Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 12. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)
ArticleCitations
Multiphysics Coupling in IGBT Modules: A Review47
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components34
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs23
Converging Jet Impingement for Enhanced Liquid Cooling22
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling19
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials18
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation17
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis16
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics15
Hybrid Bonding for Ultra-High-Density Interconnect14
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits13
Evaluation of phase transformation on boron decorated Sn-1.5Ag-0.7 Cu joined Cu pillar for packaging connection12
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