OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Components Packaging and Manufacturing Technology is 5. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)

Article	Citations
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	164
Blank Page	98
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	58
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	48
Table of Contents	46
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	46
Jet-Dispensing-Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	45
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	44
Spray deposition for Board Level Shielding assessed through MSRC measurements	43
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	40
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	36
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	33
Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	33
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	33
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	32
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	32
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	31
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	30
Low-Loss FeSi–FeNi Inductor Cores for >5–1-V Integrated Voltage Regulators	29
Ultralow-Temperature Deposition and Enhanced Bonding of SiCN Films for Advanced 3-D Integration	29
Advances in Package Microvia Interconnects: Breakthroughs With Picosecond UV Laser Ablation	28
Degradation Mechanisms in Die-to-Wafer Hybrid Bonding Governed by Surface Activation Lifetime and Moisture Evaporation	28
Predictive Modeling Of TCV-Cu Protrusion Under Thermal Cycling	27
Reliability Risk Assessment of Server CPU Package in Single Phase Hydrocarbon-Based Immersion Fluid	27
Compact In-Line Multiband Bandpass Filters With Independently Controllable Passbands Using Quarter-Mode SIW Cavities	26

A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	26
Skew-Symmetric Slotted Waveguide With Mode Select Effect	26
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	26
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	25
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	25
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	25
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	25
Board-Level Reliability of 100 × 100 mm Large Glass Packages: Warpage and Thermomechanical Reliability for AI/HPC Applications	25
mm-Wave 3-D-Printed 2 × 2 Antenna Subarray With Structurally Packaged Beamforming IC and Thermal Management	24
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	24
Simulation of the Dynamic Process and Quality-Influencing Mechanisms in Wafer-to-Wafer Hybrid Bonding	22
Table of Contents	21
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
Application of Lévêque Analogy to Open Cellular Porous Materials	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	21
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	21
Using Hybrid Bonding for Stacked Bi-Color Micro-Light-Emitting Diodes	20
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators	20
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC	20
A Cavity Balun for High-Power Shortwave Transmission	20
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	19
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	19
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	19
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	19
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	19
100 Gb/s Multichannel TOSA With Low Tracking Error at the Industry Operating Temperature	19
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging	19
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	19
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	18
Member Get-a-Member (MGM) Program	18
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	18
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	18
Front Cover	18
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	18
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	18
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	18
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications	17
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	17
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	17
High Airtightness Passivation Layer for High-Temperature All-Solid-State Thin-Film Batteries	17
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	17
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	17
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	17
Effect of Process and Design Parameters in Cu/SiCN Hybrid Bonding Process: A Finite Element Analysis Study	17
A Slow Wave Power Divider Based on the HISL Platform	17
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)	17
High Reliability and Low Thermal Resistance Spacer Based on via-DPC for Double-Side Cooling Module	17
Application of Nonlinear Fracture Mechanics Parameter Δ T * to Estimating Wire-Liftoff Lifetime: Effect of Creep Constitutive Equations	16

Machine Learning-Based Diagnosis of Defects in 2.5-D and 3-D Interconnects	16
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	16
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	16
Miniaturized Metasurface-Inspired Tunable Power Divider and Phase Shifter	16
Machine learning-based co-design of advanced flipchip packages: co-optimization of package warpage, die stress, solder joint reliability, thermal management, and signal integrity	16
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	15
Table of Contents	15
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	15
Blank Page	15
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	15
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	15
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	15
Design and Demonstration of an Ultrasonic-Laser Coupled Microjoining Platform for Electronic Device Packaging	15
Stress-Strain Analysis and Fatigue Life Prediction of SnBiInZn High-Entropy Alloy QFN Solder Joints Under Random Vibration	15
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	15
A Method for Detecting the Initiation of Solder Joint Delamination in a 3-D PCB Assembly of WBG SiC MOSFET	15
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	15
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	15
Improving Transfer Accuracy of LEDs Utilizing the Alignment Structure	15
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	15
Table of Contents	15
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	15
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	14
Monolithically GaN-Based Optocoupler With Chip Scaling	14
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	14
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	14
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	14
Analysis of Interface Evolution and Failure Mechanism of Sn _3.5 Ag Microcopper Pillar Solder Joints Under High Current Density	14
A Multiphysics Domain Decomposition Method for Transient Electro-Thermo-Mechanical Analysis	14
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	14
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	14
Front Cover	13
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	13
Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments	13
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	13
Front Cover	13
Front Cover	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	13
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	13
Emerging Trends in System-Integrated Wearable Epidermal and Flexible Electrodes: Material Design and Applications in Physiological Monitoring	13
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	13
Blank Page	13
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	13
Front Cover	12
Table of Contents	12
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	12
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	12
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	12
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators	12
Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	12
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	12
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	12
Optimization of a Compact Manifold Heatsink in External Airflow for Power Devices using a Multi-Objective Genetic Algorithm	12
IEEE Open Access Publishing	12
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	12
SiC Power Module Packaging Using Printed Electronics Materials and Processes	12
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework	12
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	12
Free-Form Filters Designed Using Binary Optimization Algorithm	11
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	11
Transient Thermomechanical Characteristic of Segmented Thermoelectric Cooler for Hotspot Thermal Management	11
An Improved Inductance and Self-Resonance Frequency Modeling and Estimation of Single-Turn On-Chip Inductors for Millimeter-Wave Applications	11
Table of Contents	11
Compact Microstrip MIMO Antenna With Enhanced Isolation Using Self-Decoupling and Stub-Based Techniques	11
Low-Loss Millimeter-Wave Surface-Mounted Wideband Filtering Power Divider Based on MEFAB Process	11
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	11
On the Generation of SPICE-Compatible Nonlinear Behavioral Macromodels	11
Design of Three-State Dual-Band Diplexer Based on SCPW-MS With Broadside-Coupled Technique	11
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	11
Integrating a Degradation-Driven Methodology in Board Level Vibration Testing	11
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	11
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	11
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint	11
Electroplated Bonding of Copper Pillar Micro-Bumps Using an Accelerator–Suppressor System	11
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	11
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	11
Table of Contents	10

A Holistic Process-Chain Optimization Framework for High-Reliability High-I/O Silicon-to-Silicon Flip-Chip Packaging	10
Blank Page	10
MINNs: MNA Informed Neural Networks for Fast Transient Simulation of Nonlinear Transmission Lines Subject to Parametric Uncertainty	10
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	10
Predictive Modeling of PCB Thermomechanical Properties for Reliable Stack-Up Configurations	10
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	10
Fused Filament Fabrication 3-D Printing for Electronics Packaging	10
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	10
State of the Art of Cu–Cu Hybrid Bonding	10
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	10
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	10
Member Get-a-Member (MGM) Program	10
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	10
Mechanical–Optical Co-Design for Structural Integrity Optimization in Heterogeneous VCSEL Array Packaging	10
Table of Contents	10
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	10
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	10
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	10
On-Chip Dual-Band Balanced Bandpass Filter Design With High Common-Mode Absorption Rate	10
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	10
IEEE Open Access Publishing	10
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	10
Member Get-a-Member (MGM) Program	10
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	10
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	10
A Wideband D-band Microbump Antenna with Self-packaged Design	10
High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities	10
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	10
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	10
Theoretical and Simulation-Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	9
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	9
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit	9
A Cavitied Cold Plate for Enhanced Thermal Uniformity and Cooling	9
A Broadband Antenna With Folded Structure and Packaged Solar Cell	9
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	9
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	9
Bus-Aware Simultaneous Escape Routing with Through-Bus Net Avoidance	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	9
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	9
Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	9
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	9
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	9
Segmentation Method for Modeling Heterogeneous Components to Suppress Broadband Simultaneous Switching Noise on a Multilayer Structure	9
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO₂ Thin Films	9
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	9
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	9
Innovating the Next Discontinuity Tight Coupling for AI and HPC	9
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	9
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	9
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	9
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging	8
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	8
IEEE Open Access Publishing	8
Advanced Chiplet Placement and Routing Optimization Considering Signal Integrity	8
Table of Contents	8
Reliability of Immersion Coolant and PCB Materials Evaluated Through Accelerated Thermal Testing	8
Bare-Die Embedded PCB Technique: An EMI Perspective	8
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	8
Improved Electrical Isolation and Reliability in SiO₂-insulated Flip-Chip Packaging of SiC Chips for High Temperature Operation	8
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	8
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	8
Characterization and Optimization of the Heat Dissipation Capability of a Chip-On-Board Package Using Finite Element Methods	8
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review	8
Coupled Thermal and Mechanical Analysis of Thermal Interface Materials in Electronic Packaging	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	8
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	8
Front Cover	8
QMSIW Filtering Balun Using IPD Technology for High-Frequency Applications	8
Low-Cost Functional Testing Based on Data Imputation Integrating Fault Tree Analysis and XGBoost	8
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded	8
Al/Ni Post-Heating Technique for Improving Mechanical Reliability of Sintered Ag Die-Attach Assembly	8
Electroless-Plated Gold Nanolayer for Low Temperature Copper Hybrid Bonding	8
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	8
Impact of EMI on the Reliability of Crossbar Architecture-Based Inference in CMOS Technology	8
Impedance and Admittance Waveguide Inverter Applications: A Practical Sub-Terahertz Region Tolerance Analysis for Large-Scale Production	8
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14	8
IEEE Open Access Publishing	8
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	8
A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution	8
A 3-D Printing Filter for High-Power Satellite Applications	8
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	8
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	8
3-D Packaging Technologies for Advanced Integrated Photonics Modules: A Review	8
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	8
Front Cover	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	7
Using Particle Image Velocimetry to Visualize Jet Impingement Flow Mechanics on Modified Surfaces	7
Member Get-a-Member (MGM) Program	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	7
Effects of a Conformal Coating on the Signal Integrity of Space Electronics Systems	7
Our Thanks to Reviewers IEEE Transactions on Components, Packaging and Manufacturing Technology	7
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	7
TechRxiv: Share Your Preprint Research with the World!	7