OOIR: Observatory of International Research

Papers

(The H4-Index of IEEE Transactions on Components Packaging and Manufacturing Technology is 25. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-11-01 to 2025-11-01.)

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	420
Blank Page	127
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	73
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	56
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	50
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	46
Skew-Symmetric Slotted Waveguide With Mode Select Effect	43
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	43
Table of Contents	40
Board-Level Reliability of 100 mm × 100 mm Large Glass Packages: Warpage and Thermo-Mechanical Reliability for AI/HPC Applications	38
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	36
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	33
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities	33
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	32
Mm-Wave 3D Printed 2×2 Antenna Subarray with Structurally Packaged Beamforming IC and Thermal Management	31
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	30
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	30
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	28
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	27
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	27
Low-Loss FeSi-FeNi Inductor Cores for > 5 V-1 V Integrated Voltage Regulators	27
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	26
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	26
Advances in Package Microvia Interconnects: Breakthroughs with Picosecond UV Laser Ablation	26
Reliability Risk Assessment of Server CPU Package in Single-Phase, Hydrocarbon-Based Immersion Fluid	25

Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics