IEEE Transactions on Components Packaging and Manufacturing Technology

Papers
(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 25. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)
ArticleCitations
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IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information108
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information61
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance54
Study on the Performance of Insulating Substrate Based on Silver Sintering50
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling49
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling49
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System42
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications41
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation41
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing41
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm37
Skew-Symmetric Slotted Waveguide With Mode Select Effect36
Jet Dispensing Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules35
Table of Contents33
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification31
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information30
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating30
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish30
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications28
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities26
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor26
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure25
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation25
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics25
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