OOIR: Observatory of International Research

Papers

(The median citation count of Microelectronics International is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-06-01 to 2026-06-01.)

Article	Citations
A failure location technology for SiP devices based on TDR nondestructive testing method	22
Publisher’s note	8
The preparation of anisotropic conductive paste and its application in FOB interconnection	8
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding	8
Magnetic alignment technology for wafer bonding	7
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	7
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles	6
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study	6
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process	5
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power	5
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications	5
A modal analysis based optimal mounting support locations of a printed circuit board	5
Study of the electronic transport performance of ZnO-SiO₂ film: the construction of grain boundary barrier	5
Effects of interface cracks on reliability of surface mount technology interconnection in service environment	4
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters	4
W-band antenna in package module with hybrid glass-compound WLFO process	4
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	4
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback	4
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints	4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process	4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL	4
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method	3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints	3
Guest editorial: Heterogeneous integration and chiplets interconnection	3
Publisher’s note	3

Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times	3
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering	2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers	2
Recent progress on bumpless Cu/SiO₂ hybrid bonding for 3D heterogeneous integration	2
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy	2
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer	2
Radiation-hardened flip-flop for single event upset tolerance	2
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions	1
Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics	1
Microstructure and properties of ZnO-Bi₂O₃-based varistor ceramics via flash sintering	1
Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 1	1
A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer	1
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents	1
Predictive maintenance for printed circuit boards using eXtreme gradient boosting	1
A monopole polarisation diversity antenna for high density packaging MIMO applications	1
Minimization of common-mode voltage for matrix converter-fed permanent magnet synchronous motor system with model predictive control	1
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees	1
Retraction notice: Packaging design and thermal analysis for 1 mm ² high power VCSEL	1
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review	1
Heat dissipation performance of solid-state drives under convective cooling: analyzing the impact of heat sink fin spacing	1
Study on the dielectric properties at grain boundaries of ZnO film by electrostaticforce microscope	1
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique	1
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED	0
Reliability evaluation on SRG with full-bridge power converter considering thermal stress	0
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals	0
Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation	0
A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max application	0
Investigation on the new reliability issues of PCB in 5G millimeter wave application	0
Miniaturized bandwidth reconfigurable microwave bandpass filter	0
Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR	0
Fluorine implantation for nanostructured silicon Zener diodes: a study on electrical characterization and reliability	0
Design of compact transversal wideband bandpass filter with controllable bandwidth	0
Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications	0
Structural analysis of paper substrate for flexible microfluidics device application	0
DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation	0
The advanced leadless leadframe package and its characteristics	0
Two-step flash sintering of (Mg_1/3Ta_2/3)_0.01Ti_0.99O₂ giant dielectric ceramics	0
Effects of indium composition on the surface morphological and optical properties of InGaN/GaN heterostructures	0
A study on surface tension prediction of Sn-based lead-free solder via machine learning algorithms	0
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm	0
Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability	0
Optimization of pressure drop and power consumption in microchannels based on fin structure design	0
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints	0
A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO	0
Bipolar power converter and control of switched reluctance generator system for renewable energy storage	0
Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling loads	0
Optimization of 1-µm gate length InGaAs-InAlAs pHEMT	0
Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication	0
The role of PI thickness and opening dimensions on void suppression in solder bump fabrication	0
Failure analysis of direct plating copper (DPC) substrates under extreme heat resistance test	0

Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology	0
A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications	0
A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration	0
Guest editorial: emerging technologies for highly-reliable power electronic systems in miniaturized electronic devices	0
Effects of ⁶⁰Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging	0
Investigation of Au-Si eutectic wafer bonding for small-cavity MEMS devices	0
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter	0
A high performance RC-INV triggering SCR under 0.25 µm process	0
Corrigendum: Analysis and modeling of supraharmonic coupling among multiple inverters in renewable energy systems	0
Analysis and modeling of supraharmonic coupling among multiple inverters in renewable energy systems	0
Publisher’s note	0
Key techniques of ultra-low-power ADC and miniaturized RF transceiver circuits for 4G/LTE applications	0
Influence of extended surface area of heatsink on heat transfer: design and analysis	0
Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications	0
Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguide	0
Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice	0
Polyimide substrate textured by copper-seeding technique for enhanced light absorption in flexible black silicon	0
Stress−strain analysis and morphological parameter optimization of CSP solder joints under coupled tensile and shear loading	0
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling	0
Wafer-level packaging integration of LPDDR5X-signal integrity design and simulation exploration	0
Novel bipolar output high step-up sepic DC/DC converter with parasitical parameters self-balance	0
An ultrawideband Koch fractal patch antenna	0