Microelectronics International

Papers
(The TQCC of Microelectronics International is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)
ArticleCitations
A failure location technology for SiP devices based on TDR nondestructive testing method26
Strengthening mechanisms of Cu/SACZ/Al micro-connection joints with solid-state bonding12
The preparation of anisotropic conductive paste and its application in FOB interconnection8
Magnetic alignment technology for wafer bonding7
Publisher’s note7
Study of the electronic transport performance of ZnO-SiO2 film: the construction of grain boundary barrier6
Quasi-elliptic band pass filter using resonators based on coupling theory for ultra-wide band applications6
Facile ligand-exchange strategy to promote low-temperature nano-sintering of oleylamine-capped Ag nanoparticles6
Comparative reliability evaluation of lightweight transmission systems for far-sea offshore wind power6
Atomic structure for AlN grown on different plane orientation of sapphire via numerical study6
Improving displacement of silicon V-shaped electrothermal microactuator using platinum sputter deposition process5
3-pass and 5-pass laser grooving & die strength characterization for reinforced internal low-k 55nm node wafer structure via heat-treatment process5
Online electrochemical impedance spectroscopy measurement for lithium-ion batteries based on real-time operating data of interface converters5
A modal analysis based optimal mounting support locations of a printed circuit board4
Influence of Ag particle shape on mechanical and thermal properties of TIM joints4
Extreme temperature thermal shock induced microstructure degradation and shear property deterioration of Sn3.0Ag0.5Cu/Cu solder joints4
Transient stability enhancement strategy of grid-forming inverter based on adaptive q-axis voltage feedback4
Effects of interface cracks on reliability of surface mount technology interconnection in service environment4
Effect of ultrasonic loading time on the microstructures and performance of Cu/Al joints at solid-liquid mixed state4
W-band antenna in package module with hybrid glass-compound WLFO process4
Effect of reflow temperature and solder size on Cu-Ni cross-interaction in the Cu/Sn/Ni micro solder joints3
A fast-read, high-stability 12T hybrid TFET-FinFET SRAM cell with reduced control overhead and enhanced layout efficiency3
Experimental study on the fracture behavior variation of the Au stud bump bonding with different high temperature storage times3
Publisher’s note3
Guest editorial: Heterogeneous integration and chiplets interconnection2
Surface quality prediction and lapping process optimisation on the fixed-abrasive lapping plate of sapphire wafers2
Radiation-hardened flip-flop for single event upset tolerance2
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration2
A chemosensitive-based ammonia gas sensor with PANI/PEO–ZnO nanofiber composites sensing layer2
Model of boron diffusion in silicon used for solar cell fabrication based on boric acid solutions2
Comparative study on solid-solid interfacial reaction and bonding property of Sn-Ag-Cu/Ni-P joints by laser and reflow soldering2
Study on electronic transport performance of Ag-ZnO film by photoassisted conductive atomic force microscopy2
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