OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Device and Materials Reliability is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2020-05-01 to 2024-05-01.)

Article	Citations
Impact of Interface Trap Charges on Analog/RF and Linearity Performances of Dual-Material Gate-Oxide-Stack Double-Gate TFET	52
Critical Insights Into Fast Charging Techniques for Lithium-Ion Batteries in Electric Vehicles	43
Quadruple and Sextuple Cross-Coupled SRAM Cell Designs With Optimized Overhead for Reliable Applications	35
Design Optimization of Three-Stacked Nanosheet FET From Self-Heating Effects Perspective	32
Schottky Gate Induced Threshold Voltage Instabilities in p-GaN Gate AlGaN/GaN HEMTs	28
EMSpice: Physics-Based Electromigration Check Using Coupled Electronic and Stress Simulation	23
High-Performance Radiation-Hardened Spintronic Retention Latch and Flip-Flop for Highly Reliable Processors	23
Design of High-Speed Low Variation Static Noise Margin Ternary S-RAM Cells	20
Exceeding Conservative Limits: A Consolidated Analysis on Modern Hardware Margins	20
Reliability-Aware Design Strategies for Stateful Logic-in-Memory Architectures	19
Ultra-Low Noise Defect Probing Instrument for Defect Spectroscopy of MOS Transistors	18
A β-Ga₂O₃ MESFET to Amend the Carrier Distribution by Using a Tunnel Diode	18
Study of Charge Trapping Effects on AlGaN/GaN HEMTs Under UV Illumination With Pulsed I-V Measurement	18
Single-Event Multiple Effect Tolerant RHBD14T SRAM Cell Design for Space Applications	18
LED Lifetime Prediction Under Thermal-Electrical Stress	17
Short Circuit Detection and Fault Current Limiting Method for IGBTs	15
Worst-Case Bias for High Voltage, Elevated-Temperature Stress of AlGaN/GaN HEMTs	14
Reliability-Oriented Automated Design of Double-Sided Cooling Power Module: A Thermo-Mechanical-Coordinated and Multi-Objective-Oriented Optimization Methodology	14
Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks	13
SRAM Radiation Hardening Through Self-Refresh Operation and Error Correction	13
A Gate-Grounded NMOS-Based Dual-Directional ESD Protection With High Holding Voltage for 12V Application	13
Soft-Error-Aware SRAM for Terrestrial Applications	13
Aging Diagnosis of Bond Wire Using On-State Drain-Source Voltage Separation for SiC MOSFET	12
TCAD Based Investigation of Single Event Transient Effect in Double Channel AlGaN/GaN HEMT	12
Fundamental Thermal Limits on Data Retention in Low-Voltage CMOS Latches and SRAM	12

ESD Protection Designs: Topical Overview and Perspective	12
Physical Study of SiC Power MOSFETs Towards HTRB Stress Based on C-V Characteristics	11
Reliability Analysis of Power Components in Restructured DC/DC Converters	11
Solder Joint Reliability Assessment and Pad Size Studies of FO-WLP With Glass Substrate	11
Copper Trace Fatigue Life Modeling for Rigid Electronic Assemblies	10
Reliability Assessment of GaAs/Al₂O₃ Junctionless FinFET in the Presence of Interfacial Layer Defects and Radiations	10
Effect of Wiring Density and Pillar Structure on Chip Packaging Interaction for Mixed-Signal Cu Low k Chips	10
Investigation of Single Event Transient Effects in Junctionless Accumulation Mode MOSFET	10
Time and Temperature Dependence of Copper Protrusion in Metallized Through-Glass Vias (TGVs) Fabricated in Fused Silica Substrate	10
Overview of Bias Temperature Instability in Scaled DRAM Logic for Memory Transistors	10
A New Scheme of the Low-Cost Multiple-Node-Upset-Tolerant Latch	9
A Physics-Based Single Event Transient Pulse Width Model for CMOS VLSI Circuits	9
Machine Learning Approach for Prediction of Point Defect Effect in FinFET	9
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization	9
Accelerated Degradation of IGBTs Due to High Gate Voltage at Various Temperature Environments	9
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs	9
Single Event Transients in Sub-10nm SOI MuGFETs Due to Heavy-Ion Irradiation	9
Reliability and Performance Analysis of Logic-in-Memory Based Binarized Neural Networks	9
A 10T Soft-Error-Immune SRAM With Multi-Node Upset Recovery for Low-Power Space Applications	9
Reliable and Radiation-Hardened Push-Pull pFlash Cell for Reconfigured FPGAs	9
Reliability of NAND Flash Memory as a Weight Storage Device of Artificial Neural Network	9
Monitoring Initial Solder Layer Degradation in a Multichip IGBT Module via Combined TSEPs	8
Design of Compact Reliable Energy Efficient Read Disturb Free 17T CNFET Ternary S-RAM Cell	8
Design, Fabrication and Characterization of Single-Crystalline Graphene gNEMS ESD Switches for Future ICs	8
Stealthy Information Leakage Through Peripheral Exploitation in Modern Embedded Systems	8
CMOS Reliability From Past to Future: A Survey of Requirements, Trends, and Prediction Methods	8
CMOS-Compatible Ex-Situ Incorporated Junctionless Enhancement-Mode Thin Polysilicon Film FET pH Sensor	8
Investigation of Self-Heating Effect in Tree-FETs by Interbridging Stacked Nanosheets: A Reliability Perspective	8
Novel ESD Compact Modeling Methodology Using Machine Learning Techniques for Snapback and Non-Snapback ESD Devices	8
Automated Die Inking	8
Next-Generation High-Density PCB Development by Fan-Out RDL Technology	8
MOZART+: Masking Outputs With Zeros for Improved Architectural Robustness and Testing of DNN Accelerators	8
Design for High Reliability of CMOS IC With Tolerance on Total Ionizing Dose Effect	7
Reliability Characterization of Ring Oscillator Circuits for Advanced CMOS Technologies	7
The Novel Structure to Enhancement I_on /I_off Ratio Based on Field Effect Diode	7
Energy Transformation Between the Inductor and the Power Transistor for the Unclamped Inductive Switching (UIS) Test	7
A Novel DTSCR With Embedded MOS and Island Diodes for ESD Protection of High-Speed ICs	7
Impact of Gamma-Ray Radiation on DC and RF Performance of 10-nm Bulk N-Channel FinFETs	7
Cell-Aware Defect Diagnosis of Customer Returns Based on Supervised Learning	7
Single Event Transient (SET) Mitigation Circuits With Immune Leaf Nodes	7
Accelerated Stress Tests and Statistical Reliability Analysis of Metal-Oxide/GaN Nanostructured Sensor Devices	7
Self-Heating and Reliability-Aware “Intrinsic” Safe Operating Area of Wide Bandgap Semiconductors—An Analytical Approach	7
Impact of Hot Carrier Aging on the 1/f and Random Telegraph Noise of Short-Channel Triple-Gate Junctionless MOSFETs	7
A Gated-Diode ESD SCR-Incorporated BJT for Reversed Floating P⁺ Junction Modulation	7
Trap-Assisted and Stress Induced Safe Operating Area Limits of AlGaN/GaN HEMTs	7
A Soft Error Detection and Recovery Flip-Flop for Aggressive Designs With High-Performance	7
Study of TID Radiation Effects on the Breakdown Voltage of Buried P-Pillar SOI LDMOSFETs	7
Impact of Dimensions of Memory Periphery FinFETs on Bias Temperature Instability	7
The TID Characteristics of a Radiation Hardened Sense-Switch pFLASH Cell	6
High Pressure Deuterium Annealing for Improved Immunity Against Stress-Induced Threshold Voltage Degradation	6

Qualitative and Quantitative Diagnostic Device for Detecting Defects in Crystalline Silicon PV Cells	6
Stress Analysis and Characterization of PECVD Oxide/Nitride Multi-Layered Films After Thermal Cycling	6
Access Region Stack Engineering for Mitigation of Degradation in AlGaN/GaN HEMTs With Field Plate	6
Using the Octagonal Layout Style for MOSFETs to Boost the Device Matching in Ionizing Radiation Environments	6
Proton-Induced Effect on AlGaN/GaN HEMTs After Hydrogen Treatment	6
Demonstration of an Equivalent Material Approach for the Strain-Induced Reliability Estimation of Stacked-Chip Packaging	6
Effect of Titanium-Polymer Interactions on Adhesion of Polymer-Copper Redistribution Layers in Advanced Packaging	6
Improving Breakdown Voltage in AlGaN/GaN Metal-Insulator-Semiconductor HEMTs Through Electric-Field Dispersion Layer Material Selection	6
Elimination of Thermo-Mechanically Driven Circumferential Crack Formation in Copper Through-Glass via Substrate	6
Impact of Interface Layer on Device Characteristics of Si:HfO₂-Based FeFET’s	6
Hot Carrier Degradation in MOSFETs at Cryogenic Temperatures Down to 4.2 K	6
Low Temperature and High Pressure Oxidized Al₂O₃as Gate Dielectric for AlInN/GaN MIS-HEMTs	5
Hybrid Multi-Graphene/Si Avalanche Transit Time <h-ATT> Terahertz Power Oscillator: Theoretical Reliability and Experimental Feasibility Studies	5
Single-Event Burnout Hardening 4H-SiC UMOSFET Structure	5
Reliability Test of 21% Efficient Flexible Perovskite Solar Cell Under Concave, Convex and Sinusoidal Bending	5
The Influence of N-Type Buried Layer on SCR ESD Protection Devices	5
An Effective Method to Identify Microarchitectural Vulnerabilities in GPUs	5
Time Dependent Shift in SOA Boundary and Early Breakdown of Epi-Stack in AlGaN/ GaN HEMTs Under Fast Cyclic Transient Stress	5
LED Reliability Assessment Using a Novel Monte Carlo-Based Algorithm	5
On-Chip Adaptive VDD Scaled Architecture of Reliable SRAM Cell With Improved Soft Error Tolerance	5
BTI and Soft-Error Tolerant Voltage Bootstrapped Schmitt Trigger Circuit	5
Investigation of Chip Temperature on Response Characteristics of the Humidity Sensor From ppm to %RH	5
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process	4
STATE: A Test Structure for Rapid and Reliable Prediction of Resistive RAM Endurance	4
A Study of the Relationship Between Endurance and Retention Reliability for a HfOₓ-Based Resistive Switching Memory	4
Run-Time Protection of Multi-Core Processors From Power-Noise Denial-of-Service Attacks	4
Simulation Study of Single-Event Burnout Reliability for 1.7-kV 4H-SiC VDMOSFET	4
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI	4
Design and Analysis of Leakage-Induced False Error Tolerant Error Detecting Latch for Sub/Near-Threshold Applications	4
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via	4
Reliability Characterization and Failure Prediction of 3D TLC SSDs in Large-Scale Storage Systems	4
Online Research on Reliability of Thermal-Vibration Coupling for PLC Optical Splitters	4
Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints	4
Impact of Structural and Process Variations on the Time-Dependent OFF-State Breakdown of p-GaN Power HEMTs	4
Effect of Different PBO-Based RDL Structures on Chip-Package Interaction Reliability of Wafer Level Package	4
Layout-Dominated Dynamic Imbalanced Current Analysis and Its Suppression Strategy of Parallel SiC MOSFETs	4
Workload-Aware Electromigration Analysis in Emerging Spintronic Memory Arrays	4
CD-DFT: A Current-Difference Design-for-Testability to Detect Short Defects of STT-MRAM Under Process Variations	4
Review of Double-Sided Cooling Power Modules for Driving Electric Vehicles	4
Probing Interface Trapping Characteristics of Au/β-Ga₂O₃ Schottky Barrier Diode on Si (100)	4
Low-Leakage and Variable V_HOLD Power Clamp for Wide Stress Time Range From ESD to Surge Test	4
Metallic Ratio Equivalent-Time Sampling and Application to TDC Linearity Calibration	4
On the Distribution of Single Defect Threshold Voltage Shifts in SiON Transistors	4
Probing the Atomic-Scale Mechanisms of Time-Dependent Dielectric Breakdown in Si/SiO₂ MOSFETs (June 2022)	4
Impact of Self-Heating on Linearity Performance of In_0.53Ga_0.47As-Based Gate-All-Around MOSFETs	4
Negative Bias-Temperature Instabilities and Low-Frequency Noise in Ge FinFETs	4
Reliability of VO textsubscript 2-Based mmWave Switches Under 100 Million Thermal Cycles	4