IEEE Journal of Photovoltaics

Papers
(The H4-Index of IEEE Journal of Photovoltaics is 23. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-04-01 to 2025-04-01.)
ArticleCitations
Table of Contents79
IEEE Journal of Photovoltaics Information for Authors72
IEEE Journal of Photovoltaics Publication Information65
TechRxiv: Share Your Preprint Research with the World!52
IEEE Journal of Photovoltaics50
Evaluating the Potential of Polycrystalline Al0.25Ga0.75P and Al0.9Ga0.1As as Hole Contacts in Silicon Heterojunction Solar Cells49
Table of Contents49
Data-Driven Soiling Estimation and Optimized Cleaning Strategies for Industrial Rooftop PV Systems43
Characterization of Field-Exposed Photovoltaic Modules Featuring Signs of Contact Degradation42
Top-Performing Photovoltaic Cells Compared to the Shockley–Queisser Limit38
A Novel Fault Diagnosis Scheme for PV Plants Based on Real-Time System State Identification37
An Investigation on the Pollen-Induced Soiling Losses in Utility-Scale PV Plants36
IEEE Open Access Publishing35
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on “Semiconductor Device Modeling for Circuit and System Design”31
Role of Solar Cells in Global Energy Transformation30
Blank page28
Table of Contents26
TechRxiv: Share Your Preprint Research with the World!25
Call for Papers for a Special Issue of IEEE Transactions on Electron Devices on “Semiconductor Device Modeling for Circuit and System Design”25
2023 Index IEEE Journal of Photovoltaics Vol. 1325
IEEE Journal of Photovoltaics Publication Information24
Corrections to ‘‘Thermal Impact of Rear Insulation, Light Trapping, and Parasitic Absorption in Solar Modules’’ [Jul 22 1043-1050]23
Table of Contents23
Stack Diffusion Process for Cost- and Energy-Efficient Boron Emitter Formation23
3-D Modeling of Thermal Exchange in the PV Module During Lamination: Impact of Architecture, Laminator Configuration, and Lamination Recipe23
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