OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Device and Materials Reliability is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)

Article	Citations
Special Issue on Semiconductor Design for Manufacturing (DFM)Joint Call for Papers	50
From Mega to nano: Beyond one Century of Vacuum Electronics	46
CD-DFT: A Current-Difference Design-for-Testability to Detect Short Defects of STT-MRAM Under Process Variations	32
Investigation of the Interaction Effect Between the Microstructure Evolution and the Thermo-Mechanical Behavior of Cu-Filled Through Silicon Via	25
Mission Profile-Based Hotspot Temperature and Lifespan Estimation of DC-Link Capacitors Used in Automotive Traction Inverters	24
A Modified Bypass Circuit for Improved Reliability of PV Module Validated With Real-Time Data	23
Guidelines for the Design of Random Telegraph Noise-Based True Random Number Generators	22
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part I—Initial Characterization	21
FEA-Dominant Reliability and Lifetime Model of Double-Sided Cooling SiC Power Module	20
IEEE Transactions on Device and Materials Reliability Publication Information	19
Reliability of Advanced Nodes	19
A DLTS Study on Deep Trench Processing-Induced Trap States in Silicon Photodiodes	19
Device Screening Strategy for Suppressing Current Imbalance in Parallel-Connected SiC MOSFETs	18
IEEE Transactions on Device and Materials Reliability Publication Information	17
Research of Single-Event Burnout in P-NiO/n-Ga₂O₃ Heterojunction Diode	15
Unveiling the Degradation Mechanism of Polymer-Based Thermal Interface Materials Under Thermo-Oxidative Condition	15
Failure Mechanism and Predictive Modeling for Microbump Interconnects Drop Life Under Diverse Impact Angles in Advanced Packaging	14
Implication of Self-Heating Effect on Device Reliability Characterization of Multi-Finger n-MOSFETs on 22FDSOI	14
Lifetime Prediction of IGBT by BPNN Based on Improved Dung Beetle Optimization Algorithm	14
Modeling Analysis of BTI-Driven Degradation of a Ring Oscillator Designed in a 28-nm CMOS Technology	14
Degradation Analysis of 14 nm SOI FinFETs by Influence of Hot Carrier Injection and Self-Heating Synergistic Effects	13
Fault Modeling and Test Algorithm Development Framework for Gate-All-Around SRAMs	13
Simulation Study of Stress Effect on Performance and Design Methodology of Proposed Si/SiGe Integrated Bragg Grating Filter	13
Thermal Effect on Carbon Nanotube Fiber High-Ampacity Conductors at High Frequencies	13
Mitigation Technique for Single Event Transient via Pulse Quenching	13

Improving Breakdown Voltage in AlGaN/GaN Metal-Insulator-Semiconductor HEMTs Through Electric-Field Dispersion Layer Material Selection	13
IEEE Transactions on Device and Materials Reliability Publication Information	13
Study of TID Radiation Effects on the Breakdown Voltage of Buried P-Pillar SOI LDMOSFETs	13
Introducing IEEE Collabratec	12
Table of Contents	12
Member Get-A-Member (MGM) Program	12
Single-Event Effects Induced by Monoenergetic Fast Neutrons in Silicon Power UMOSFETs	12
IEEE Transactions on Device and Materials Reliability Publication Information	11
A Novel Dual-Mode Dual Trench MOSFET With Self-Adjustable Field Plate for Low EMI Noise and High Dynamic Avalanche Robustness	11
TechRxiv: Share Your Preprint Research with the World!	11
IEEE Transactions on Device and Materials Reliability Information for Authors	11
A New SiC Quasi MOSFET for Ultra-Low Specific On-Resistance and Improved Reliability	11
Study of Trap Influence on Threshold Voltage of SiC MOSFET Based on Transient Current Method	11
Revealing the Impact of Gate Area Scaling on Charge Trapping Employing SiO₂Transistors	11
Reliability and Characterization of Nanosilver Joints Prepared by a Time-Reduced Sintering Process	10
Compact Modeling of Process Variation and Reliability Predictions for Nanosheet Gate-All-Around FET	10
Predicting Failure Distributions of SRAM Arrays by Using Extreme Value Statistic, Bit Cell Simulation, and Machine Learning	10
A Lifetime Prediction Method of IGBT Based on Phased Nonlinear Wiener Process	10
Degradation Behavior and Mechanism of SONOS FLASH by Total Ionization Dose Effects	9
Design, Fabrication and Characterization of Single-Crystalline Graphene gNEMS ESD Switches for Future ICs	9
Temperature-Dependent Study of Large-Signal Reliability of p-FET-Based Power Amplifier for mmWave Applications	9
Blank Page	9
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on "Semiconductor Device Modeling for Circuit and System Design	9
An Analytical Model of Read-Disturb Failure Time in a Post-Cycling Resistive Switching Memory	9
TechRxiv: Share Your Preprint Research with the World!	9
Effects of Temperature and Bias Voltage on Electron Transport Properties in GaN High-Electron-Mobility Transistors	9
Analysis of Trapping Mechanisms and Capacitance Dispersion in Double-π Gate AlGaN/GaN HEMTs Under High-Temperature Conditions	9
From Mega to nano: Beyond one Century of Vacuum Electronics	9
Erratum to “Reliability Characterization of a Low-k Dielectric Using Magnetoresistance as a Diagnostic Tool”	9
Call for Nominations Editor-in-Chief IEEE Transactions on Device and Materials Reliability	9
Plasma Induced Charging Damage Causing MOS Device Reliability Lifetime Degradation Originating From Well Charging of a Technology With Deep Trench Isolation	8
A Consistent Analytical Method to Assess Reliability of Redundant Safety Instrumented Systems	8
Impact of Hot Carrier Aging on the 1/f and Random Telegraph Noise of Short-Channel Triple-Gate Junctionless MOSFETs	8
Reliability of VO textsubscript 2-Based mmWave Switches Under 100 Million Thermal Cycles	8
Open Model Interface Assisted NBTI-Aware Design With Dual-Vth Logic Synthesis Strategy for Reliability Improvement	8
Negative Bias-Temperature Instabilities and Low-Frequency Noise in Ge FinFETs	8
Designing and Reliability Analysis of Radiation Hardened Stacked Gate Junctionless FinFET and CMOS Inverter	8
Impact of Pulse Voltage Stress on the Reliability of Ferroelectric Thin-Film Transistor	8
Development of Accelerated Life Testing Apparatus for Light-Emitting Diode Therapy	8
[Blank page]	8
FPGA Assessment Methodology of Adverse X-Ray Effects on Secure Digital Circuits	8
Aging-Induced Mg Cluster Observation in GaN-Based Lasers by Atom Probe Tomography	8
Exploring the Optimal Solution for Graphene-Based Microstrip Line Attenuators	7
Blank Page	7
Exploiting Resistance Drift Characteristics to Improve Reliability of LDPC-Assisted Phase-Change Memory	7
IEEE Transactions on Device and MaterialsReliability publication information	7
Evaluations of Gate Oxide Reliability in SiC MOSFETs Under Extremely High Gate Voltage Stress	7
Table of Contents	7
Negative Bias Temperature Instability in Top-Gated Carbon Nanotube Thin Film Transistors With Y₂O₃ Gate Dielectric	7
Analysis of Floating Limiting Rings Termination Under Repetitive Avalanche Current Stress for 4H-SiC JBS Rectifiers	7

Aging and Sintered Layer Defect Detection of Discrete MOSFETs Using Frequency Domain Reflectometry Associated With Parasitic Resistance	7
Low Conductance State Drift Characterization and Mitigation in Resistive Switching Memories (RRAM) for Artificial Neural Networks	7
TechRxiv: Share Your Preprint Research with the World!	7
Influence of Critical Working Conditions on Stability of Varistor Characteristics	7
Introducing IEEE Collabratec	6
IEEE Transactions on Device and Materials Reliability Publication Information	6
IEEE Transactions on Device and Materials Reliability Information for Authors	6
Reflow Residues on Printed Circuit Board Assemblies and Interaction With Humidity	6
Research of Single-Event Burnout in 1.2-kV Rated CoolSiC Trench MOSFET	6
Call for Nominations for Editor-in-Chief IEEE Electron Device Letters	6
Radiation Hardened SOI LDMOS With Dual P-Type Layers Shielding Irradiation Charge Field	6
Negative Capacitance Vertical Dopingless TFET and Its Analog/RF Analysis Using Interface Trap Charges	6
Wide Band Gap Semiconductors for Automotive Applications	6
Call for Nominations for Editor-in-Chief IEEE Transactions on Semiconductor Manufacturing	6
Lifetime Prediction Method For IGBT Modules Under Combined Power Cycling–Vibration Conditions	6
Call for Nominations for Editor-in-Chief	5
Design of Highly Reliable 14T and 16T SRAM Cells Combined With Layout Harden Technique	5
Lateral and Vertical Gate Oxide Stacking Impact on Noise Margins and Delays for the 8T SRAM Designed With Source Pocket Engineered GaSb/Si Heterojunction Vertical TFET: A Reliability Study	5
Memristive Switching Behavior of MoO₃ Decorated PSi Heterostructure and Impact of Temperature on Device Reliability	5
Metallization Reliability of GaN-Based High-Voltage Light-Emitting Diodes	5
Comprehensive Study on Trap-Induced Bias Instability via High-Pressure D ₂ and N ₂ Annealing	5
Trap Location and Stress Degradation Analysis of GaN High Electron Mobility Transistors Based on the Transient Current Method	5
Influence of Phase Coarsening on Inhomogeneous Deformation and Fracture Behavior in Sn–Bi Solder Interconnects	5
Irradiation-Induced Degradation of Surface Acoustic Wave Devices Fabricated on Bulk AlN	5
Degradation Mapping and Impact of Device Dimension on IGZO TFTs BTI	5
Correlation of Radiation-Induced Interface Traps With Band Edge Energy Through Band Structure-Based Analysis of Electrostatics of UTB SOI Devices	5
White X-Ray Radiation Effects in MOS Capacitors With Atomic Layer Deposited HfO₂/Al₂O₃ and Al₂O₃/HfO₂/Al₂O₃ Gate	5
Systematic Reliability Evaluation of FPGA Implemented CNN Accelerators	5
Comprehensive TCAD-Based Single Event Effect Study of TFET-Based 1T DRAM and Crossbar Memory Array	5
An Effective Method to Identify Microarchitectural Vulnerabilities in GPUs	4
Call for Papers for a Special Issue of IEEE Journal of the Electron Devices Society on "Materials, processing and integration for neuromorphic devices and in-memory computing"	4
Correlation of HCD and Percolation Paths in FinFETs: Study of RDF and MGG Impacts Through 3-D Particle-Based Simulation	4
Analysis of Multicrystalline Si Solar Cell Degradation Due To Reverse Bias and High Temperature Aging	4
IEEE Transactions on Device and Materials Reliability information for authors	4
Metastable Operating Stability of Perovskite/Silicon Tandem Solar Cell Module	4
Single-Event Burnout Hardening 4H-SiC UMOSFET Structure	4
Front Cover	4
2023 Index IEEE Transactions on Device and Materials Reliability Vol. 23	4
Investigations on High-Power LEDs and Solder Interconnects in Automotive Application: Part II—Reliability	4
Table of Contents	4
Failure Mechanisms of Fluorine-Doped Tin Oxide Thin Films in Glass and Reliability Tests	4
Soft-Error-Aware SRAM for Terrestrial Applications	4
Power Durability Enhancement and Failure Analysis of TC-SAW Filter With Ti/Cu/Ti/Cu/Ti Electrodes	4
IEEE Transactions on Device and MaterialsReliability publication information	4
Prediction of Crack Initiation at Die Corner of Molded Underfill Flip-Chip Packages Under Thermal Load by New Criteria	4
Effect of Aging Temperature on the Fatigue Resistance and Shear Strength of SAC305 Solder Joints	4
ESR Modeling for Atmospheric Corrosion Behavior of Metallized Film Capacitors	4
IEEE Transactions on Device and Materials Reliability Information for Authors	4
Characterization, Analysis, and Modeling of Long-Term RF Reliability and Degradation of SiGe HBTs for High Power Density Applications	4
Modeling Degradation Kinetics of FAPbI₃ Perovskite Solar Cells: Impact of Microstructural and Optoelectronic Defects	4