cooling18
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling18
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials16
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits15
Hybrid Bonding for Ultra-High-Density Interconnect15
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics14
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation12
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current12
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis12
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