Microelectronics International

Papers
(The median citation count of Microelectronics International is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)
ArticleCitations
A failure location technology for SiP devices based on TDR nondestructive testing method15
Magnetic alignment technology for wafer bonding6
Design and implementation of miniaturized tri-band microwave bandpass filter6
The preparation of anisotropic conductive paste and its application in FOB interconnection6
Publisher’s note6
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow6
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding6
Real-time contact angle’s measurement of molten solder balls in laboratory conditions5
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier5
Computer‐aided selective production of low-resistance NiP and NiCuP layers5
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles5
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process5
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study5
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications5
A modal analysis based optimal mounting support locations of a printed circuit board4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL4
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications4
Improvement of c-axis (002) AlN crystal plane by temperature assisted HiPIMS technique4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process4
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach3
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints3
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration3
Influence of Ag particle shape on mechanical and thermal properties of TIM joints3
Effects of interface cracks on reliability of surface mount technology interconnection in service environment3
Guest editorial: Heterogeneous integration and chiplets interconnection3
Influence of different etching methods on the structural properties of porous silicon3
W-band antenna in package module with hybrid glass-compound WLFO process3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints3
Identification of printed circuit boards mechanical properties using response surface methods2
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers2
Retraction notice: Packaging design and thermal analysis for 1 mm2 high power VCSEL2
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents2
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering2
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method2
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy2
Predictive maintenance for printed circuit boards using eXtreme gradient boosting2
Microstructure and properties of ZnO-Bi2O3-based varistor ceramics via flash sintering2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode2
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer2
Radiation-hardened flip-flop for single event upset tolerance2
A monopole polarisation diversity antenna for high density packaging MIMO applications2
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions2
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED1
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator1
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter1
A novel miniaturized Koch-Minkowski hybrid fractal antenna1
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network1
Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures1
A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications1
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique1
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees1
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata1
DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation1
N-face GaN substrate roughening for improved performance GaN-on-GaN LED1
A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer1
Reliability evaluation on SRG with full-bridge power converter considering thermal stress1
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