Journal of Electronic Packaging

Papers
(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)
ArticleCitations
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers95
A Review of Mechanism and Technology of Hybrid Bonding34
Viability of Cryogenic Cooling to Reduce Processor Power Consumption24
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation23
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing18
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer17
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components16
Hybrid Substrates for Heterogeneous Integration16
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope15
Convection Cooling of Power Electronics Operating in Deep-Space13
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling13
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics12
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging12
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package11
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges11
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging11
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds10
Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform10
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods10
Multiphysics Coupling in IGBT Modules: A Review9
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications9
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs8
Interfacial Fracture Caused by Electromigration at Copper Interconnects8
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks8
Acoustic Characterization of Integrated Circuits During Operation8
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate7
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling7
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers7
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation7
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation7
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads7
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation7
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology6
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation6
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model6
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals6
Hybrid Bonding for Ultra-High-Density Interconnect5
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches5
Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging5
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits4
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling4
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics4
Influence of Laser Soldering Temperatures on Through-Hole Component4
Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy4
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies4
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids4
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots4
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging4
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core4
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation3
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging3
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations3
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)3
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling3
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints3
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities3
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions3
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling3
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors3
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies3
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology3
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters3
Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 Solder3
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes3
Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Ele3
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages3
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis3
Converging Jet Impingement for Enhanced Liquid Cooling3
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads3
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes3
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate3
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics2
Applications, Design Methods, and Challenges for Additive Manufacturing of Thermal Solutions for Heterogeneous Integration of Electronics2
Development and Validation of a Transient Heat Transfer Model for Evaluating Thermal Management Solutions for Packaging Next-Generation Smart City Infrastructure Devices2
Correlation Study on Voiding in Underfill of Large Quantity Ball Grid Array Chip Using Machine Learning2
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat2
Design and Fabrication of Leadless Package Structure for Pressure Sensors2
Optimization of Micropillars Electroplating Bonding Processes and Additives2
Virtual Testbed for Economical and Reliability Analysis of Battery Thermal Management Control Strategies2
Interface Reliability Modeling of Coaxial Through Silicon Via Based on WOA-BP Neural Network2
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current2
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures2
Fatigue Testing of Copper Nanoparticle-Based Joints and Bonds2
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages2
Development of a Thermal Metrology Standard for Evaluation of Cold Plate Thermal Resistance as a Performance Metric2
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors2
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics2
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules2
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions2
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers2
Reviewer's Recognition2
Reviewer's Recognition2
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging2
A Hybrid Antenna in Package Solution Using FOWLP Technology2
Special Issue Dedicated to Professor Avram Bar-Cohen2
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers2
Viscoelastic Influence on the Board Level Assessment of Wafer Level Packages Under Drop Impact and Under Thermal Cycling1
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network1
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model1
Improving Ambient Contrast Ratio of Display Device at Oblique Angle Using a Fe3O4-Magnetic Particle Chained Pillar Array Structure1
Characterization of a Rack-Level Thermosyphon-Based Cooling System1
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink1
An Automatic Finite Element Method-Boundary Element Method Coupling Method for Elastic–Plastic Problems of Multiscale Structures in Electronic Packaging1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics1
Transient Liquid Phase Bond Acceleration Using Copper Nanowires1
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?1
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days1
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review1
Remaining Useful Life Estimation and Prognostication of SAC305 Printed Circuit Boards for Dynamic Conditions of Temperature and Vibration Loads1
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink1
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces1
Multilayer Conductive Metallization With Offset Vias Using Aerosol Jet Technology1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications1
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks1
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model1
Application of the Nonlinear Fracture Mechanics Parameter ΔT* to Wire-Liftoff Lifetime Estimation of Power Modules at Elevated Temperatures1
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature1
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique1
Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules1
Microbead Encapsulation for Protection of Electronic Components1
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]1
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications1
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging1
The Discussion About the Identification of the Anand Model Parameters and Two Alternative Identification Methods1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module1
A Comparison of Biaxial Bending Strength of Thin Silicon Dies in the Ball-on-Ring and PoEF Tests1
Electrochemical Additive Manufacturing-Based Design of a Heat Sink for Single-Phase Natural Convection Immersion Cooling Application1
Module-Level Thermal Interface Material Degradation in HALT1
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