IEEE Transactions on Device and Materials Reliability

Papers
(The H4-Index of IEEE Transactions on Device and Materials Reliability is 17. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)
ArticleCitations
From Mega to nano: Beyond one Century of Vacuum Electronics59
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers55
Editorial34
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators31
Location-Aware Error Correction for Mitigating the Impact of Interconnects on STT-MRAM Reliability30
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data28
Sintered Silver-Based Direct-Cooled IGBTs With High Output Power and Thermal Reliability28
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization26
Package-Level Electro-Thermal Simulation With Transient Thermal Resistance Model for Surge Stress Failure Analysis of SiC MOSFET23
On the Response Time Constant of Interface Defects in Accumulation22
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters21
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module21
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via20
IEEE Transactions on Device and Materials Reliability Publication Information19
Reliability of Advanced Nodes18
IEEE Transactions on Device and Materials Reliability Publication Information18
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology17
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