OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)

Article	Citations
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	33
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	25
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	21
Multiphysics Coupling in IGBT Modules: A Review	20
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	18
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	18
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	17
Hybrid Bonding for Ultra-High-Density Interconnect	17
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	14
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	14
Converging Jet Impingement for Enhanced Liquid Cooling	14
Tonal and Broadband Noise-Reducing Heat Sinks Using Long-Neck Helmholtz Resonator Arrays and Corrugated Periodic Cellular Materials	12
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	11
Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model	11
Damage Analysis in Ag Nanoparticle Interconnect Line Under High-Density Electric Current	10
Special Issue Dedicated to Professor Avram Bar-Cohen	10
Computational Framework for Computational Fluid Dynamics Analysis of Loop Thermosiphon Based Embedded Cooling Systems	9
Performance and Reliability Comparison of Thermoformed, Screen-Printed Structures on Polycarbonate and High Impact Polystyrene Substrates Under Sustained High Temperatures for In-Mold Electronics	9
Anand Model Constants of Sn–Ag–Cu Solders: What Do They Actually Mean?	9
Process-Factor Optimization of Small-Area Sintered Interconnects for Power Electronics Applications	9
Three Decades of Thermal Management Research at DARPA	9
Erratum: “Understanding Thermal Lagging Behaviors in Thermoelectric Elements With the Dual-Phase-Lag Model” [ASME J. Electron. Packag., 2022, 144(3), p. 031011; DOI: 10.1115/1.4052948]	9
Numerical Analysis of Flow and Heat Transfer Characteristics of Lattice-Based Compact Heat Sinks	9
Optimization of Micropillars Electroplating Bonding Processes and Additives	9
Failure Mechanisms Driven Reliability Models for Power Electronics: A Review	8

Printed Circuit Board Defect Image Recognition Based on the Multimodel Fusion Algorithm	8
Point-Contact Bonding of Integrated Three-Dimensional Manifold Microchannel Cooling Within Direct Bonded Copper Platform	8
Effect of Dispensing Type on Void Formation Using Convolutional Neural Network	8
High-Performance Planar Thermal Diode With Wickless Components	8
Mechanical Properties of Doped Solder SAC-Q for High Strain Rate Testing at Extreme Surrounding Temperatures for 6 Months of Isothermal Aging	8
Optimal Design of Thermal Cycling Reliability for Plastic Ball Grid Array Assembly Via Finite Element Method and Taguchi Method	7
Power Law Creep Behavior Model of Third Generation Lead-Free Alloys Considering Isothermal Aging	7
Experimental Analysis and Modeling of a Novel Thermosyphon System for Electronics Cooling	7
Special Section on InterPACK2021	7
Fracture Behavior and Reliability of Low-Silver Lead-Free Solder Joints	6
Effective Constitutive Relations for Sintered Nano Copper Joints	6
Figure of Merit-Based Optimization Approach of Phase Change Material-Based Composites for Portable Electronics Using Simplified Model	6
A Novel Design of Rack Mount Server Thermal Simulator: Design, Assembly, and Experimental Verification	6
Analysis and Modeling of a SiC Based Buck Converter and Its Effects in an Electric Vehicle Application	6
Heat Dissipation Design Based on Topology Optimization and Auxiliary Materials	6
Variable Area Jet Impingement for Enhanced Junction Temperature Control of High-Power Electronics	6
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	6
Experimental Method to Measure High-Temperature Hygroscopic Swelling in Epoxy Mold Compounds and Dielectric Build-Up Films	6
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	5
Convection Cooling of Power Electronics Operating in Deep-Space	5
Liquid To Liquid In-Row Coolant Distribution Unit Characterization For High Power Data Center	5
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	5
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	5
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	5
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	5
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	5
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	5
The Impact of Die Tilt on the Reliability of Packages With Dies Bonded to Substrates Using Silver Sintered Material	5
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	5
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	5
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	4
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	4
Effect of U-Flex-to-Install and Dynamic U-Flexing on Li-Ion Battery State of Health Degradation Subjected to Varying Fold Orientations, Folding Speeds, Depths of Charge, C-Rates, and Temperatures	4
HFE7500 Coolant Dielectric Strength Augmentation Under Convective Conditions	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	4
Cold Gas Spraying Copper Metal on AlN Ceramics as an Alternative to Thick Direct Bond Copper Substrates for Power Electronics	4
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	4
A Review of the Cu Chemical Mechanical Planarization Process in Hybrid Bonding Technology	4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Simplified and Detailed Analysis of Data Center Particulate Contamination at Server and Room Level Using Computational Fluid Dynamics	4
Reviewer's Recognition	4