OOIR: Observatory of International Research

Papers

(The TQCC of IEEE Transactions on Components Packaging and Manufacturing Technology is 4. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2021-08-01 to 2025-08-01.)

Article	Citations
Blank Page	359
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	108
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	61
A Data-Driven Approach to Collaborative Optimization for Enhancing TSV Multiphysics Performance	54
Study on the Performance of Insulating Substrate Based on Silver Sintering	50
Thermomechanical Modeling and Stress Analysis of Copper Inverse Opal (CIO) Structure for Capillary-Fed Boiling	49
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	49
Hybrid Integration of VCSEL and 3-μm Silicon Waveguide Based on a Monolithic Lens System	42
Wideband 3-D-Printed Chip Interconnects for DC-Millimeter Wave Applications	41
Intra-Lid Multi-Core Vapor Chamber Architecture for Heterogeneous Electronic Packages: Technology Concept to Prototype Evaluation	41
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	41
Rapid Multiobjective Optimization Strategy of TSV-Based 3-D Inductor Using Vector Fitting and Evolutionary Algorithm	37
Skew-Symmetric Slotted Waveguide With Mode Select Effect	36
Jet Dispensing Based Assembly of Electric Field Adaptively Controlled Structure in Power Electronic Modules	35
Table of Contents	33
Enhancing Defect Detection in Circuit Board Assembly Using AI and Text Analytics for Component Failure Classification	31
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	30
Package Design and Analysis of a 20-kV Double-Sided Silicon Carbide Diode Module With Polymer Nanocomposite Field-Grading Coating	30
Microstructural Evolution of SAC-Based Solder Joints Exposed to Thermal Cycling: Effect of Paste Alloy, Paste Volume, and Surface Finish	30
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	28
Compact In-Line Multiband Bandpass Filters with Independently Controllable Passbands using Quarter-Mode SIW Cavities	26
System Optimization: High-Frequency Buck Converter With 3-D In-Package Air-Core Inductor	26
Investigation of Graphene Film as Ground Plane Material for RF and Microwave Electronics	25
A Multifault Testing Method for TSVs Based on GAF-DRSN and Mirror Constant Current Source Structure	25
Accelerated Life Test and Prediction of Electromigration in Aluminum Interconnects Coupling Multiphysics Full Coupled Model With Optimized Atomic Flux Divergence Simulation	25

Integrated Circuit Packaging Defect Analysis and Deep Learning Detection Method	23
Reconfigurable SIW Phase Shifter Based on Parallel Stubs Loaded With Surface Mount p-i-n Diodes	23
Dual-Band Dual-Polarized Microstrip Patch Antenna With Parasitic Elements for 5G Antenna-in-Package Design at Millimeter-Wave Frequencies	23
In Memoriam Prof. Avram Bar-Cohen	23
Design and Implementation of an Electrostatic Force-Based Microcirculation Cooling System for Microelectronic Devices	23
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	23
Analysis of Power Delivery Network (PDN) in Bridge-Chips for 2.5-D Heterogeneous Integration	22
Table of Contents	22
Member Get-a-Member (MGM) Program	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	22
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	22
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	22
Influence of Au Substrate Crystal Structure on Ag–Au Interdiffusion for WBG Packaging	21
Packaged Millimeter-Wave On-Chip Bandpass Filter Using SHMSIW and Microstrip Hybrid Structure in 0.25-μm GaAs pHEMT Technology	21
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	21
Machine Learning-Based Diagnosis of Defects in 2.5-D and 3-D Interconnects	21
100 Gb/s Multichannel TOSA With Low Tracking Error at the Industry Operating Temperature	20
Power, Performance, Area, and Cost Analysis of Face-to-Face-Bonded 3-D ICs	20
Third Quadrant Operation of SiC MOSFETs: Comprehensive Analysis and Condition Monitoring Solution	20
Enhancing Humidity Robustness of Electronics: Understanding the Crucial Role of Solder Flux Chemistry in Determining Humidity Boundary for Failure	20
Optimization of the Wire Bonding Process for Enhanced Thermomechanical Performance of Quad Flat No-Lead (QFN) Packages in Automotive Applications	20
Reliability Improvement of 3.3 kV Full-SiC Power Modules for Power Cycling Tests With Sintered Copper Die Attach Technology	20
A Low-Profile Filtering Magneto-Electric Dipole Antenna Based on High-Density-Interconnect (HDI) Packaging	19
Thermal Onboard Detection of Voids in the Solder Layer Between Power Semiconductor and PCB	19
A Novel Approach to Evaluate and Predict the Impact of Randomly Distributed Voids on Junction Temperature for Power Modules	19
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	19
Miniaturized Metasurface Inspired Tunable Power Divider and Phase Shifter	19
High-Dimensional Uncertainty Quantification Using Stochastic Galerkin and Tensor Decomposition	18
Gate Voltage Oscillation Mitigation in Solid-State Circuit Breakers With Single-Gate Driven Series-Connected Power Devices	18
Extending Copper Interconnects and Epoxy Dielectrics to Multi-GHz Frequencies	18
Application of Lévêque Analogy to Open Cellular Porous Materials	18
Comparison Between Synthetic Oil Lubricants for Reducing Fretting Degradation in Lightly Loaded Gold-Plated Contacts	17
A Stepwise Integration Separation of Variables Solver for Full-Chip Thermal Uncertainty Analysis	17
Effect of Solar Irradiation on Thermal Performance of Heatsink—Numerical and Experimental Study	17
Dielectric Breakdown by Metallic Particles in COF Packaging for Display Driver IC	17
Thermal Design and Evaluation of a Rectifier for Electric Vehicle Wireless Charging Using Hybrid PCBs and Planar Magnetics	17
Electro-Thermal-Stress Multiphysical Field Coupling Optimization Design for Coaxial Through Silicon Via Array	16
Transient Flow Boiling and Maldistribution Characteristics in Heated Parallel Channels Induced by Flow Regime Oscillations	16
A Cavity Balun for High-Power Shortwave Transmission	16
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	16
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics	15
Differential-Fed Magneto-Electric Dipole Antenna With Integrated Balun Based on Ball Grid Array Packaging	15
Front Cover	15
Signal Integrity Analysis of Through-Silicon Via (TSV) With a Silicon Dioxide Well to Reduce Leakage Current for High-Bandwidth Memory Interface	15
Analysis of Discharge Caused by Soldering Defect in Wire-Bonding Power Module	15
Optimization and Analysis of Microchannels Under Complex Power Distribution in 3-D ICs	15
Estimation of Heat Generation in Semiconductors Centrally Mounted on Printed Circuit Boards	15
Compact Interdigital Bandpass Filter, Diplexer, and Triplexer Based on Through Quartz Vias (TQVs)	15
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	15
Deep Reinforcement Learning-Based Optimal and Fast Hybrid Equalizer Design Method for High-Bandwidth Memory (HBM) Module	14

Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme	14
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	14
Design and Demonstration of Dual-Core Spiral Package-Embedded Inductors for Integrated Voltage Regulators	14
The Impact of Bonding Wire Failure in Microelectronic Package on Near-Field Radiation	14
Table of Contents	14
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	14
Blank Page	14
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices	14
High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling	13
Modeling of Tunable Electronic Waveguide Devices in Graphene Using Conservative Higher Order Time Stepping	13
Solder Joint Geometry Effects on Thermomechanical Fatigue Lifetime of End-Capped Chip Component Assemblies	13
A Dual-Band Mushroom EBG Structure With Inductive via Coupling for Wideband Parallel-Plate Mode Suppression	13
Corrections to “A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network”	13
Benchmarking and Demonstration of Low-Loss Fused-Silica Stitch-Chips With Compressible Microinterconnects for RF/mm-Wave Chiplet-Based Modules	13
A Wideband Transition From Coaxial Line to Substrate-Integrated Waveguide	13
Table of Contents	13
Low-Profile UWB Millimeter-Wave Antenna Array Under Triple Resonant Modes Based on PCB Technology	13
Ball Grid Array Package Intermittent Partial Connection Defect Analysis in DDR4 Data Channel	13
Monolithically GaN-Based Optocoupler With Chip Scaling	13
The Impact of Substrate Vibrations on Self-Alignment Accuracy in BGA/Flip-Chip Assembly	13
On the Use of Acoustic Methods for the Detection of Electrostatic Capture of Diaphragm in Capacitive MEMS Microphones	13
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	13
High-Selectivity Bandpass Filter-Integrated SPDT Switch Using Switchable Dual-Mode Hybrid Resonators	13
Embedded p-i-n-Diode Die Interconnections With Aerosol-Jet Printing	12
Emerging Trends in System-Integrated Wearable Epidermal and Flexible Electrodes: Material Design and Applications in Physiological Monitoring	12
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	12
Influence of Copper Pad Dimension on Thermal Fatigue Life Performance of BGA Packages	12
Prefabricated and Assembled Electromagnetic Shields Inside Electronic Packages to Reduce Near-Field Capacitive and Inductive Coupling	12
Wide-Stopband Diplexer With Small Frequency Ratio Based on SIW Dual-Mode Resonators for Millimeter-Wave Applications	12
A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression	12
On the Use of an In-Package Dielectric Lens Antenna for Radar-Based Applications	12
Double-Sided Copper Filling of Small Diameter, High-Aspect Ratio Through-Glass Vias in High-Density Glass Interposers	12
A method for detecting the initiation of solder joint delamination in a 3D PCB assembly of WBG SiC MOSFET	12
Front Cover	11
Numerical and Experimental Analyses of Component Failure Risk in a Mobile Phone Under Drop Test	11
Thermomechanical Oriented Reliability Enhancement of Si MOSFET Panel-Level Packaging Fusing Ant Colony Optimization With Backpropagation Neural Network	11
Local Heat/Mass Transfer of Array Jet Impingement Cooling With Pin-Fin Heat Sinks	11
Front Cover	11
Free-Form Filters Designed Using Binary Optimization Algorithm	11
Application of Ferroelectric Capacitors for Equalization of High-Speed Digital Signaling	11
In Memoriam - A Tribute: Prof. Avram Bar-Cohen	11
A Miniaturized Balanced-to-Balanced Power Divider With Common-Mode Noise Absorption	11
Front Cover	11
IEEE Open Access Publishing	11
Member Get-A-Member (MGM) Program	11
Failure Mechanism and Reliability Research of Solder Layer Tilt in Double-Sided Cooling Power Modules	11
Material Property Variability of Composites in Thermo-Mechanical Studies Involving Virtual Design of Experiments	11
Rapid Design of Litz Wire Using Surrogate-Assisted Optimization Embedding Adjacent Trust Region	11
Front Cover	11
Bus-Aware IO Alignment Considering Length-Matching Constraints in 3-D IC Designs	11
SiC Power Module Packaging Using Printed Electronics Materials and Processes	10
Effect of Oxygen Content on Bonding Performance of Sintered Silver Joint on Bare Copper Substrate	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	10
Preventing Corrosion-Related Failures in Electronic Assembly: A Multicase Study Analysis	10
A Machine Learning-Based Method for Tuning the Control Loop of Fully Integrated Voltage Regulators	10
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	10
Blank Page	10
Moisture Diffusion Inside the BEOL of an FC-PBGA Package	10
Structurally Integrated Radar in an Aerospace Composite Laminate	10
Membrane-Based Two Phase Heat Sinks for High Heat Flux Electronics and Lasers	10
Ka-Band Substrate Integrated Waveguide Equalizer With Larger Equalization Value Based on Capacitive Loading Technology and Tiny Gap Effect	10
Metrology of Silicon Wafers Through Synchrotron Section Topography and X-Ray Diffraction Imaging	10
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	10
Artificial Intelligence-Driven Optimization for 3-D Integrated Circuit Manufacturing: A System of Systems Framework	10
Development of Silver Paste With High Sintering Driving Force for Reliable Packaging of Power Electronics	10
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	9
Determination of Fatigue Model Constants for Bi-Based SAC305 Hybrid Solder Joint	9
YOLO Algorithm With Hybrid Attention Feature Pyramid Network for Solder Joint Defect Detection	9
Table of Contents	9
IEEE Open Access Publishing	9
Tunable Ultra-Wideband (UWB) Liquid Metal Phase Shifter Based on SISL Platform	9
Member Get-a-Member (MGM) Program	9
Miniaturized Dual-/Tri-/Quad-Band Bandpass Filters Using Perturbed Multimode SIW Cavity	9
Comparative Drop Shock Reliability Study of SAC-Based Alloys in BGA Assemblies	9
An Improved Inductance and Self-Resonance Frequency Modelling and Estimation of Single Turn On-chip Inductors for Millimeter-wave Applications	9
IEEE Components, Packaging, and Manufacturing Technology Society Information	9
Member Get-a-Member (MGM) Program	9
Investigation and Improvements of UWB Microstrip Delay Lines	9
Study on Wear Debris Distribution and Performance Degradation of Electrical Connector Under Step Random Vibration Stress	9

Contact Reconstruction and Contact Spot Analysis of Microscopic Contact Surfaces Based on Feature Matching	9
Flexible/Conformal Inkjet-Printed 3-D “Ramp” Interconnects for 5G/mmWave System-on-Package Designs and Wearable Applications	9
Quad Port MIMO Al₂O₃ Ceramic-Based Integrated Reconfigurable Wideband Sensing and Communication Dielectric Antenna for 5G Cognitive Radio	9
Design of Three-State Dual-Band Diplexer Based on SCPW-MS With Broadside-Coupled Technique	9
Table of Contents	9
Transient thermo-mechanical characteristic of segmented thermoelectric cooler for hot-spot thermal management	9
Effects of Interconnect Shape and Thermal-Electro-Migration on Solder Creep of Copper-Pillar Flip Chip Joints	9
Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part I: Design and Performance Simulation	9
Blank Page	9
Study on Thermomigration-Induced Void Formation in Advanced Copper Interconnects	9
Out-of-Plane Optical Coupling to Photonic Integrated Circuits Using Turning-Mirror Lens Arrays	8
Table of Contents	8
Ultrawideband Chip-to-Chip Interconnect Using Bond Wire With Sidewalls	8
Low-Profile Wideband D-Band Absorber Utilizing Resistive Thin-Film Screen-Printing	8
A Sensitive Data Labeling Strategy for Optimizing a Broadband Vertical Transition in W Band	8
Low Cost/Insertion Loss Substrate-Integrated Waveguide Equalizer Based on Absorbing Materials	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	8
A Reflection Self-Canceling Design Technique for Multidrop Memory Interfaces	8
Least Squares Polynomial Chaos Regression for Stochastic Analysis of Transmission Lines Without and With Noise	8
State of the Art of Cu–Cu Hybrid Bonding	8
The Influence of Mechanical Cyclic Bending Stress on the Reliability of the Emerging DDR5 Memories in the Industrial Market	8
PIDDN: Pair-Image-Based Defect Detection Network With Template for PCB Inspection	8
Co-Designed Silicon Photonics Chip I/O for Energy-Efficient Petascale Connectivity	8
Characterization of Microstrip Line and SIW on ABF in Glass Interposers for mmWave Applications	8
Origami-Driven Manufacturing of Reflectarrays or Transmitarrays With Feeds and Fixture	8
Numerical Analysis of Pool Boiling of Nanofluids for High Heat Dissipation Applications	8
High-Density Hybrid Substrate for Heterogeneous Integration	8
High-Selectivity Bandpass Filters With Low Loss and Reduced Size Based on HCILA Slow Wave Technology Encapsulated in Patch Cavities	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Publication Information	8
Mixed-Mode Fiber Array Alignment and Coupling to Photonic Integrated Circuits	8
On-Chip Dual-Band Balanced Bandpass Filter Design with High Common-Mode Absorption Rate	8
Experimental Analysis on Reliability of Needle Electrodes in Ionic Wind	8
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	8
FPCB Surface Defect Detection Using Multiscale Spectral-Spatial Features Fusion	8
A Broadband Antenna With Folded Structure and Packaged Solar Cell	8
Electronic Components Provenance Assurance Through AI and Big Data in Assembly Processes	8
Design of Manifolded 3-D μ-Coolers Enabling High Heat Flux Capillary-Driven Boiling Over Large Areas	8
Symmetrical Multilayer Dielectric Model of Thermal Stress and Strain of Silicon-Core Coaxial Through-Silicon Vias in 3-D Integrated Circuit	8
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	8
A Cavitied Cold Plate for Enhanced Thermal Uniformity and Cooling	8
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	8
Aerosol-Jet Printed Transferable Millimeter-Wave Circuits	8
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling	8
MCB-DPO: Multiport Constrained Barrier Method-Based Decoupling Capacitor Placement Optimization on Irregularly Shaped Planes	7
Electromechanical Performance of Microprobe Test With Cuboid Magnetorheological Damper in Microelectronic Packaging	7
3-D Stacking of SiC Integrated Circuit Chips With Gold Wire Bonded Interconnects for Long-Duration High-Temperature Applications	7
NOMA: A Novel Reliability Improvement Methodology for 3-D IC-based Neuromorphic Systems	7
Front Cover	7
Conservative Gaussian Process Models for Uncertainty Quantification and Bayesian Optimization in Signal Integrity Applications	7
Cu Sintering for Cu Pillar Bonding: A Comparative Study Among Pressure-Less, Pressure-Assisted, and Transient Liquid Phase Sinter Pastes	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Information for Authors	7
On-Chip Single-/Dual-Notch-Band Half-Mode Substrate Integrated Plasmonic Waveguide Filters Based on Through Glass Via Technology	7
Segmentation Method for Modeling Heterogeneous Components to Suppress Broadband Simultaneous Switching Noise on a Multilayer Structure	7
Enhancing Glass-to-Glass Bonding at Room Temperatures Using Laser Surface Modification With Ti/Cu/Ti/TiO₂ Thin Films	7
Design of Vertically Integrated Folded SISL Patch Bandpass Filters With Single and Multiband Responses	7
IEEE Open Access Publishing	7
A mm-Wave 5G System Architecture With Enhanced-Gain Antenna Solution	7
Broadband Low-Loss Fan-In Chip-to-Package Interconnect Enabling System-in-Package Applications Beyond 220 GHz	7
Metal-Assisted Chemical Etching Toward Scallop-Free-Sidewall Through-Silicon Vias: A Review	7
Front Cover	7
Impact of Thermo-Mechanical Stress Due to Probing and Wire Bonding on CUP Devices	7
Our Thanks to Reviewers IEEE Transactions on Components, Packaging, and Manufacturing Technology	7
2024 Index IEEE Transactions on Components, Packaging and Manufacturing Technology Vol. 14	7
Design Guidelines for 2.5-D Packages Featuring Organic Interposer With Bridges Embedded	7
IEEE Transactions on Components, Packaging and Manufacturing Technology Society Information	7
3D Packaging Technologies for Advanced Integrated Photonics Modules: a Review	7
Advanced Chiplet Placement and Routing Optimization considering Signal Integrity	7
Table of Contents	7
Characterization of Additively Manufactured Suspended Finite Ground CPW Interconnects Enhanced by Femtosecond Laser Micromachining	7
Sulfur Ingression on Encapsulated Leadframe of Discrete Semiconductor Package	7
Electrothermal Transient Co-Simulation With Domain Decomposition Method for 3-D Complex Integrated Systems	7
Analysis and Optimization of HBM3 PPA for TSV Model With Micro-Bump and Hybrid Bonding	7
Front Cover	7
Impedance and Admittance Waveguide Inverter Applications: A Practical Sub-Terahertz Region Tolerance Analysis for Large-Scale Production	7
Reliability of immersion coolant and PCB materials evaluated through accelerated thermal testing	7
IEEE Open Access Publishing	7
Low-Cost Functional Testing Based on Data Imputation Integrating Fault Tree Analysis and XGBoost	7
Comprehensive Influences of Manufacturing Process Integrated With Thermal Cycling Test Loading on Mechanical Responses of Power Module	7
Theoretical and Simulation-Based Investigation of Heat Transfer and Thermal Runaway in Power MOSFET Devices	7
IEEE Components, Packaging, and Manufacturing Technology Society information for authors	7
Low-Profile Polymer Composite Radar Absorber Embedded With Frequency Selective Surface	7
Enhanced Junction Temperature Prediction Model for CoWoS Packaging With Multiple Chiplets	7
Table of Contents	6
Member Get-a-Member (MGM) Program	6
FEM Thermo-Fluid Dynamic Analysis of Advanced Metal Finned Liquid Cold Plates for High Power Semiconductor Devices and Modules	6
Waveguide Integration and Packaging of a Multichannel Power Amplifier in a SiGe BiCMOS Technology for mm-Wave Applications	6
Front Cover	6
TechRxiv: Share Your Preprint Research With the World!	6
Ku-Band Self-Packaged Balanced Magic-T and Filtering Power Divider Based on Substrate-Integrated Suspended Sandwich Slotline With High Isolation	6
Table of Contents	6
IEEE Transactions on Components, Packaging and Manufacturing Technology publication information	6
Our Thanks to Reviewers IEEE Transactions on Components, Packaging and Manufacturing Technology	6
IEEE Components, Packaging, and Manufacturing Technology Society Information	6
Using Particle Image Velocimetry to Visualize Jet Impingement Flow Mechanics on Modified Surfaces	6
Table of contents	6