IEEE Transactions on Components Packaging and Manufacturing Technology

Papers
(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 25. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)
ArticleCitations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information461
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Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System81
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation53
Skew-Symmetric Slotted Waveguide With Mode Select Effect48
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information47
Table of Contents42
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules40
Board-Level Reliability of 100 mm × 100 mm Large Glass Packages: Warpage and Thermo-Mechanical Reliability for AI/HPC Applications40
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities40
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating39
Mm-Wave 3D Printed 2×2 Antenna Subarray with Structurally Packaged Beamforming IC and Thermal Management37
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance32
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling32
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices29
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics28
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor28
Study on the Performance of Insulating Substrate Based on Silver Sintering28
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information27
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish27
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm27
Reliability Risk Assessment of Server CPU Package in Single-Phase, Hydrocarbon-Based Immersion Fluid27
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation26
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration26
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method26
Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators25
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