Microelectronics International

Papers
(The TQCC of Microelectronics International is 3. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)
ArticleCitations
A failure location technology for SiP devices based on TDR nondestructive testing method15
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow6
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding6
Magnetic alignment technology for wafer bonding6
Design and implementation of miniaturized tri-band microwave bandpass filter6
The preparation of anisotropic conductive paste and its application in FOB interconnection6
Publisher’s note6
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study5
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications5
Real-time contact angle’s measurement of molten solder balls in laboratory conditions5
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier5
Computer‐aided selective production of low-resistance NiP and NiCuP layers5
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles5
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process5
Improvement of c-axis (002) AlN crystal plane by temperature assisted HiPIMS technique4
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process4
A modal analysis based optimal mounting support locations of a printed circuit board4
RETRACTED: Packaging design and thermal analysis for 1 mm2 high power VCSEL4
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications4
Guest editorial: Heterogeneous integration and chiplets interconnection3
Influence of different etching methods on the structural properties of porous silicon3
W-band antenna in package module with hybrid glass-compound WLFO process3
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints3
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach3
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints3
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration3
Influence of Ag particle shape on mechanical and thermal properties of TIM joints3
Effects of interface cracks on reliability of surface mount technology interconnection in service environment3
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