OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-06-01 to 2025-06-01.)

Article	Citations
Multiphysics Coupling in IGBT Modules: A Review	100
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	42
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	28
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	25
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	21
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	19
Converging Jet Impingement for Enhanced Liquid Cooling	16
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	16
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	15
Hybrid Bonding for Ultra-High-Density Interconnect	15
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	14
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	14
Special Issue Dedicated to Professor Avram Bar-Cohen	13
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	12
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	11
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	11
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	10
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	10
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	10
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	9
Experimental Study and Mitigation of Pressure Drop Oscillation Using Active Control	9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	9
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	8

Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8
High-Performance Planar Thermal Diode With Wickless Components	8
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Special Section on InterPACK2021	8
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Underfill Flow in Flip-Chip Encapsulation Process: A Review	7
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	7
Reliability Analysis of Solder Joints on Rigid-Flexible Printed Circuit Board for MEMS Pressure Sensors Under Combined Temperature Cycle and Vibration Loads With Continuously Monitored Electrical Sign	7
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	6
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	5
Convection Cooling of Power Electronics Operating in Deep-Space	5
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	5
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
The Impact of Die Tilt on the Reliability of Packages with Dies Bonded to Substrates Using Silver Sintered Material	4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	4
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures	4
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	4
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Correlation Studies Between Laser Ultrasonic Inspection Data and Finite-Element Modeling Results in Evaluation of Solder Joint Quality in Microelectronic Packages	4
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	4
Reviewer's Recognition	4