Microelectronics International

Papers
(The TQCC of Microelectronics International is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-05-01 to 2024-05-01.)
ArticleCitations
The interfacial reliability of through-glass vias for 2.5D integrated circuits12
Integration of perovskite Pb[Zr0.35Ti0.65]O3/HfO2 ferroelectric-dielectric composite film on Si substrate7
Recent progress on bumpless Cu/SiO2 hybrid bonding for 3D heterogeneous integration6
Atomic layer deposition of TiO2 blocking layers for dye-sensitized solar cells6
A novel miniaturized Koch-Minkowski hybrid fractal antenna5
Compact dual-mode microstrip bandpass filter based on slotted square patch resonator5
Implementation of capacitance as simultaneous sensing and actuating tool in tapered microelectrode arrays for dielectrophoresis-on-a-chip application5
High-transconductance silicon carbide nanowire-based field-effect transistor (SiC-NWFET) for high-temperature applications4
An efficient design of dual-axis MEMS accelerometer considering microfabrication process limitations and operating environment variations4
Effects of V/III ratio of InGaN quantum well at high growth temperature for near ultraviolet light emitting diodes3
Optimization of flexible printed circuit board’s cooling with air flow and thermal effects using response surface methodology3
Dynamic dielectric properties characterization of tapered dielectrophoresis microelectrodes for selective detection and rapid manipulation of cells3
Investigations of temperature sensor embedded into PCB3
Fabrication of fluorine and silver co-doped ZnO photodetector using modified hydrothermal method3
Two-step flash sintering of (Mg1/3Ta2/3)0.01Ti0.99O2 giant dielectric ceramics3
Influence of different etching methods on the structural properties of porous silicon3
A fault-tolerant design for a digital comparator based on nano-scale quantum-dotcellular automata3
Multilayer ferrite inductors for the use at high temperatures3
N-face GaN substrate roughening for improved performance GaN-on-GaN LED3
Preliminary dielectrophoresis study: Manipulation of protein albumin and electrical quantification by using cyclic voltammetry technique3
Synthesis and characterization of ZnO based varistor ceramics: effect of sintering temperatures2
Real-time contact angle’s measurement of molten solder balls in laboratory conditions2
Improving the electromagnetic compatibility of electronic products by using response surface methodology and artificial neural network2
Effect of alloy particle size and stencil aperture shape on solder printing quality2
Willemite with Li2CO3 as a sintering aid for LTCC microwave substrates2
Identification of printed circuit boards mechanical properties using response surface methods2
Fabrication of UV ZnO NRS photodetector based on seeded silicon substrate via the drop-casting technique2
Influence of Ag particle shape on mechanical and thermal properties of TIM joints2
A fully matched dual stage CMOS power amplifier with integrated passive linearizer attaining 23 db gain, 40% PAE and 28 DBM OIP32
A 1-mm2 CMOS-pipelined ADC with integrated folded cascode operational amplifier2
Novel implementation of 3D multiplexers in nano magnetic logic technology2
Improvement of inter layer dielectric crack for LQFP C90FG wafer technology devices in copper wire bonding process2
Cylindrical conformal wideband antenna with enhancement of gain using integrated parasitic triangular shaped elements for WiMAX application2
Influence of selected factors on parameters of a cooling system with a Peltier module and forced air flow2
Influence of copper pillar bump structure on flip chip packaging during reflow soldering: a numerical approach2
Properties of Cu/Zn+15%SAC0307+15%Cu/Al joints by different ultrasonic-assisted degrees2
Effects of three-step magnesium doping in p-GaN layer on the properties of InGaN-based light-emitting diode2
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