OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)

Article	Citations
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	39
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	29
Multiphysics Coupling in IGBT Modules: A Review	20
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	18
Converging Jet Impingement for Enhanced Liquid Cooling	18
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	16
Hybrid Bonding for Ultra-High-Density Interconnect	15
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	15
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	14
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	12
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	12
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	12
Optimization of Micropillars Electroplating Bonding Processes and Additives	11
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	11
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High-Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	10
Three Decades of Thermal Management Research at DARPA	10
Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	9
Advanced IGBT Module Design for Enhanced Overcurrent Capability Using Phase Change Materials	9
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	9
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	9
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	9
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	8
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	8
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8

Special Section on InterPACK2021	7
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	7
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	7
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	6
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
Uncertainty quantification for compressible micro-interconnects in replaceable integrated chiplet assembly under hypergravity	6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	6
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	6
Convection Cooling of Power Electronics Operating in Deep-Space	5
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	5
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	5
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	5
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	5
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	5
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	5
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	5
Effective Constitutive Relations for Sintered Nano Copper Joints	5
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	5
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	4
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	4
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Liquid to Liquid In-Row Coolant Distribution Unit Characterization for High Power Data Center	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4