OOIR: Observatory of International Research

Papers

(The TQCC of Journal of Electronic Packaging is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)

Article	Citations
A Transient Resistance/Capacitance Network-Based Model for Heat Spreading in Substrate Stacks Having Multiple Anisotropic Layers	95
A Review of Mechanism and Technology of Hybrid Bonding	34
Viability of Cryogenic Cooling to Reduce Processor Power Consumption	24
Microstructural Evolution of Viscoelastic Properties of Underfills Under Sustained High Temperature Operation	23
Prediction of Board Level Pad Cratering Strength With the Predefined Failure Criteria From Joint Level Testing	18
Guidelines for Designing Micropillar Structures for Enhanced Evaporative Heat Transfer	17
A Contribution to Printed Circuit Boards' Miniaturization by the Vertical Embedding of Passive Components	16
Hybrid Substrates for Heterogeneous Integration	16
Numerical Study of Two-Stage Temperature Control Strategy for High-Temperature Stability of Satellite-Borne Fiber Optic Gyroscope	15
Convection Cooling of Power Electronics Operating in Deep-Space	13
Evaluating the Reliability of Passive Server Components for Single-Phase Immersion Cooling	13
Optimized Design of Various Ag Decorated Sn-xAg-Cu0.7 Solder Bump on Cycling Fatigue Reliability for Wafer-Level Chip Scale Packaging	12
A Novel Package-Integrated Cyclone Cooler for the Thermal Management of Power Electronics	12
Research Status and Progress on Non-Destructive Testing Methods for Defect Inspection of Micro-Electronic Packaging	11
Analytical Multi-Parametric Design Optimization for the Miniaturization of Flip-Chip Package	11
Simultaneous Characterization of Both Coefficients of Thermal Expansion and Thermal Warpages of Flip-Chip Packages With a Cap Using Strain Gauges	11
Sensitivity Coefficient-Based Inverse Heat Conduction Method for Identifying Hot Spots in Electronics Packages: A Comparison of Grid-Refinement Methods	10
Inelastic Deformation of Copper Nanoparticle Based Joints and Bonds	10
Forward Kinematics Analysis of High-Precision Optoelectronic Packaging Platform	10
Multiphysics Coupling in IGBT Modules: A Review	9
Numerical and Experimental Investigation of a Volumetric Resistance Blower Performance and Its Optimization for Portable Computing Device Applications	9
Performance Analysis of Liquid-to-Air Heat Exchanger of High-Power Density Racks	8
Acoustic Characterization of Integrated Circuits During Operation	8
Hybrid Monte Carlo-Diffusion Studies of Modeling Self-Heating in Ballistic-Diffusive Regime for Gallium Nitride HEMTs	8
Interfacial Fracture Caused by Electromigration at Copper Interconnects	8

Numerical Study of Large Footprint (24 × 24 mm2) Silicon-Based Embedded Microchannel Three-Dimensional Manifold Coolers	7
Simultaneous Measurement of Temperature and Strain in Electronic Packages Using Multiframe Super-Resolution Infrared Thermography and Digital Image Correlation	7
Effect of Different Solder Volumes on the Laser Soldering Process: Numerical and Experimental Investigation	7
Peak Temperature Mitigation of a Multimicrochannel Evaporator Under Transient Heat Loads	7
Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation	7
Performance Analysis of Corrosion Resistant Electroless Nickel-Plated Impinging Computer Numerical Control Manufactured Liquid Cooling Cold Plate	7
Indentation Tests for Sintered Silver in Die-Attach Interconnection After Thermal Cycling	7
Electromigration Analysis of Solder Joints for Power Modules Using an Electrical-Thermal-Stress Coupled Model	6
Grain-Scale Study of SAC305 Oligocrystalline Solder Joints: Anisotropic Elasto-Plastic Constitutive Properties of Single Crystals	6
High Gain and Wideband Antenna-in-Package Solution Using Fan-Out Technology	6
Thomson Effect, Leg Design, Heat Interaction, and Material Impacts on Segmented Thermoelectric Cooler: Insights From Three-Dimensional Simulation	6
Reliability of State-of-Health of the Flexible Li-Ion Batteries Under Various Flexing Conditions and Calendar Aging	5
Hybrid Bonding for Ultra-High-Density Interconnect	5
Assessing the SAC305 Solder Joint Fatigue in Ball Grid Array Assembly Using Strain-Controlled and Stress-Controlled Approaches	5
Experimental Investigation of Boiling Heat Transfer in a Liquid Chamber With Partially Soluble Nanofluids	4
A Comparative Numerical Analysis of Cold Plates for Thermal Management of Chips With Hotspots	4
Machine Learning Analysis of Autonomous Vehicle Sensors Under Extreme Conditions in Alaska	4
Electrochemical Linked to Mechanical Simulation for an Assessment of State-of-Health of Thin-Flexible Li-Ion Batteries on Dynamic Flexing and Calendar Aging	4
Thermal-Hydraulic Characterization of a Thermosyphon Cooling System for Highly Compact Edge MicroDataCenter	4
Impact of Immersion Cooling on Thermomechanical Properties of Halogen-Free Substrate Core	4
Co-Packaged Optics—Heterogeneous Integration of Photonic Integrated Circuits and Electronic Integrated Circuits	4
A Smart Temperature-Regulating Garment for Portable, High-Efficiency and Comfortable Cooling	4
Shear and Fatigue Properties of Lead-Free Solder Joints: Modeling and Microstructure Analysis	4
Investigation of Electromechanical Reliability and Radio Frequency Performance of a Highly Stretchable Liquid Metal Conductor for Wearable Electronics	4
Influence of Laser Soldering Temperatures on Through-Hole Component	4
Microstructure and Properties of Nb Nanoparticles Reinforced Sn–0.7Cu Solder Alloy	4
Numerical and Parametric Investigation of the Effect of Heat Spreading on Boiling of a Dielectric Liquid for Immersion Cooling of Electronics	4
Boiling Enhanced Lidded Server Packages for Two-Phase Immersion Cooling Using Three-Dimensional Metal Printing and Metal Injection Molding Technologies	4
Using a Multi-Inlet/Outlet Manifold to Improve Heat Transfer and Flow Distribution of a Pin Fin Heat Sink	3
Experimental and Numerical Analysis of Data Center Pressure and Flow Fields Induced by Backward and Forward CRAH Technology	3
A Kriging Surrogate Model for Ball Grid Array Electronic Packaging With Stochastic Material and Geometrical Parameters	3
Effect of Cyclic Stress on Electrochemical Corrosion Behavior of SAC305 Solder	3
Extreme Drop Durability of Sintered Silver Traces Printed With Extrusion and Aerosol Jet Processes	3
Publisher's Note: “Dynamic Modeling Framework for Evaluating Electromagnetic-Electro-Thermal Behavior of Power Conversion System During Load Operation” (Cheng, H. C., and Liu, Y. C., 2023, ASME J. Ele	3
Effect of Phase Change Material on Dynamic Thermal Management Performance for Power Electronics Packages	3
Modeling the Thermal-Compression Flip-Chip Process by Finite Element Analysis	3
Converging Jet Impingement for Enhanced Liquid Cooling	3
Understanding the Impact of Data Center Liquid Cooling on Energy and Performance of Machine Learning and Artificial Intelligence Workloads	3
Joint Analysis and Reliability Test of Epoxy-Based Nano Silver Paste Under Different Pressure-Less Sintering Processes	3
Wideband Equivalent Circuit Modeling and Parameter Extraction Method for Through Via in Ceramic Package Substrate	3
Impact of Encapsulated Phase Change Material Additives for Improved Thermal Performance of Silicone Gel Insulation	3
Machine Learning-Based Predictions of Benefits of High Thermal Conductivity Encapsulation Materials for Power Electronics Packaging	3
Electrical Reliability of Flexible Silicon Package Integrated on Polymer Substrate During Repeated Bending Deformations	3
Performance Analysis of a Brazed Plate Heat Exchanger During Condensation of R1233zd(E)	3
Validation and Application of a Finned Tube Heat Exchanger Model for Rack-Level Cooling	3
Incorporating Tensile Stress Into Electromigration Life Prediction for Cu/SAC305/Cu Solder Joints	3
Artificial Intelligence for Power Electronics in Electric Vehicles: Challenges and Opportunities	3
Accelerated Solder Interconnect Testing Under Electromigratory and Mechanical Strain Conditions	3
Chip Level Thermal Performance Measurements in Two-Phase Immersion Cooling	3
High Temperature Degradation Modes Observed in Gallium Nitride-Based Hall-Effect Sensors	3

Design Optimization by Virtual Prototyping Using Numerical Simulation to Ensure Thermomechanical Reliability in the Assembly and Interconnection of Electronic Assemblies