Journal of Electronic Packaging

Papers
(The median citation count of Journal of Electronic Packaging is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)
ArticleCitations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components39
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs29
Multiphysics Coupling in IGBT Modules: A Review20
Converging Jet Impingement for Enhanced Liquid Cooling18
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling18
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials16
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits15
Hybrid Bonding for Ultra-High-Density Interconnect15
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics14
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation12
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current12
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis12
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model11
Optimization of Micropillars Electroplating Bonding Processes and Additives11
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics10
Three Decades of Thermal Management Research at DARPA10
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm9
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials9
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]9
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems9
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review8
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications8
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks8
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging8
Special Section on InterPACK20217
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network7
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging6
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints6
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform6
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics6
Uncertainty quantification for compressible micro-interconnects in replaceable integrated chiplet assembly under hypergravity6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification6
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers5
Effective Constitutive Relations for Sintered Nano Copper Joints5
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application5
Convection Cooling of Power Electronics Operating in Deep-Space5
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope5
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material5
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling5
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films5
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation4
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis4
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics4
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics3
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes3
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core3
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes3
Special Issue on InterPACK20203
Model Establishment of Chip Air Cooling Process and Its Proportional Integral Differential Tuning3
Liquid-to-Air Coolant Distribution Units Performance and Considerations for Server Rooms Upgrade With Conventional Air Conditioning3
Evolution of Anand Parameters for Thermally Aged Sn-Ag-Cu Lead-Free Alloys at Low Operating Temperature3
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures3
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions3
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics3
Automotive Silicon Carbide Power Module Cooling With a Novel Modular Manifold and Embedded Heat Sink3
Surrogate Modeling for Creep Strain-Based Fatigue Prediction of a Ball Grid Array Component3
Methodology to Characterize Row Manifolds for High Power Direct to Chip Liquid Cooling Data Centers3
On the Assumption Used for the Time-Dependent Warpage Analysis of Encapsulated Semiconductor Packages3
Review on Fan-Out Packaging of Light-Emitting Diodes: Process Route, Manufacturing Reliability, and Performance Optimization3
Reviewer's Recognition3
Transient Liquid Phase Bond Acceleration Using Copper Nanowires3
Special Issue on InterPACK20233
A Time Frequency Domain Based Approach for Ball Grid Array Solder Joint Fatigue Analysis Using Global Local Modeling Technique3
Temperature-Humidity-Bias Testing and Life Prediction Modeling for Electrochemical Migration in Aerosol-Jet Printed Circuits3
Effect of Wavy Wall and Plate Bifurcations on Heat Transfer Enhancement in Microchannel3
Microbead Encapsulation for Protection of Electronic Components3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology2
Heat Transfer Analysis of Supercritical Methane in Microchannels With Different Geometric Configurations on High Power Electromechanical Actuator2
Hybrid Substrates for Heterogeneous Integration2
Transient Nature of Flight and Its Impact on Thermal Management for All Electric Aircraft2
Evaluation of Phase Transformation on Boron Decorated Sn-1.5Ag-0.7 Cu Joined Cu Pillar for Packaging Connection2
Mandrel Bend Test of Screen-Printed Silver Conductors2
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers2
Advancing in Data Centers Thermal Management: Experimental Assessment of Two-Phase Liquid Cooling Technology2
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots2
Process Recipe and Functional Circuitry Performance on Aerosol Jet Printed Water-Based Silver Ink2
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing2
Effects of Thermal-Moisture Coupled Field on Delamination Behavior of Electronic Packaging2
Acoustic Characterization of Integrated Circuits During Operation2
A Comprehensive Study on Characterization of Residual Stress of Build-Up Layer and Prediction of Chip Warpage2
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers2
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors2
Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies2
Research on Reliability of Ni/Sn/Cu(Ni) Copper Pillar Bump Under Thermoelectric Loading2
Interfacial Fracture Caused by Electromigration at Copper Interconnects2
Thermal Management of 3D Chips and Monolithic Integrated Circuits Using Phase Change Materials - Si/Cu Composites2
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink2
Bio-Analysis of Cross-Mixed Coolants in High-Powered Liquid-Cooled Data Center2
Characterization of Fatigue Performance for Bulk Epoxy Molding Compound in Sustained High Temperature Exposure up to 1 Year Aging2
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska1
Effect of Differently Shaped Solder Joints of Chip Resistor on Fatigue Life1
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress-Atomic Coupled Model1
Multi-Physics Models of a Low-Voltage Power Semiconductor System-in-Package for Automotive Applications1
ThermoDynaSMT: A Physics-Informed Machine Learning Model for Component Displacement in Surface Mount Technology1
Recent Advances and Trends in Chiplet Design and Heterogeneous Integration Packaging1
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter1
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities1
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation1
Electrothermal Analysis of System in Package for Aerospace Application1
Phase Change Material Behavior in Finite Thickness Slabs Under a Step Response Heat1
Thermomechanical Characterization and Geometric Optimization of Multi-Layer Cantilever Probe Card Needles for Wafer Testing1
Characterization of a Rack-Level Thermosyphon-Based Cooling System1
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals1
The Resistor Network Approach to Modeling Screen-Printed Silver Ink Under Uniaxial Stretch1
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers1
Flow Characterization of Capillary Underfill in Multi-Chip Heterogenous Integration Using Computational Fluid Dynamics1
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling1
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging1
Leadfree SnAgCu Solder Materials Characterization at High Strain Rates at Low Test Temperatures and Drop and Shock Simulation Using Input-G Method1
Thermal Spreading Resistance of Surface Adjacent Localized Heating-Induced Size Effects in Semiconductors1
Investigation of the Impacts of Solder Alloy Composition and Temperature Profile on Fatigue Life of Ball Grid Array Solder Joints Under Accelerated Thermal Cycling1
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids1
Submillimeter Reflector for Edge-Emitting Laser Package1
Reliability Assessment and Multiphysics Simulation of Additively Printed Wearable Humidity Sensor With Supercapacitive Material for Astronaut in Extreme Condition1
Numerical and Experimental Investigation of Effects of Porous Layer on Cooling of Electronic Components1
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module1
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches1
Mitigation of Boiling-Induced Thermal Degradation Using Microporous Nickel Inverse Opals Structures1
Sequential Versus Concurrent Effects in Combined Stress Solder Joint Reliability1
Experimental and Numerical Investigations of Intermittence for Electronic Connectors Subjected to Mechanical Shocks1
0.44605994224548