OOIR: Observatory of International Research

Papers

(The median citation count of IEEE Transactions on Components Packaging and Manufacturing Technology is 1. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-01-01 to 2026-01-01.)

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	461
Blank Page	140
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	81
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	53
Skew-Symmetric Slotted Waveguide With Mode Select Effect	48
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	47
Table of Contents	42
Board-Level Reliability of 100 mm × 100 mm Large Glass Packages: Warpage and Thermo-Mechanical Reliability for AI/HPC Applications	40
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities	40
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	40
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	39
Mm-Wave 3D Printed 2×2 Antenna Subarray with Structurally Packaged Beamforming IC and Thermal Management	37
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	32
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	32
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	29
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	28
Study on the Performance of Insulating Substrate Based on Silver Sintering	28
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	28
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	27
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	27
Reliability Risk Assessment of Server CPU Package in Single-Phase, Hydrocarbon-Based Immersion Fluid	27
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	27
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration	26
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	26
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	26

Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators	25
Degradation Mechanisms in Die-to-Wafer Hybrid Bonding Governed by Surface Activation Lifetime and Moisture Evaporation	24
Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation	24
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	23
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	23
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	23
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	23
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	22
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	22
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
Table of Contents	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	21
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	20
Application of Lévêque Analogy to Open Cellular Porous Materials	20
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	20
Using Hybrid Bonding for Stacked Bi-Color Micro-Light-Emitting Diodes	19
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	19
A Cavity Balun for High-Power Shortwave Transmission	19
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators	19
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC	19
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	18
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	18
100 Gb/s Multichannel TOSA With Low Tracking Error at the Industry Operating Temperature	18
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	18
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards	18
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	18
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	17
Miniaturized Metasurface-Inspired Tunable Power Divider and Phase Shifter	17
Machine Learning-Based Diagnosis of Defects in 2.5-D and 3-D Interconnects	17
Front Cover	17
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	17
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	17
Member Get-a-Member (MGM) Program	17
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	17
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	17
A Slow Wave Power Divider Based on the HISL Platform	16
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	16
High airtightness passivation layer for high-temperature all-solid-state thin-film batteries	16
Comparison Between Synthetic Oil Lubricants for Reducing Fretting Degradation in Lightly Loaded Gold-Plated Contacts	16
Effect of Process and Design Parameters in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study	16
High Reliability and Low Thermal Resistance Spacer Based on via-DPC for Double-Side Cooling Module	16
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging	15
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	15
A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules	15
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	15
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	15
Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs	15
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	15

A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	15
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	15
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	15
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	15
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	15
Table of Contents	14
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications	14
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	14
Analysis of Interface Evolution and Failure Mechanism of Sn_3.5Ag Micro-Copper Pillar Solder Joints under High Current Density	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	14
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)	14
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	14
Blank Page	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	14
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	14
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	13
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	13
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	13
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	13
A Method for Detecting the Initiation of Solder Joint Delamination in a 3-D PCB Assembly of WBG SiC MOSFET	13
On the Use of Acoustic Methods for the Detection of Electrostatic Capture of Diaphragm in Capacitive MEMS Microphones	13
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	13
Emerging Trends in System-Integrated Wearable Epidermal and Flexible Electrodes: Material Design and Applications in Physiological Monitoring	13
Table of Contents	13
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	13
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	13
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	13
Improving Transfer Accuracy of LEDs Utilizing the Alignment Structure	13
Design and Demonstration of an Ultrasonic-Laser Coupled Microjoining Platform for Electronic Device Packaging	13
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	13
A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression	13
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	13
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	13
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	13
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	12
Front Cover	12
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	12
Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments	12
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	12
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	12
Front Cover	12
Front Cover	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	12
Monolithically GaN-Based Optocoupler With Chip Scaling	12
Member Get-A-Member (MGM) Program	12
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	12
Blank Page	12
Electroplated Bonding of Copper Pillar Micro-Bumps Using an Accelerator–Suppressor System	11
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	11
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	11
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	11
Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	11
An Improved Inductance and Self-Resonance Frequency Modelling and Estimation of Single Turn On-chip Inductors for Millimeter-wave Applications	11
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	11
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework	11
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	11
IEEE Open Access Publishing	11
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	11
On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels	11
SiC Power Module Packaging Using Printed Electronics Materials and Processes	11
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	11
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	11
Front Cover	11
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators	11
Transient thermo-mechanical characteristic of segmented thermoelectric cooler for hot-spot thermal management	11
Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test	10
Table of Contents	10
Compact Microstrip MIMO Antenna with Enhanced Isolation Using Self-Decoupling and Stub-Based Techniques	10
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	10
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	10
Member Get-a-Member (MGM) Program	10
Table of Contents	10
Design of Three-State Dual-Band Diplexer Based on SCPW-MS With Broadside-Coupled Technique	10
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	10
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	10
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	10
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	10
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	10

Member Get-a-Member (MGM) Program	10
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	10
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	10
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint	10
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	10
Free-Form Filters Designed Using Binary Optimization Algorithm	10
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	10
Blank Page	10
IEEE Open Access Publishing	10
IEEE Components, Packaging, and Manufacturing Technology Society Information	10
A Cavitied Cold Plate for Enhanced Thermal Uniformity and Cooling	9
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	9
High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities	9
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit	9
A Broadband Antenna With Folded Structure and Packaged Solar Cell	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	9
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	9
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	9
State of the Art of Cu–Cu Hybrid Bonding	9
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	9
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	9
Table of Contents	9
On-Chip Dual-Band Balanced Bandpass Filter Design With High Common-Mode Absorption Rate	9
Predictive Modeling of PCB Thermo-Mechanical Properties for Reliable Stack-Up Configurations	9
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	9
Low-Cost Functional Testing Based on Data Imputation Integrating Fault Tree Analysis and XGBoost	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	9
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	9
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	9
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	9
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	9
Table of Contents	9
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	9
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	9
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	9
Segmentation Method for Modeling Heterogeneous Components to Suppress Broadband Simultaneous Switching Noise on a Multilayer Structure	9
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	9
Fused Filament Fabrication 3D Printing for Electronics Packaging	9
A Wideband D-band Microbump Antenna with Self-packaged Design	9
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	9
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	9
3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review	8
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	8
Bare-Die Embedded PCB Technique: An EMI Perspective	8
High-Density Hybrid Substrate for Heterogeneous Integration	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	8
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	8
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	8
Theoretical and Simulation-Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	8
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	8
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	8
Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity	8
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO₂ Thin Films	8
Reliability of Immersion Coolant and PCB Materials Evaluated Through Accelerated Thermal Testing	8
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	8
IEEE Open Access Publishing	8
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	8
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	8
Front Cover	8
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	8
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded	8
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	8
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	8
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	8
Bus-Aware Simultaneous Escape Routing with Through-Bus Net Avoidance	8
Front Cover	8
Table of Contents	8
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	8
Al/Ni Post-Heating Technique for Improving Mechanical Reliability of Sintered Ag Die-Attach Assembly	8
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	7
Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods	7
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	7
TechRxiv: Share Your Preprint Research With the World!	7
Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials	7
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding	7
Achievement and Assessment of 6-in Wafer Bonding Based on a Novel Nanosilver Sintering Method	7
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	7
A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design	7
TechRxiv: Share Your Preprint Research with the World!	7
Member Get-a-Member (MGM) Program	7
NOMA: A Novel Reliability Improvement Methodology for 3D IC-Based Neuromorphic Systems	7
The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature	7
Coupled Thermal and Mechanical Analysis of Thermal Interface Materials in Electronic Packaging	7
Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging	7
MEMS Package for an Iron–Gallium Nanowire-Based Acoustic Sensor	7
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	7
Our Thanks to Reviewers IEEE Transactions on Components, Packaging and Manufacturing Technology	7
Front Cover	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	7
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	7
The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal-Dielectric Structures	7
Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology	7