IEEE Transactions on Components Packaging and Manufacturing Technology

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	420
Blank Page	127
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	73
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	56
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	50
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	46
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	43
Skew-Symmetric Slotted Waveguide With Mode Select Effect	43
Table of Contents	40
Board-Level Reliability of 100 mm × 100 mm Large Glass Packages: Warpage and Thermo-Mechanical Reliability for AI/HPC Applications	38
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	36
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities	33
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	33
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	32
Mm-Wave 3D Printed 2×2 Antenna Subarray with Structurally Packaged Beamforming IC and Thermal Management	31
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	30
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	30
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	28
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	27
Low-Loss FeSi-FeNi Inductor Cores for > 5 V-1 V Integrated Voltage Regulators	27
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	27
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	26
Advances in Package Microvia Interconnects: Breakthroughs with Picosecond UV Laser Ablation	26
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	26
Reliability Risk Assessment of Server CPU Package in Single-Phase, Hydrocarbon-Based Immersion Fluid	25

Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	25
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	24
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	24
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	24
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	23
Ultra-Low-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3D Integration	23
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	23
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	23
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	22
Study on the Performance of Insulating Substrate Based on Silver Sintering	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	22
Table of Contents	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
Application of Lévêque Analogy to Open Cellular Porous Materials	21
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	21
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	21
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	21
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	20
Comparison Between Synthetic Oil Lubricants for Reducing Fretting Degradation in Lightly Loaded Gold-Plated Contacts	20
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC	20
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	20
Using Hybrid Bonding for Stacked Bi-Color Micro-Light-Emitting Diodes	19
A Cavity Balun for High-Power Shortwave Transmission	19
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	19
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	18
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators	18
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	18
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards	18
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	17
100 Gb/s Multichannel TOSA With Low Tracking Error at the Industry Operating Temperature	17
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	17
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	17
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications	17
Miniaturized Metasurface-Inspired Tunable Power Divider and Phase Shifter	16
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	16
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)	16
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	16
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	16
Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs	16
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	16
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	16
Front Cover	16
Effect of Process and Design Parameters in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study	16
Member Get-a-Member (MGM) Program	16
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	15
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics	15
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	15
A Slow-Wave Power Divider Based on the HISL Platform	15
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging	15

A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	15
Machine Learning-Based Diagnosis of Defects in 2.5-D and 3-D Interconnects	15
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	15
Blank Page	14
Analysis of Interface Evolution and Failure Mechanism of Sn3.5Ag Micro-Copper Pillar Solder Joints under High Current Density	14
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	14
A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	14
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	14
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	14
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	14
A Method for Detecting the Initiation of Solder Joint Delamination in a 3-D PCB Assembly of WBG SiC MOSFET	14
Table of Contents	14
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	14
On the Use of Acoustic Methods for the Detection of Electrostatic Capture of Diaphragm in Capacitive MEMS Microphones	13
Monolithically GaN-Based Optocoupler With Chip Scaling	13
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	13
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	13
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	13
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	13
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	13
Table of Contents	13
Design and Demonstration of an Ultrasonic-Laser Coupled Microjoining Platform for Electronic Device Packaging	13
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	13
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	13
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	13
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	13
Front Cover	12
Free-Form Filters Designed Using Binary Optimization Algorithm	12
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	12
Improving Transfer Accuracy of LEDs Utilizing the Alignment Structure	12
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	12
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	12
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	12
A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression	12
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme	12
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	12
Front Cover	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	12
Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments	12
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	12
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	12
Emerging Trends in System-Integrated Wearable Epidermal and Flexible Electrodes: Material Design and Applications in Physiological Monitoring	12
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	12
Member Get-A-Member (MGM) Program	12
Front Cover	12
Blank Page	11
Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	11
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	11
Structurally Integrated Radar in an Aerospace Composite Laminate	11
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	11
IEEE Open Access Publishing	11
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators	11
Design of Three-State Dual-Band Diplexer Based on SCPW-MS With Broadside-Coupled Technique	11
SiC Power Module Packaging Using Printed Electronics Materials and Processes	11
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	11
An Improved Inductance and Self-Resonance Frequency Modelling and Estimation of Single Turn On-chip Inductors for Millimeter-wave Applications	11
Front Cover	11
On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels	11
Transient thermo-mechanical characteristic of segmented thermoelectric cooler for hot-spot thermal management	11
Electroplated Bonding of Copper Pillar Micro-Bumps Using an Accelerator–Suppressor System	11
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	10
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	10
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	10
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	10
Local Heat/Mass Transfer of Array Jet Impingement Cooling With Pin-Fin Heat Sinks	10
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	10
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	10
Table of Contents	10
Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test	10
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	10
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	10
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	10
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	10
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	10
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework	10
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	10

Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	10
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	10
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint	10
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	9
A Cavitied Cold Plate for Enhanced Thermal Uniformity and Cooling	9
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	9
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	9
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	9
Blank Page	9
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	9
IEEE Components, Packaging, and Manufacturing Technology Society Information	9
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	9
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	9
Table of Contents	9
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	9
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	9
Low Cost/Insertion Loss Substrate-Integrated Waveguide Equalizer Based on Absorbing Materials	9
IEEE Open Access Publishing	9
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	9
Member Get-a-Member (MGM) Program	9
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	9
On-Chip Dual-Band Balanced Bandpass Filter Design with High Common-Mode Absorption Rate	9
State of the Art of Cu–Cu Hybrid Bonding	9
Table of Contents	9
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	9
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	9
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit	9
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	9
High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities	9
Member Get-a-Member (MGM) Program	9
Fused Filament Fabrication 3D Printing for Electronics Packaging	9
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	9
Table of Contents	9
3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review	8
High-Density Hybrid Substrate for Heterogeneous Integration	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	8
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	8
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	8
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded	8
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	8
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	8
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	8
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	8
Theoretical and Simulation-Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	8
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	8
Segmentation Method for Modeling Heterogeneous Components to Suppress Broadband Simultaneous Switching Noise on a Multilayer Structure	8
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	8
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	8
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	8
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	8
Front Cover	8
Reliability of Immersion Coolant and PCB Materials Evaluated Through Accelerated Thermal Testing	8
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	8
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO2 Thin Films	8
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	8
A Broadband Antenna With Folded Structure and Packaged Solar Cell	8
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	8
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	8
Advanced Chiplet Placement and Routing Optimization considering Signal Integrity	8
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	8
Low-Cost Functional Testing Based on Data Imputation Integrating Fault Tree Analysis and XGBoost	8
Front Cover	8
Al/Ni Post-Heating Technique for Improving Mechanical Reliability of Sintered Ag Die-Attach Assembly	8
IEEE Open Access Publishing	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	7
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	7
Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems	7
NOMA: A Novel Reliability Improvement Methodology for 3-D IC-based Neuromorphic Systems	7
On the Fast Prediction of the Aerodynamic Performance of Electronics Cooling Fans Considering the Effect of Tip Clearance	7
The Connection Between Electromigration Resistance and Thin-Film Adhesion and Their Degradation With Temperature	7
MEMS Package for an Iron–Gallium Nanowire-Based Acoustic Sensor	7
Spectral Bayesian Optimization Using a Physics-Informed Rational Szegö Kernel for Microwave Design	7
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding	7
Electrical Demonstration of an RF Embedded Multichip Module Enabled by Fused-Silica Stitch-Chip Technology	7
IEEE Open Access Publishing	7
Front Cover	7
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review	7
Reliability Concerns of TSV-Based 3-D Integration: Impact of Interfacial Crack	7
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	7
Achievement and Assessment of 6-in Wafer Bonding Based on a Novel Nanosilver Sintering Method	7
Broadband Millimeter-Wave Dielectric Properties of Liquid Crystal Polymer Materials	7
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging	7
Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications	7
A Fast Thermal Network Model for Film Capacitors in Power Electronic Applications Facilitating the Lifespan Assessment	7
Table of Contents	7
Impact of EMI on the Reliability of Crossbar Architecture-based Inference in CMOS Technology	7
Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets	7
A Slow Wave Folded Ridge HMSIW Using Spoof Surface Plasmon Polaritons Structure and Its Application in Coupler Design	7
Selection and Characterization of Photosensitive Polyimide for Fan-Out Wafer-Level Packaging	7
Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods	7
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	7
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	7