Multidiscipline Modeling in Materials and Structures

Papers
(The H4-Index of Multidiscipline Modeling in Materials and Structures is 15. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-09-01 to 2025-09-01.)
ArticleCitations
Finite element analysis (FEA) study on the development of bioabsorbable magnesium-carbonate apatite (Mg-CAp) composite as a candidate interference screw (IFS) material54
Description of crystal defect properties in BCC Cr with extended Finnis–Sinclair potential35
Fracture mechanism and failure criterion of S-07 steel for liquid rocket engine33
A comprehensive study on using expanded silica gel size as hollow sphere material in different aluminum alloy-based syntactic foams32
Modeling of voltage-limiting kinetics in two-layer varistor–posistor structures25
Machinability optimization of carbon fiber reinforced polymer composites for aviation manufacturing parts24
Breaking process of composite membranes used in desalination phenomenon20
Cutting force and delamination optimization of nanoparticle-reinforced basalt/epoxy multi-scale composites in dry drilling by Taguchi design18
Optimization of structural parameters for the sound absorption performance of a cellular ceramic foam16
Study on the effects of guide fins structures on the flow and thermal uniformity of the motorcycle exhaust thermoelectric generator16
Modeling of resettable fuses characteristics for protection of solar arrays from current overloads16
Efficient aerodynamic optimization of turbine blade profiles: an integrated approach with novel HDSPSO algorithm16
Review of research progress and development trend of digital image correlation16
Reliability analysis of time-dependent problems based on ensemble learning of surrogate models15
Hydro-thermo-fluidic aspects of Oldroyd B fluid with hybrid nanostructure subject to low and moderate Prandtl numbers15
Effect of high-frequency PCB laminate on thermal cycling behavior of electronic packaging structures15
Relative frugal wavelet transform to detect damages in functionally graded tapered beams made of porous material15
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