IEEE Transactions on Components Packaging and Manufacturing Technology

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	168
Blank Page	101
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	57
Table of Contents	50
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	50
Predictive Modeling Of TCV-Cu Protrusion Under Thermal Cycling	46
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration	45
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	45
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	45
Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators	42
Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation	39
Degradation Mechanisms in Die-to-Wafer Hybrid Bonding Governed by Surface Activation Lifetime and Moisture Evaporation	39
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	37
Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities	34
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	34
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	33
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	33
Skew-Symmetric Slotted Waveguide With Mode Select Effect	31
Reliability Risk Assessment of Server CPU Package in Single Phase Hydrocarbon-Based Immersion Fluid	31
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding	30
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	29
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	29
Spray deposition for Board Level Shielding assessed through MSRC measurements	29
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	29
Board-Level Reliability of 100 × 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications	28

IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	28
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	27
mm-Wave 3-D-Printed 2 × 2 Antenna Subarray With Structurally Packaged Beamforming IC and Thermal Management	26
Mechanistic Study on Regulating Aspect Ratio of Silver Lines in Dry Aerosol Jet Printing via Focusing Ratio	26
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	26
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	26
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	26
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	25
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	25
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	24
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	23
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	22
Table of Contents	22
Application of Lévêque Analogy to Open Cellular Porous Materials	21
A Cavity Balun for High-Power Shortwave Transmission	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC	21
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	21
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	20
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	20
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	20
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging	20
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	20
Member Get-a-Member (MGM) Program	20
100 Gb/s Multichannel TOSA With Low Tracking Error at the Industry Operating Temperature	20
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	20
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	20
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	20
High Airtightness Passivation Layer for High-Temperature All-Solid-State Thin-Film Batteries	19
Front Cover	19
Machine learning-based co-design of advanced flipchip packages: co-optimization of package warpage, die stress, solder joint reliability, thermal management, and signal integrity	19
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	19
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	19
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators	19
A Slow Wave Power Divider Based on the HISL Platform	19
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications	19
Effect of Process and Design Parameters in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study	19
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	19
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	18
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	18
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	18
Machine Learning-Based Diagnosis of Defects in 2.5-D and 3-D Interconnects	18
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	18
Application of Nonlinear Fracture Mechanics Parameter Δ T * to Estimating Wire-Liftoff Lifetime: Effect of Creep Constitutive Equations	17
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)	17
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	17
High Reliability and Low Thermal Resistance Spacer Based on Via-DPC for Double-Side Cooling Module	17
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	17
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	17

Miniaturized Metasurface-Inspired Tunable Power Divider and Phase Shifter	17
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	17
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	17
Table of Contents	16
Blank Page	16
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	16
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	16
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	16
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	16
Improving Transfer Accuracy of LEDs Utilizing the Alignment Structure	16
Using Hybrid Bonding for Stacked Bi-Color Micro-Light-Emitting Diodes	16
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	16
Emerging Trends in System-Integrated Wearable Epidermal and Flexible Electrodes: Material Design and Applications in Physiological Monitoring	15
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	15
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	15
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	15
A Method for Detecting the Initiation of Solder Joint Delamination in a 3-D PCB Assembly of WBG SiC MOSFET	15
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	15
Analysis of Interface Evolution and Failure Mechanism of Sn 3.5 Ag Microcopper Pillar Solder Joints Under High Current Density	15
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	15
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	15
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	15
Table of Contents	15
A Multiphysics Domain Decomposition Method for Transient Electro-Thermo-Mechanical Analysis	15
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	15
Stress-Strain Analysis and Fatigue Life Prediction of SnBiInZn High-Entropy Alloy QFN Solder Joints Under Random Vibration	15
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	14
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	14
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	14
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	14
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	14
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	14
Monolithically GaN-Based Optocoupler With Chip Scaling	14
Design and Demonstration of an Ultrasonic-Laser Coupled Microjoining Platform for Electronic Device Packaging	14
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	14
Front Cover	13
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	13
Blank Page	13
Front Cover	13
Front Cover	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	13
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	13
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	13
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	12
Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	12
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	12
Table of Contents	12
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework	12
IEEE Open Access Publishing	12
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	12
SiC Power Module Packaging Using Printed Electronics Materials and Processes	12
Optimization of a Compact Manifold Heatsink in External Airflow for Power Devices using a Multi-Objective Genetic Algorithm	12
Compact Microstrip MIMO Antenna With Enhanced Isolation Using Self-Decoupling and Stub-Based Techniques	12
Integrating a Degradation-Driven Methodology in Board Level Vibration Testing	12
Front Cover	12
Table of Contents	12
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	12
Design of Three-State Dual-Band Diplexer Based on SCPW-MS With Broadside-Coupled Technique	12
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	12
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	12
Mechanical–Optical Co-Design for Structural Integrity Optimization in Heterogeneous VCSEL Array Packaging	11
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	11
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	11
Electroplated Bonding of Copper Pillar Micro-Bumps Using an Accelerator–Suppressor System	11
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	11
Transient Thermomechanical Characteristic of Segmented Thermoelectric Cooler for Hotspot Thermal Management	11
Free-Form Filters Designed Using Binary Optimization Algorithm	11
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	11
An Improved Inductance and Self-Resonance Frequency Modeling and Estimation of Single-Turn On-Chip Inductors for Millimeter-Wave Applications	11
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	11
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	11
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	11
On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels	11
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	11
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	11
A Holistic Process-Chain Optimization Framework for High-Reliability High-I/O Silicon-to-Silicon Flip-Chip Packaging	10
IEEE Open Access Publishing	10

A Cavitied Cold Plate for Enhanced Thermal Uniformity and Cooling	10
High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities	10
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	10
Low-Loss Millimeter-Wave Surface-Mounted Wideband Filtering Power Divider Based on MEFAB Process	10
State of the Art of Cu–Cu Hybrid Bonding	10
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	10
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	10
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint	10
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	10
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	10
Predictive Modeling of PCB Thermomechanical Properties for Reliable Stack-Up Configurations	10
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	10
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	10
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	10
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	10
Table of Contents	10
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	10
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	10
On-Chip Dual-Band Balanced Bandpass Filter Design With High Common-Mode Absorption Rate	10
Member Get-a-Member (MGM) Program	10
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit	10
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	10
Innovating the Next Discontinuity Tight Coupling for AI and HPC	10
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	10
The Dynamic Capillary Limits of a Heat Pipe: Mapping the Operating Power Ranges using a Transient Dryout and Rewetting Model	10
Member Get-a-Member (MGM) Program	10
MINNs: MNA Informed Neural Networks for Fast Transient Simulation of Nonlinear Transmission Lines Subject to Parametric Uncertainty	10
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	10
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	10
A Wideband D-Band Microbump Antenna With Self-Packaged Design	10
Blank Page	10
A Novel Surrogate Modeling Framework Based on Fast Time-Domain Simulation and Transfer Learning for Signal Integrity Analysis	10
Table of Contents	10
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	10
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	10
Fused Filament Fabrication 3-D Printing for Electronics Packaging	10
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	10
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	9
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	9
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	9
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films	9
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	9
Low-Cost Functional Testing Based on Data Imputation Integrating Fault Tree Analysis and XGBoost	9
A 3-D Printing Filter for High-Power Satellite Applications	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	9
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	9
Al/Ni Post-Heating Technique for Improving Mechanical Reliability of Sintered Ag Die-Attach Assembly	9
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	9
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	9
Bare-Die Embedded PCB Technique: An EMI Perspective	9
Bus-Aware Simultaneous Escape Routing with Through-Bus Net Avoidance	9
A Broadband Antenna With Folded Structure and Packaged Solar Cell	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	9
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	9
Improved Electrical Isolation and Reliability in SiO₂-insulated Flip-Chip Packaging of SiC Chips for High Temperature Operation	9
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	9
IEEE Open Access Publishing	8
Physics-Informed Modeling of Coupled Electro–Thermo–Mechanical Degradation in ADAS Interconnects Under Self-Heating and Bias Temperature Instability	8
Impact of EMI on the Reliability of Crossbar Architecture-Based Inference in CMOS Technology	8
Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications	8
Front Cover	8
IEEE Open Access Publishing	8
Reliability Analysis and Improvement of Hermetic LTCC-CBGA Board-Level Interconnects	8
Electroless-Plated Gold Nanolayer for Low Temperature Copper Hybrid Bonding	8
3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review	8
QMSIW Filtering Balun Using IPD Technology for High-Frequency Applications	8
Table of Contents	8
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	8
Coupled Thermal and Mechanical Analysis of Thermal Interface Materials in Electronic Packaging	8
Failure Mechanisms and Predictive Modeling of Micro Solder Joints Under Thermal Cycling	8
A Novel 3-D-Printed Passive Microfluidic Temperature Sensor for Medical Applications	8
Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods	8
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	8
Achievement and Assessment of 6-in Wafer Bonding Based on a Novel Nanosilver Sintering Method	8
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded	8
Advanced 3-ω Method for Evaluating Anisotropic Thermal Conductivity in Carbon Nanotubes	8
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	8
Front Cover	8
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	8
The Impact of Large-Amplitude Intermittent Current Pulsing on the Reliability of Die Metal–Dielectric Structures	8
Accurate EM Modeling of Multiport Circuits via a Gated Rational Complex Neural Network	8
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review	8
Highly Manufacturable Packaging of an Implantable Episcleral Surface Stimulator With Reliability and Safety Validations	8
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	8
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14	8
Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity	8
Theoretical and Simulation-Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	8
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	8
Reliability of Immersion Coolant and PCB Materials Evaluated Through Accelerated Thermal Testing	8
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	8
Table of Contents	7
Using Particle Image Velocimetry to Visualize Jet Impingement Flow Mechanics on Modified Surfaces	7