Journal of Electronic Packaging

Papers
(The H4-Index of Journal of Electronic Packaging is 13. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)
ArticleCitations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components103
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs46
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer33
Multiphysics Coupling in IGBT Modules: A Review27
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation23
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling21
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis20
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling20
Hybrid Bonding for Ultra-High-Density Interconnect17
Converging Jet Impingement for Enhanced Liquid Cooling17
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics17
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits17
Three Decades of Thermal Management Research at DARPA14
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?13
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