IEEE Transactions on Components Packaging and Manufacturing Technology

Article	Citations
Recent Advances and Trends in Advanced Packaging	137
A Review of 5G Front-End Systems Package Integration	113
Demystifying Machine Learning for Signal and Power Integrity Problems in Packaging	51
A Review of Recent Research on Heat Transfer in Three-Dimensional Integrated Circuits (3-D ICs)	46
Universal Chiplet Interconnect Express (UCIe): An Open Industry Standard for Innovations With Chiplets at Package Level	44
Power Delivery for High-Performance Microprocessors—Challenges, Solutions, and Future Trends	43
An Adaptive Machine Learning Method Based on Finite Element Analysis for Ultra Low-k Chip Package Design	35
Electric Field Mitigation in High-Voltage High-Power IGBT Modules Using Nonlinear Conductivity Composites	34
Automatic Industry PCB Board DIP Process Defect Detection System Based on Deep Ensemble Self-Adaption Method	33
Wafer-to-Wafer Hybrid Bonding Development by Advanced Finite Element Modeling for 3-D IC Packages	32
Low Insertion-Loss MMIC Bandpass Filter Using Lumped-Distributed Parameters for 5G Millimeter-Wave Application	31
Characterization of ABF/Glass/ABF Substrates for mmWave Applications	30
Long Short-Term Memory Neural Networks for Modeling Nonlinear Electronic Components	29
Electrical and Reliability Investigation of Cu-to-Cu Bonding With Silver Passivation Layer in 3-D Integration	27
Silicon-Interconnect Fabric for Fine-Pitch (≤10 μm) Heterogeneous Integration	27
Modular Integration of a Passive RFID Sensor With Wearable Textile Antennas for Patient Monitoring	25
CPU Overclocking: A Performance Assessment of Air, Cold Plates, and Two-Phase Immersion Cooling	25
Numerical Simulation and Analytical Modeling of the Thermal Behavior of Single- and Double-Sided Cooled Power Modules	25
The ICECool Fundamentals Effort on Evaporative Cooling of Microelectronics	25
Diamond-Incorporated Flip-Chip Integration for Thermal Management of GaN and Ultra-Wide Bandgap RF Power Amplifiers	23
Performance Analysis and Shape Optimization of an Impingement Microchannel Cold Plate	22
Viscoelastic Warpage Modeling of Fan-Out Wafer-Level Packaging During Wafer-Level Mold Cure Process	22
Influence of Operation Numbers on Arc Erosion of Ag/CdO Electrical Contact Materials	22
Panel-Level Fan-Out RDL-First Packaging for Heterogeneous Integration	21
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV-Less Interposers	21

An Improved Cauer Model of IGBT Module: Inclusive Void Fraction in Solder Layer	20
Electromigration Reliability of Advanced High-Density Fan-Out Packaging With Fine-Pitch 2-/2-μm L/S Cu Redistribution Lines	20
Optimization of Converging and Diverging Microchannel Heat Sink for Electronic Chip Cooling	19
Low-Loss Gap Waveguide Transmission Line and Transitions at 220–320 GHz Using Dry Film Micromachining	19
A Contactless PCBA Defect Detection Method: Convolutional Neural Networks With Thermographic Images	18
Comparative Study of Surrogate Modeling Methods for Signal Integrity and Microwave Circuit Applications	18
A Review of Recent Developments in Pumped Two-Phase Cooling Technologies for Electronic Devices	18
Hybrid Substrate by Fan-Out RDL-First Panel-Level Packaging	18
Comparison of Mechanical Modeling to Warpage Estimation of RDL-First Fan-Out Panel-Level Packaging	18
3-D-Printing and High-Precision Milling of W-Band Filter Components With Admittance Inverter Sequences	18
Additively Manufactured Dual-Mode Reconfigurable Filter Employing VO₂-Based Switches	17
A Comprehensive Review of the Finite Element Modeling of Electrical Connectors Including Their Contacts	17
Iterative Machine Learning-Aided Framework Bridges Between Fatigue and Creep Damages in Solder Interconnections	17
Materials and Interface Challenges in High-Vapor-Quality Two-Phase Flow Boiling Research	17
An Analysis of Solder Joint Formation and Self-Alignment of Chip Capacitors	17
Package-Integrated, Wideband Power Dividing Networks and Antenna Arrays for 28-GHz 5G New Radio Bands	16
Residue-Assisted Water Layer Build-Up Under Transient Climatic Conditions and Failure Occurrences in Electronics	16
Thickness Dependence and Anisotropy of Capped Diamond Thermal Conductivity on Cooling of Pulse-Operated GaN HEMTs	16
A Variational Autoencoder Enhanced Deep Learning Model for Wafer Defect Imbalanced Classification	16
A Method of Defect Detection for Focal Hard Samples PCB Based on Extended FPN Model	16
Investigation of Low-Temperature Cu–Cu Direct Bonding With Pt Passivation Layer in 3-D Integration	16
Evaluation of Launderability of Electrically Conductive Fabrics for E-Textile Applications	15
Thermal–Mechanical Performance Analysis and Structure Optimization of the TSV in 3-D IC	15
A Novel Approach to Control of Piezo-Transducer in Microelectronics Packaging: PSO-PID and Editing Trajectory Optimization	15
Thermal Design, Optimization, and Packaging of Planar Magnetic Components	15
Crosstalk Noise Suppression Between Single and Differential Transmission Lines Using Spoof Surface Plasmon Polaritons	15
FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages	14
Low-Temperature (260 °C) Solderless Cu–Cu Bonding for Fine-Pitch 3-D Packaging and Heterogeneous Integration	14
Thermal Management System for Press-Pack IGBT Based on Liquid Metal Coolant	14
Reliability Study of Polymers Used in Sub-4-μm Pitch RDL Applications	14
Thermal Management of Electronic Devices Using Gold and Carbon Nanofluids in a Lid-Driven Square Cavity Under the Effect of Variety of Magnetic Fields	14
Anomaly Detection for Solder Joints Using β-VAE	14
Modeling of the RF Coaxial TSV Configuration Inside the Silicon Interposer With Embedded Cooling Cavity	14
Experimental Investigation on the Sintering Kinetics of Nanosilver Particles Used in High-Power Electronic Packaging	13
Analysis of Parameter Variability in an Integrated Wireless Power Transfer System via Partial Least-Squares Regression	13
Development of 3-D Wafer Level Packaging for SAW Filters Using Thin Glass Capping Technology	13
3-D Printing Structural Electronics With Conductive Filaments	13
A Novel High-Isolation Resistor-Less Millimeter-Wave Power Divider Based on Metamaterial Structures for 5G Applications	13
Luffa/Epoxy Composites: Electrical Properties for PCB Application	13
A Finite Element Analysis on the Reliability of Heavy Bonding Wire for High-Power IGBT Module	13
Electrical Circuit Modeling and Validation of Through-Silicon Vias Embedded in a Silicon Microfluidic Pin-Fin Heat Sink Filled With Deionized Water	13
Failure Analysis and Modeling of Solder Joints in BGA Packaged Electronic Chips	13
A Predictive Abnormality Detection Model Using Ensemble Learning in Stencil Printing Process	12
Thermal Management Modeling for β-Ga2O3-Highly Thermal Conductive Substrates Heterostructures	12
Smarter Temperature Setup for Reflow Oven to Minimize Temperature Variation Among Components	12
Low-Loss Impedance-Matched Sub-25-μm Vias in 3-D Millimeter-Wave Packages	12
Substrate Integrated Waveguide Filters in Glass Interposer for mmWave Applications	12
Development and Characterization of Novel Composite and Flexible Electrode Based on Titanium Dioxide	12
Mechanical and Electrical Behavior of Printed Silver Conductor in Adaptive Curvature Flexure Test	12
Noncontact Reflow Oven Thermal Profile Prediction Based on Artificial Neural Network	12

A Physical Thermal Network Model of Press Pack IGBTs Considering Spreading and Coupling Effects	12
Solder Joint Defect Inspection Method Based on ConvNeXt-YOLOX	12
Thermal Optimization of High-Temperature Downhole Electronic Devices	12
Synthetic Jet Cooling Technology for Electronics Thermal Management—A Critical Review	12
Analysis and Optimization of Electrolytic Capacitor Technology for High-Frequency Integrated Inverter	12
Comprehensive Analysis of a Cu Nitride Passivated Surface That Enhances Cu-to-Cu Bonding	12
Signal Integrity and Computing Performance Analysis of a Processing-In-Memory of High Bandwidth Memory (PIM-HBM) Scheme	11
Laminated Glass-Based, Compact Inline Stepped-Impedance Resonator Bandpass Filters for 5G New Radio Modules	11
Materials and Devices for On-Chip and Off-Chip Peltier Cooling: A Review	11
Fatigue Life Degradation Modeling of SnAgCu Solder Joints After Aging	11
Shape Memory Alloy-Based Frequency Reconfigurable Ultrawideband Antenna for Cognitive Radio Systems	11
Characteristics of Intermittent Fault in Electrical Connectors Under Vibration Environment	11
Single-Phase Microfluidic Cooling of 2.5D-SICs for Heterogeneous Integration	11
Impact of Pressure Drop Oscillations on Surface Temperature and Critical Heat Flux During Flow Boiling in a Microchannel	11
A Comparative Study of Energy Savings in a Liquid-Cooled Server by Dynamic Control of Coolant Flow Rate at Server Level	11
High-Dimensional Uncertainty Quantification via Tensor Regression With Rank Determination and Adaptive Sampling	11
Signal Integrity Design and Analysis of 3-D X-Point Memory Considering Crosstalk and IR Drop for Higher Performance Computing	11
Thermal Management of β-Ga₂O₃ Current Aperture Vertical Electron Transistors	11
Additive Manufacture of Custom Radiofrequency Connectors	11
Fully Integrated Wireless Elastic Wearable Systems for Health Monitoring Applications	11
Fast and Stable Time-Domain Simulation Based on Modified Numerical Inversion of the Laplace Transform	10
Plasma Treatment and Copper Metallization for Reliable Plated-Through-Holes in Microwave PCBs for Space Electronic Packaging	10
Smaller Microvias for Packaging Interconnects by Picosecond UV Laser With a Nanometer Metal Barrier Layer: A Feasibility Study	10
Effects of Filler Configuration and Moisture on Dissipation Factor and Critical Electric Field of Epoxy Composites for HV-ICs Encapsulation	10
Fan-Out Panel-Level Packaging of Mini-LED RGB Display	10
Thermal and Mechanical Analyses of Clamping Area on the Performance of Press-Pack IGBT in Series-Connection Stack Application	10
Effect of Ag Sintered Bondline Thickness on High-Temperature Reliability of SiC Power Devices	10
Analysis of Thermal Performance Metrics—Application to CPU Cooling in HPC Servers	10
DC IR-Drop Analysis of Multilayered Power Distribution Network by Discontinuous Galerkin Method With Thermal Effects Incorporated	10
Q-Thermal: A Q-Learning-Based Thermal-Aware Routing Algorithm for 3-D Network On-Chips	10
Evaluation of Additive Manufacturing Techniques Applied to a Waveguide Mode Transducer	10
Varactor–Graphene-Based Bandpass Filter With Independently Tunable Characteristics of Frequency and Amplitude	10
Uniformly Stable Parameterized Macromodeling Through Positive Definite Basis Functions	10
High-Reliability Wireless Packaging for High-Temperature SiC Power Device Sintered by Novel Organic-Free Nanomaterial	10
Mechanical and High-Frequency Electrical Study of Printed, Flexible Antenna Under Deformation	10
Modeling of Signal Distortion Caused by Passive Intermodulation and Cross Modulation in Coaxial Connectors	9
Warpage Analysis and Prediction of the Advanced Fan-Out Technology Based on Process Mechanics	9
Experimental and Numerical Study of 3-D Printed Direct Jet Impingement Cooling for High-Power, Large Die Size Applications	9
High-Density Hybrid Substrate for Heterogeneous Integration	9
Compact Fractional-Order Model of On-Chip Inductors With BCB on High Resistivity Silicon	9
A Review of Methods for the Reliability Testing of Flexible Hybrid Electronics	9
Influence of Humidity on the Power Cycling Lifetime of SiC MOSFETs	9
Near-Field Scanning Based Shielding Effectiveness Analysis of System in Package	9
Mode-Selective Transmission Line—Part I: Theoretical Foundation and Physical Mechanism	9
GVF: GPU-Based Vector Fitting for Modeling of Multiport Tabulated Data Networks	9
Large-Area Substrate Bonding With Single-Printing Silver Paste Sintering for Power Modules	9
A Hybrid CN-FDTD-SPICE Solver for Field-Circuit Analyses in Low-Frequency Wideband Problems	9
The Impact of Connection Failure of Bonding Wire on Signal Transmission in Radio Frequency Circuits	9
Comparative Reliability of Inkjet-Printed Electronics Packaging	9
Design of 3-D Integrated SIW Multiband Bandpass Filter With Split-Type Extended Doublet Topology	9
Reflow Recipe Establishment Based on CFD-Informed Machine Learning Model	9
Application of Steinberg Model for Vibration Lifetime Evaluation of Sn-Ag-Cu-Based Solder Joints in Power Semiconductors	9
Laser Ablation Cutting-Based Metal Patterning Technique Enabling 3D-Printed Broadband Antennas for Sub-6 GHz Wireless Communications Applications	9
Thermal Lifetime Calculation of Capacitor Insulation Using the Activation Energy Method	9
Design Flow for Active Interposer-Based 2.5-D ICs and Study of RISC-V Architecture With Secure NoC	9
Self-Evolution Cascade Deep Learning Model for High-Speed Receiver Adaptation	9
A Study on the Dynamic Bending Property of Chip-on-Flex Assembly Using Anchoring Polymer Layer Anisotropic Conductive Films	9
Millimeter-Wave Dielectric Slab-Based Chip-to-Chip Interconnect Network Allowing for Relaxed Assembly Tolerances	9
A Low-Loss Fan-Out Wafer-Level Package With a Novel Redistribution Layer Pattern and Its Measurement Methodology for Millimeter-Wave Application	8
Characterization of Alumina Ribbon Ceramic Substrates for 5G and mm-Wave Applications	8
Microstructural Characterization and Unified Reliability Assessment of Aged Solder Joints in a PV Module	8
Mode-Selective Transmission Line—Part II: Excitation Scheme and Experimental Verification	8
A Signaling Figure of Merit (s-FoM) for Advanced Packaging	8
Recent Advances and Trends in Multiple System and Heterogeneous Integration With TSV Interposers	8
Performance Analysis Using Air Gap Defected Through Silicon Via: Impact on Crosstalk and Power	8
Improving the Energy-Conversion Efficiency of a PV–TE System With an Intelligent Power-Track Switching Technique and Efficient Thermal-Management Scheme	8
Modeling and Analysis of Signal Integrity of Ball Grid Array Packages With Failed Ground Solder Balls	8
Large-Area Bonding by Sintering of a Resin-Free Nanosilver Paste at Ultralow Temperature of 180 °C	8
Cu–Cu Bonding Using Selective Cobalt Atomic Layer Deposition for 2.5-D/3-D Chip Integration Technologies	8
Novel SiC-Based Power Device Bonding Materials of Nano Foam Sheet and Its Characteristic and Properties	8
Cyclic Bending Effects on Resistance of Screen-Printed Silver Conductors	8
An Estimate of Heat Generation, Electric, and Magnetic Parameters From Temperature Fields in Porous Fins for Electronic Cooling Systems	8
Effect of Boron Nitride Nanosheets on Properties of a Commercial Epoxy Molding Compound Used in Fan-Out Wafer-Level Packaging	8
Wideband Low-Profile Dual-Polarized Antenna Based on a Gain-Enhanced EBG Reflector	8
A 5-Gb/s Adaptive Continuous Time Linear Equalizer Using Ferroelectric Capacitor	8
Additive Manufacturing of Hetero-Magnetic Coupled Inductors	8
Micropackaged Compact Switchable Filters With High Isolation in 3-D TSV-MEMS Process	8
3-D Printed Microjet Impingement Cooling for Thermal Management of Ultrahigh-Power GaN Transistors	8
Thermal and Mechanical Characterization of 2.5-D and Fan-Out Chip on Substrate Chip-First and Chip-Last Packages	8
Optical Beam-Based Defect Localization Methodologies for Open and Short Failures in Micrometer-Scale 3-D TSV Interconnects	8

Intermittent Fault Modeling and RUL Prediction for Degraded Electrical Connectors in Vibration Environments	8
Development and Reliability Study of 3-D Wafer Level Packaging for SAW Filter Using Thin Film Capping	8
A New Theoretical Model to Study the Closing Bounce Characteristics of the Electromagnetic Relay Under Capacitive Loads	8
Experimental Characterization of Additively Manufactured Metallic Heat Exchangers	8
A Transfer Learning LSTM Network-Based Severity Evaluation for Intermittent Faults of an Electrical Connector	8
Investigation on the Reliability of Die-Attach Structures for Double-Sided Cooling Power Module	7
Effects of Environmental Temperature on Passive Intermodulation in Electrical Connectors	7
Mean-Time-To-Failure Equations for Electromigration, Thermomigration, and Stress Migration	7
Effect of Solder Paste Volume and Reflow Parameters on Solder Paste Wicking and Joint Shear Strength of Ni–Au-Coated Cu Spheres	7
Thermal Aging Reliability of Socketable BGA Packages With Ni–Au-Coated SAC305 Spheres	7
Ultrasonic Bonding of Ag and Ag-Alloy Ribbon—An Innovative Alternative for High Power IC Packages	7
Impact of Microstructure Evolution on the Long-Term Reliability of Wafer-Level Chip-Scale Package Sn–Ag–Cu Solder Interconnects	7
Preparation and Characterization of a Thermal Insulating Carbon Xerogel-Epoxy Composite Adhesive for Electronics Applications	7
A Low-Cost Substrate Integrated Suspended Line Platform With Multiple Inner Boards and Its Applications in Coupled-Line Circuits	7
Technological Investigation of Metal 3-D Printed Microwave Cavity Filters Based on Different Topologies and Materials	7
Optically Transparent Adhesives for Microwave Metamaterial Absorber With PET–PDMS Interface	7
Evaluation of 3-D Printed Monolithic G-Band Waveguide Components	7
Recent Advances and Trends in Cu–Cu Hybrid Bonding	7
Multimaterial Aerosol Jet Printed Magnetic Nanocomposites for Microwave Circuits	7
A Temperature and Dielectric Roughness-Aware Matrix Rational Approximation Model for the Reliability Assessment of Copper– Graphene Hybrid On-Chip Interconnects	7
Modeling of Intergranular Mechanical Fatigue of a Sintered Nanosilver Die Attachment for Power Electronics	7
Thermal Modeling of a Chiplet-Based Packaging With a 2.5-D Through-Silicon Via Interposer	7
Vacuum Reflow Process Optimization for Solder Void Size Reduction in Semiconductor Packaging Assembly	7
A Scalable HPC-Based Domain Decomposition Method for Multiphysics Modeling of RF Devices	7
Planar Feeding Techniques for Wearable Textile Antennas	7
The Heat-Dissipation Sintered Interface of Power Chip and Heat Sink and Its High-Temperature Thermal Analysis	7
Toward Fully Automated High-Dimensional Parameterized Macromodeling	7
Panel-Level Chip-Scale Package With Multiple Diced Wafers	7
Transient Cooling and Heating Effects in Holey Silicon-Based Lateral Thermoelectric Devices for Hot Spot Thermal Management	7
A Wettability-Mediated Microdroplet Under Electrowetting Effect for Hotspot Cooling	7
Air-Cooled Loop Thermosyphon Cooling System for High Heat Load CPUs—Part II: Experimental Results and Validation	7
Study on the Separation Packaging Structure of Quantum Dot–Phosphor Hybrid White Light-Emitting Diodes for Backlight Display	7
Phase-Field Study of Thermomigration in 3-D IC Micro Interconnects	7
On the Junction Temperature Extraction Approach With a Hybrid Model of Voltage-Rise Time and Voltage-Rise Loss	7
Antenna-in-Package (AiP) Using Through-Polymer Vias (TPVs) for a 122-GHz Radar Chip	7
Research on Flip-Chip Bonding Process and Thermal Cycle Reliability Simulation of 3-D Stacked Structure	6
D-Band Waveguide Diplexer Fabricated Using Micro Laser Sintering	6
An FR4-Based Self-Packaged Full Ka-Band Low-Loss 1:4 Power Divider Using SISL to Air-Filled SIW T-Junction	6
Intermetallic Compounds at the Interfaces of Ag–Pd Alloy Stud Bumps With Al Pads	6
Electrothermal Design of SIW Slot Antenna Array With Fin-Shaped Heatsink Enclosed	6
Humidity Control in Electronic Devices: Water Sorption Properties of Desiccants and Related Humidity Build-Up in Enclosures	6
Evaluation of Stochastic and Periodic Cellular Materials for Combined Heat Dissipation and Noise Reduction: Experiments and Modeling	6
DC IR-Drop Analysis of Power Distribution Networks by a Robin Transmission Condition-Enhanced Discontinuous Galerkin Method	6
Monolithic Microfluidic Cooling of a Heterogeneous 2.5-D FPGA With Low-Profile 3-D Printed Manifolds	6
Shear Fatigue Analysis of SAC-Bi Solder Joint Exposed to Varying Stress Cycling Conditions	6
Back-Side Release of Slot Waveguides for the Integration of Functional Materials in a Silicon Photonic Technology With a Full BEOL	6
The Effect of Pitch Distance on the Statistics and Morphology of Through-Silicon Via Extrusion	6
Investigation of Pillar–Concave Structure for Low-Temperature Cu–Cu Direct Bonding in 3-D/2.5-D Heterogeneous Integration	6
Galerkin’s Projection Framework for BCI CTMs—Part I: Extended FANTASTIC Approach	6
Mechanical–Thermal–Electrical Coupling Modeling and Temperature Rise Characteristic of a Parallel Groove Clamp With Improved Representation of Contact Interactions	6
Thermal Influence Coefficients-Based Electrothermal Modeling Approach for Power Electronics	6
Glass-Based Bandpass Filters for New Radio (NR) K-/Ka-Band Communications	6
Laguerre–Volterra Feed-Forward Neural Network for Modeling PAM-4 High-Speed Links	6
Multichannel Parallel Testing of Intermittent Faults and Reliability Assessment for Electronic Equipment	6
Cascaded Multicore Vapor Chambers for Intrapackage Spreading of High-Power, Heterogeneous Heat Loads	6
A Fully Integrated Arbitrary Power Divider on Printed Circuit Board by a Novel SMD-Resistor-Free Isolation Network	6
Thin Film Metallization Stacks Serve as Reliable Conductors on Ceramic-Based Substrates for Active Implants	6
Reinforcement-Learning-Based Signal Integrity Optimization and Analysis of a Scalable 3-D X-Point Array Structure	6
An UHF Reconfigurable Liquid-Metal Monopole Antenna Based on a 2-D Surface	6
Study of Bondable Laser Release Material Using 355 nm Energy to Facilitate RDL-First and Die-First Fan-Out Wafer-Level Packaging (FOWLP)	6
Thermal and Signal Integrity Co-Design and Verification of Embedded Cooling Structure With Thermal Transmission Line for High Bandwidth Memory Module	6
Tarnishing (Ag2S) Layer on Silver-Plated Electrical Contacts: Its Influence on Electrical Contact Resistance	6
Contacting Inkjet-Printed Silver Structures and SMD by ICA and Solder	6
Metal-Embedded Chiplet Assembly for Microwave Integrated Circuits	6
The Influence and Application of Bond Wires Failure on Electrothermal Characteristics of IGBT Module	6
Equivalent Circuit Synthesis of Multiport S Parameters in Pole–Residue Form	6
Holistic Chiplet–Package Co-Optimization for Agile Custom 2.5-D Design	6
A Review of Low-Temperature Solders in Microelectronics Packaging	6
Signal Integrity Modeling and Analysis of Large-Scale Memristor Crossbar Array in a High-Speed Neuromorphic System for Deep Neural Network	6
Influence of Lateral Temperature Gradients on the Failure Modes at Power Cycling	6
High-Temperature Encapsulation Materials for Power Modules: Technology and Future Development Trends	6
Physical Modeling of Monolithic Self-Rolled-Up Microtube Interdigital Capacitors	6
SLA-Printed K-Band Waveguide Components Using Tollens Reaction Silver Plating	6
Design and Development of Single-Qubit Ion Trap on Glass and Si Substrates With RF Analysis and Performance Benchmarking	6
Sensitivity Analysis for Geometrical Parameters of BGA in Flip-Chip Packaging Under Random Shear Stress and Thermal Temperature	6
Experimental Analysis of the Condenser Design in a Thermosiphon System for Cooling of Telecommunication Electronics	6
Vertical Noise Reduction in 3-D Mixed-Signal Integrated Circuits With Graphene Nanoribbon and Carbon Nanotube Interconnects	6
Structurally Integrated Radar in an Aerospace Composite Laminate	6
Average Power Handling Capability of Microstrip Lines Considering Heat Convection and Self-Heating Effects With Temperature-Dependent Resistivity	6
Heterogeneous Integration System in Display (HiSID) for Next-Generation Terminal Device	6
Effect of Thermal Cycling on the Thermal and Mechanical Properties of Dielectric Materials	6
High-Density Electrical and Optical Assembly for Subminiature VCSEL-Based Optical Engine	6
Flexible Chip-First Millimeter-Wave Packaging Using Multiple Dielectrics	6
Thermo-Mechanical Characteristics and Reliability of Die-Attach Through Self-Propagating Exothermic Reaction Bonding	6
A Flexible Implantable Polyimide Catheter Device for Targeted Treatment of Cardiovascular Diseases by Aggregating Magnetic Nanoparticles	5
77/79-GHz Forward-Wave Directional Coupler Component Based on Microstrip and SIW for FMCW Radar Application	5
An Optimized Ag–5Pd–3.5Au Bonding Wire for the Resistance of Ag Ion Migration in LED Packages	5
Open Defect Detection Not Utilizing Boundary Scan Flip-Flops in Assembled Circuit Boards	5
Fan-Out Antenna-in-Package Integration Using Heatsink Antenna	5
RF Performance Benchmarking of TSV Integrated Surface Electrode Ion Trap for Quantum Computing	5
An Artificial Intelligence-Based Pick-and-Place Process Control for Quality Enhancement in Surface Mount Technology	5
Solder Volume Effect on Electromigration Failure Mechanism of Cu/Ni/Sn-Ag Microbumps	5
A Dynamic Control System for Server Processor Direct Liquid Cooling	5
Experimental and Numerical Investigations of the Warpage of Fan-Out Wafer-Level Packaging With SAW Filters	5
Environment-Adaptable Printed-Circuit Board Positioning Using Deep Reinforcement Learning	5