Microelectronics International

Papers
(The TQCC of Microelectronics International is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)
ArticleCitations
A failure location technology for SiP devices based on TDR nondestructive testing method15
Design and implementation of miniaturized tri-band microwave bandpass filter7
The preparation of anisotropic conductive paste and its application in FOB interconnection7
Real-time contact angle’s measurement of molten solder balls in laboratory conditions6
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding6
Publisher’s note6
Magnetic alignment technology for wafer bonding5
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier5
A modal analysis based optimal mounting support locations of a printed circuit board5
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow5
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles5
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process5
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study5
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications5
Influence of different etching methods on the structural properties of porous silicon4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process4
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints3
Publisher’s note3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints3
Effects of interface cracks on reliability of surface mount technology interconnection in service environment3
W-band antenna in package module with hybrid glass-compound WLFO process3
Influence of Ag particle shape on mechanical and thermal properties of TIM joints3
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times3
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