OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-05-01 to 2024-05-01.)

Article	Citations
Spray Cooling on Enhanced Surfaces: A Review of the Progress and Mechanisms	58
Applications and Impacts of Nanoscale Thermal Transport in Electronics Packaging	39
Recent Advances in Thermal Metamaterials and Their Future Applications for Electronics Packaging	35
Electric-Drive Vehicle Power Electronics Thermal Management: Current Status, Challenges, and Future Directions	29
State of the Art of Lead-Free Solder Joint Reliability	28
A System to Package Perspective on Transient Thermal Management of Electronics	25
A Review of Thermo-Hydraulic Performance of Metal Foam and Its Application as Heat Sinks for Electronics Cooling	25
A Review On Transient Thermal Management of Electronic Devices	24
Design, Analysis, Comparison, and Experimental Validation of Insulated Metal Substrates for High-Power Wide-Bandgap Power Modules	17
Device-Level Multidimensional Thermal Dynamics With Implications for Current and Future Wide Bandgap Electronics	15
Underfill Flow in Flip-Chip Encapsulation Process: A Review	15
A Hybrid Finite Element Modeling: Artificial Neural Network Approach for Predicting Solder Joint Fatigue Life in Wafer-Level Chip Scale Packages	15
Experimental Study of Flexible Electrohydrodynamic Conduction Pumping for Electronics Cooling	15
Minimizing the Effects of On-Chip Hotspots Using Multi-Objective Optimization of Flow Distribution in Water-Cooled Parallel Microchannel Heatsinks	13
High-Performance Planar Thermal Diode With Wickless Components	13
High Strain Rate Mechanical Properties of SAC-Q Solder for Extreme Temperatures After Exposure to Isothermal Aging Up to 90 Days	12
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	12
Advancement of Chip Stacking Architectures and Interconnect Technologies for Image Sensors	11
Modular Heat Sinks for Enhanced Thermal Management of Electronics	11
Fatigue Properties and Microstructure of SnAgCu Bi-Based Solder Joint	11
Compact Transient Thermal Model of Microfluidically Cooled Three-Dimensional Stacked Chips With Pin-Fin Enhanced Microgap	11
Additive Manufactured Impinging Coolant, Low Electromagnetic Interference, and Nonmetallic Heat Spreader: Design and Optimization	10
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	10
The Doping Dependence of the Thermal Conductivity of Bulk Gallium Nitride Substrates	9
Study of a Lab-Scale Organic Rankine Cycle for the Ultra-Low-Temperature Waste Heat Recovery Associated With Data Centers	9

Experimental Characterization of Two-Phase Cold Plates Intended for High-Density Data Center Servers Using a Dielectric Fluid	9
Role of Nominal Stress State on Cyclic Fatigue Durability of SAC305 Grain-Scale Solder Joints	9
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods	9
Validation and Parametric Investigations of an Internal Permanent Magnet Motor Using a Lumped Parameter Thermal Model	9
Minimizing Temperature Nonuniformity by Optimal Arrangement of Hotspots in Vertically Stacked Three-Dimensional Integrated Circuits	9
High Strain Rate Mechanical Properties of SAC-Q With Sustained Elevated Temperature Storage at 100 °C	9
Comparative Study on Power Module Architectures for Modularity and Scalability	8
Experimental Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	8
Thermomechanical Degradation of Thermal Interface Materials: Accelerated Test Development and Reliability Analysis	8
Improving Ambient Contrast Ratio and Color Uniformity of Mini Full Color Light-Emitting Diodes Using an SiO2/Graphite Bilayered Packaging Structure	8
Fatigue Life of Sn3.0Ag0.5Cu Solder Alloy Under Combined Cyclic Shear and Constant Tensile/Compressive Loads	8
Influence of Carbon Nanoparticles Additives on Nanosilver Joints in LTJT Technology	7
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	7
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging	7
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	7
Fabrication and Reliability Assessment of Cu Pillar Microbumps With Printed Polymer Cores	7
Nearly Efficiency-Droop-Free AlGaN-Based Deep-Ultraviolet Light-Emitting Diode Without Electron-Blocking Layer	7
Design, Development, and Characterization of a Flow Control Device for Dynamic Cooling of Liquid-Cooled Servers	7
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	7
Flow-Controlled Spray Cooling Approaches for Dynamic Thermal Management	7
Thermal Performance of Metal Foam Heat Sink With Pin Fins for Nonuniform Heat Flux Electronics Cooling	7
Ultra-Compact Microscale Heat Exchanger for Advanced Thermal Management in Data Centers	7
System-Level Thermal Management and Reliability of Automotive Electronics: Goals and Opportunities Using Phase-Change Materials	7
Concurrent Thermal and Electrical Property Effects of Nano-Enhanced Phase Change Material for High-Voltage Electronics Applications	7
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	6
Effects of Gaseous and Particulate Contaminants on Information Technology Equipment Reliability—A Review	6
Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	6
A New Correlation for Subcooled Flow Boiling Heat Transfer in a Vertical Narrow Microchannel	6
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	6
Strength and Isothermal Fatigue Resistance of SnBi/SnAgCu Joints Reflowed at Low Temperatures	5
Numerical Modeling of the Wave Soldering Process and Experimental Validation	5
Evolution of Anand Parameters With Elevated Temperature Aging for SnAgCu Lead-free Alloys	5
Additively Printed Multilayer Substrate Using Aerosol-Jet Technique	5
Interfacial Behavior of Flux Residues and Its Impact on Copper/Underfill Adhesion in Microelectronic Packaging	5
Recent Developments in Air Pumps for Thermal Management of Electronics	5
Process Capability of Aerosol-Jet Additive Processes for Long-Runs Up to 10-Hours	5
Process Development for Printed Copper With Surface Mount Devices on Inkjet Metallization	4
Parametric Effects of Heater Size, Contact Angle, and Surrounding Vessel Size on Pool Boiling Critical Heat Flux From Horizontal Surfaces	4
Parametric Effects on Pool Boiling Heat Transfer and Critical Heat Flux: A Critical Review	4
Multi-Level Embedded Three-Dimensional Manifold Microchannel Heat Sink of Aluminum Nitride Direct Bonded Copper for the High-Power Electronic Module	4
Electro-Thermal Codesign Methodology of an On-Board Electric Vehicle Charger	4
Reduced Order Design Optimization of Liquid Cooled Heat Sinks	4
A New Structure of Ceramic Substrate to Reduce the Critical Electric Field in High Voltage Power Modules	4
Thermal Analysis and Optimization of Light-Emitting Diodes Filament Lamp	4
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	4
A Surface Energy Approach to Developing an Analytical Model for the Underfill Flow Process in Flip-Chip Packaging	4
Scattering Nanoparticles-Induced Reflection Effect for Enhancing Optical Efficiency of Inverted Quantum Dots-Light-Emitting Diodes Combined With the Centrifugation Technique	4
Application of Alumina-Based Ceramic Paste for High-Temperature Electronics Packaging	4