IEEE Transactions on Device and Materials Reliability

Papers
(The H4-Index of IEEE Transactions on Device and Materials Reliability is 16. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)
ArticleCitations
From Mega to nano: Beyond one Century of Vacuum Electronics55
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers53
Sintered Silver-Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability40
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data31
On the Response Time constant of Interface Defects in Accumulation26
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators25
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via24
Editorial20
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters19
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module19
Location-Aware Error Correction for Mitigating the Impact of Interconnects on STT-MRAM Reliability19
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization18
Reliability of Advanced Nodes16
IEEE Transactions on Device and Materials Reliability Publication Information16
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology16
IEEE Transactions on Device and Materials Reliability Publication Information16
0.52281618118286