OOIR: Observatory of International Research

Papers

(The TQCC of Microelectronics International is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)

Article	Citations
Design and implementation of miniaturized tri-band microwave bandpass filter	15
The preparation of anisotropic conductive paste and its application in FOB interconnection	7
A failure location technology for SiP devices based on TDR nondestructive testing method	6
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding	6
Publisher’s note	5
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles	5
Magnetic alignment technology for wafer bonding	5
Real-time contact angle’s measurement of molten solder balls in laboratory conditions	5
Study of the electronic transport performance of ZnO-SiO₂ film: the construction of grain boundary barrier	5
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study	5
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow	5
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach	4
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications	4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process	4
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process	4
A modal analysis based optimal mounting support locations of a printed circuit board	4
Computer‐aided selective production of low-resistance NiP and NiCuP layers	4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL	3
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints	3
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method	3
Influence of different etching methods on the structural properties of porous silicon	3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints	3
W-band antenna in package module with hybrid glass-compound WLFO process	3
Influence of Ag particle shape on mechanical and thermal properties of TIM joints	3
Effects of interface cracks on reliability of surface mount technology interconnection in service environment	3