Microelectronics International

Papers
(The median citation count of Microelectronics International is 0. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)
ArticleCitations
A failure location technology for SiP devices based on TDR nondestructive testing method26
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding12
The preparation of anisotropic conductive paste and its application in FOB interconnection8
Magnetic alignment technology for wafer bonding7
Publisher’s note7
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier6
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications6
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles6
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power6
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study6
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process5
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process5
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters5
Influence of Ag particle shape on mechanical and thermal properties of TIM joints4
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints4
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback4
Effects of interface cracks on reliability of surface mount technology interconnection in service environment4
Effect of ultrasonic loading time on the microstructures and performance of Cu/Al joints at solid-liquid mixed state4
W-band antenna in package module with hybrid glass-compound WLFO process4
A modal analysis based optimal mounting support locations of a printed circuit board4
A fast-read, high-stability 12T hybrid TFET-FinFET SRAM cell with reduced control overhead and enhanced layout efficiency3
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times3
Publisher’s note3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints3
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration2
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer2
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions2
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering2
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy2
Guest editorial: Heterogeneous integration and chiplets interconnection2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers2
Radiation-hardened flip-flop for single event upset tolerance2
Comparative analysis of gold-coated silver and conventional gold wire for semiconductor wire bonding: material properties and corrosion susceptibility in microelectronics1
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique1
Study on the dielectric properties at grain boundaries of ZnO film by electrostaticforce microscope1
Heat dissipation performance of solid-state drives under convective cooling: analyzing the impact of heat sink fin spacing1
A 15 dBm CMOS Class-J power amplifier achieving 47% PAE and 20 dBm OIP3 for Bluetooth low energy application1
A monopole polarisation diversity antenna for high density packaging MIMO applications1
Predictive maintenance for printed circuit boards using eXtreme gradient boosting1
Guest editorial: Advanced sensing and control techniques for safety enhancement of power electronics components and systems in renewable energy applications-Part 11
Microstructure and properties of ZnO-Bi2O3-based varistor ceramics via flash sintering1
Retraction notice: Packaging design and thermal analysis for 1 mm 2 high power VCSEL1
Silicon photonics packaging for AI datacenters: technical challenges, reliability requirements and future directions – a critical review1
Simplifying finite elements analysis of four-point bending tests for flip chip microcomponents1
Minimization of common-mode voltage for matrix converter-fed permanent magnet synchronous motor system with model predictive control1
Bi-objective optimization of power cycling stress and return loss in stacked BGA solder joints based on NSGA-II algorithm0
Guest editorial: emerging technologies for highly-reliable power electronic systems in miniaturized electronic devices0
Investigation of Au-Si eutectic wafer bonding for small-cavity MEMS devices0
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees0
A high performance RC-INV triggering SCR under 0.25 µm process0
Double-sided silicon vias (DSSVs) interconnection for large-sized interposer fabrication0
Cost-effective photovoltaic power generation with fuzzy-MCO MPPT and DRL-EHO controlled grid-forming inverter0
Microstructure and mechanical properties of Sn58Bi modified Sn1.0Ag0.5Cu/Cu solder joints0
A DFT+U study of structural, electronic and optical properties of Ag- and Cu-doped ZnO0
The role of PI thickness and opening dimensions on void suppression in solder bump fabrication0
Investigation on the new reliability issues of PCB in 5G millimeter wave application0
Analysis of stress relaxation in gate pins of press-pack IGBT devices based on multiphysics coupling0
Rectangular wire winding: homogenization and thermal analysis0
Optimization of 1-µm gate length InGaAs-InAlAs pHEMT0
Fluorine implantation for nanostructured silicon Zener diodes: a study on electrical characterization and reliability0
DC-port voltage balance strategy for three-phase cascaded H-bridge rectifier based on logic combination modulation0
Design of reconfigurable liquid crystal holographic antenna fed by a slow-wave rectangular waveguide0
Wafer-level packaging integration of LPDDR5X-signal integrity design and simulation exploration0
Effects of 60Co γ ray radiation on the transmission characteristics of interconnection structures for 3D packaging0
Strain-engineered ZnO/PVDF nanocomposite piezoelectric films for high-performance self-powered flexible wearable pressure sensors0
Reliability evaluation on SRG with full-bridge power converter considering thermal stress0
An ultrawideband Koch fractal patch antenna0
Optimization of pressure drop and power consumption in microchannels based on fin structure design0
Corrigendum: Analysis and modeling of supraharmonic coupling among multiple inverters in renewable energy systems0
Deformation and crack growth in multilayered ceramic capacitor during thermal reflow process: numerical and experimental investigation0
Influence of extended surface area of heatsink on heat transfer: design and analysis0
Experimental study for dual-channel-MCM reliability with complex condition0
Publisher’s note0
Design of UWB MIMO antenna using lean wearable textile substrate for reduced SAR0
A 122 dB gain fully differential op-amp with a rail-to-rail output and novel offset compensation scheme0
Reduction of the warping of a silicon wafer coated with two thin layers by minimal geometric modifications0
Research on the influence of intermetallic compounds on the reliability of lead-free solder joints under thermal cycling loads0
Design of compact transversal wideband bandpass filter with controllable bandwidth0
The advanced leadless leadframe package and its characteristics0
Two-step flash sintering of (Mg1/3Ta2/3)0.01Ti0.99O2 giant dielectric ceramics0
A chopper amplifier with a pseudo MOS resistor-based tunable bandwidth for EEG applications0
Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals0
The science-governed interface: a critical review of advanced metallization, intelligent control and characterization strategies for wire bonding technology0
Design and finite element simulation of a novel bimorph cantilever-based piezoelectric micromachined ultrasonic transducer with enhanced acoustic performance0
Characterization of a non-invasive dielectrophoresis ratchet microelectrode for electric-field-assisted HEK cell alignment and accumulation within defined gaps: in vitro 0
A study on surface tension prediction of Sn-based lead-free solder via machine learning algorithms0
A chemosensitive based ammonia gas sensor with PANI/PEO- ZnO nanofiber composites sensing layer0
Dual-mode virtual inertia and damping control scheme for cascaded H-bridge converter-based BESS with enhanced frequency support ability0
CVD processed ZnO thin film as solid thermal interface material in electronic devices: thermal and optical performance of LED0
Analysis and modeling of supraharmonic coupling among multiple inverters in renewable energy systems0
A novel S-shaped frequency and pattern reconfigurable patch antenna for 4G LTE, WLAN/Wi-Max application0
Reliability analysis of power converters in hybrid transformers considering the common fault conditions0
Experimental investigations of the effect of sintering pressure and temperature on the porosity and mechanical properties of sintered silver0
Failure analysis of direct plating copper (DPC) substrates under extreme heat resistance test0
Au-coated Ag alloy bonding wires with enhanced oxidation resistance for electronic packaging applications0
Review of aluminum nitride buffer layer for high electron mobility transistor applications: growth technique and substrate choice0
Bipolar power converter and control of switched reluctance generator system for renewable energy storage0
Stress−strain analysis and morphological parameter optimization of CSP solder joints under coupled tensile and shear loading0
A numerical investigation on the influence of full vs perimeter arrays on the mechanical reliability of electronic assemblies under vibration0
Design of radio frequency power amplifier for 2.45 GHz IoT application using 0.18 µm CMOS technology0
Novel bipolar output high step-up sepic DC/DC converter with parasitical parameters self-balance0
Structural analysis of paper substrate for flexible microfluidics device application0
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