OOIR: Observatory of International Research

Papers

(The median citation count of Journal of Electronic Packaging is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)

Article	Citations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	103
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	46
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	33
Multiphysics Coupling in IGBT Modules: A Review	27
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	23
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	21
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	20
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	20
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	17
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	17
Hybrid Bonding for Ultra-High-Density Interconnect	17
Converging Jet Impingement for Enhanced Liquid Cooling	17
Three Decades of Thermal Management Research at DARPA	14
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	13
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	12
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	12
Special Issue Dedicated to Professor Avram Bar-Cohen	11
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	10
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	10
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	10
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	9
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control	9
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	9
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	9

Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	8
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Sign	8
Special Section on InterPACK2021	8
Underfill Flow in Flip-Chip Encapsulation Process: A Review	8
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	8
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	8
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
High-Performance Planar Thermal Diode With Wickless Components	8
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	7
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	7
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	7
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	7
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	7
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	6
Convection Cooling of Power Electronics Operating in Deep-Space	6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	6
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	6
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	5
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	5
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	5
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	5
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	5
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	5
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	5
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	5
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages	4
Reviewer's Recognition	4
Microbead Encapsulation for Protection of Electronic Components	4
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	4
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	4
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature	4
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Transient Liquid Phase Bond Acceleration Using Copper Nanowires	4
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	4
Special Issue on InterPACK2023	4
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component	3

Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	3
Validation of the Critical Strain-Based Methodology for Evaluating the Mechanical Safety of Ball Grid Array Solder Joints in a Launch Random Vibration Environment	3
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	3
Special Issue on InterPACK2020	3
On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages	3
System and Component Level Risk Assessment for SiC MOSFET Based Inverter for Traction Application at High Coolant Temperatures and Off-Road Mission Profile	3
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection	3
Stochastic Finite Element Thermal Analysis of a Ball Grid Array Package	3
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	3
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies	3
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel	3
Acoustic Characterization of Integrated Circuits During Operation	3
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning	3
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink	3
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits	3
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning	3
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	3
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	3
Hybrid Substrates for Heterogeneous Integration	3
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers	3
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	3
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique	3
Interfacial Fracture Caused by Electromigration at Copper Interconnects	3
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure	3
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	2
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator	2
Recent Developments in Air Pumps for Thermal Management of Electronics	2
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling	2
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging	2
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors	2
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink	2
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	2
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	2
Micro Solder Joint Reliability and Warpage Investigations of Extremely Thin Double-Layered Stacked-Chip Packaging	2
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	2
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method	2
Electrothermal Analysis of System in Package for Aerospace Application	2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage	2
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks	2
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging	2
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	2
Mandrel Bend Test of Screen-Printed Silver Conductors	2
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability	2
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	2
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling	2
Application of Shape Factor to Mechanical Behavior of Thermal Interface Pads and Putties	2
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading	2
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft	2