OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-06-01 to 2025-06-01.)

Article	Citations
Multiphysics Coupling in IGBT Modules: A Review	100
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	42
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	28
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	25
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	21
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	19
Converging Jet Impingement for Enhanced Liquid Cooling	16
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	16
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	15
Hybrid Bonding for Ultra-High-Density Interconnect	15
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	14
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	14
Special Issue Dedicated to Professor Avram Bar-Cohen	13
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	12
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	11
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	11
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	10
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	10
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	10
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	9
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control	9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	9
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	8

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8
High-Performance Planar Thermal Diode With Wickless Components	8
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Special Section on InterPACK2021	8
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Underfill Flow in Flip-Chip Encapsulation Process: A Review	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	7
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Sign	7
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	6
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	5
Convection Cooling of Power Electronics Operating in Deep-Space	5
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
The Impact of Die Tilt on the Reliability of Packages with Dies Bonded to Substrates Using Silver Sintered Material	4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	4
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures	4
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	4
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages	4
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	4
Reviewer's Recognition	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	3
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning	3
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers	3
Special Issue on InterPACK2023	3
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure	3
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	3
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	3
Special Issue on InterPACK2020	3
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	3
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning	3

Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment	3
Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package	3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	3
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	3
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits	3
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	3
Acoustic Characterization of Integrated Circuits During Operation	3
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel	3
System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile	3
Microbead Encapsulation for Protection of Electronic Components	3
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	3
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	3
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	3
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection	3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	2
Interfacial Fracture Caused by Electromigration at Copper Interconnects	2
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	2
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink	2
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft	2
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging	2
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors	2
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	2
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	2
Hybrid Substrates for Heterogeneous Integration	2
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	2
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging	2
Mandrel Bend Test of Screen-Printed Silver Conductors	2
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks	2
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability	2
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	2
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies	2
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	2
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	2
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator	2
Recent Developments in Air Pumps for Thermal Management of Electronics	2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage	2
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading	2
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat	1
Submillimeter Reflector for Edge-Emitting Laser Package	1
Special Issue on InterPACK2022	1
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	1
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	1
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling	1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics	1
Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties	1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model	1
High Gain Compact Antenna-in-Package Solution Using Like Mushroom Electromagnetic Band Gap for Industrial, Scientific, and Medical Band	1
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms	1
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter	1
Multifunctional Magnetic Nanocomposite Encapsulant for Electromagnetic Interference Shielding in Power Electronics	1
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging	1
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review	1
Characterization of a Rack-Level Thermosyphon-Based Cooling System	1
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	1
Electrothermal Analysis of System in Package for Aerospace Application	1
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging	1
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method	1
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids	1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications	1
Study on the Microstructure Evolution and Mechanical Properties of Cu/Cu41Sn11/Cu Solder Joint During High-Temperature Aging	1
Coupled Electrical–Thermal–Fluidic Multi-Physics Analysis of Through Silicon Via Pin Fin Microchannel in the Three-Dimensional Integrated Circuit	1
The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch	1
A Hybrid Antenna in Package Solution Using FOWLP Technology	1
Prognostics and Health Management Features for Large Circuit Boards to Be Implemented Into Electric Drivetrain Applications	1
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling	1
Liquid-Cooled Heat Sink Optimization for Thermal Imbalance Mitigation in Wide-Bandgap Power Modules	1
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition	1
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers	1
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska	1
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling	1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	1
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model	1
A Reduced Model Based on Proper Generalized Decomposition for the Fast Analysis of IGBT Power Modules Lifetime	1
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions	1
Experimental and Numerical Investigation of Electromigration Behavior of Printed Silver Wire Under High Current Density	1
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	1
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life	1