Microelectronics International

Papers
(The median citation count of Microelectronics International is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)
ArticleCitations
A failure location technology for SiP devices based on TDR nondestructive testing method16
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding7
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study6
The preparation of anisotropic conductive paste and its application in FOB interconnection6
Magnetic alignment technology for wafer bonding6
Design and implementation of miniaturized tri-band microwave bandpass filter6
Publisher’s note6
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier5
Real-time contact angle’s measurement of molten solder balls in laboratory conditions5
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles5
A modal analysis based optimal mounting support locations of a printed circuit board4
Influence of different etching methods on the structural properties of porous silicon4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process4
Influence of Ag particle shape on mechanical and thermal properties of TIM joints4
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process4
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL4
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints3
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times3
W-band antenna in package module with hybrid glass-compound WLFO process3
Publisher’s note3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints3
Effects of interface cracks on reliability of surface mount technology interconnection in service environment3
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method3
Radiation-hardened flip-flop for single event upset tolerance2
Retraction notice: Packaging design and thermal analysis for 1 mm2 high power VCSEL2
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer2
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering2
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions2
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy2
Guest editorial: Heterogeneous integration and chiplets interconnection2
Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers2
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration2
Minimization of common-mode voltage for matrix converter-fed permanent magnet synchronous motor system with model predictive control1
Microstructure and properties of ZnO-Bi2O3-based varistor ceramics via flash sintering1
Study on the dielectric properties at grain boundaries of ZnO film by electrostaticforce microscope1
DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation1
A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer1
A monopole polarisation diversity antenna for high density packaging MIMO applications1
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents1
An improved parallel five-level reinjection CSC for self-commutation of thyristor converter1
Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging1
Reliability evaluation on SRG with full-bridge power converter considering thermal stress1
Predictive maintenance for printed circuit boards using eXtreme gradient boosting1
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique1
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees1
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED1
0.052669048309326