OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 27. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-08-01 to 2026-08-01.)

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	192
Blank Page	123
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	64
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	62
Table of Contents	56
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	49
Predictive Modeling Of TCV-Cu Protrusion Under Thermal Cycling	49
Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation	47
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	46
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	46
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	46
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	46
Reliability Risk Assessment of Server CPU Package in Single Phase Hydrocarbon-Based Immersion Fluid	43
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding	39
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	36
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	35
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	34
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	32
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	32
Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities	31
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	31
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	31
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	30
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	29
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration	28

Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	27
Spray Deposition for Board-Level Shielding Assessed Through MSRC Measurements	27
Degradation Mechanisms in Die-to-Wafer Hybrid Bonding Governed by Surface Activation Lifetime and Moisture Evaporation	27
mm-Wave 3-D-Printed 2 × 2 Antenna Subarray With Structurally Packaged Beamforming IC and Thermal Management	27