Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 13. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-05-01 to 2024-05-01.)
ArticleCitations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms58
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging39
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging35
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions29
State of the Art of Lead-Free Solder Joint Reliability28
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling25
A System to Package Perspective on Transient Thermal Management of Electronics25
A Review On Transient Thermal Management of Electronic Devices24
Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules17
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling15
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics15
Underfill Flow in Flip-Chip Encapsulation Process: A Review15
A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages15
High-Performance Planar Thermal Diode With Wickless Components13
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks13
0.022818088531494