IEEE Design & Test

Papers
(The TQCC of IEEE Design & Test is 2. The table below lists those papers that are above that threshold based on CrossRef citation counts [max. 250 papers]. The publications cover those that have been published in the past four years, i.e., from 2022-05-01 to 2026-05-01.)
ArticleCitations
IEEE Foundation67
Top Picks in Hardware and Embedded Security 202241
Flexible and Portable Management of Secure Scan Implementations Exploiting P1687.1 Extensions36
Special Issue on the 2023 Symposium on Integrated Circuits and Systems Design31
On Backside Probing Techniques and Their Emerging Security Threats28
Celebrating 20 Years of EDA: Milestones, Challenges, and Future Directions25
SPOCK: Reverse Packet Traversal for Deadlock Recovery24
An Energy-Aware Nanoscale Design of Reversible Atomic Silicon Based on Miller Algorithm22
BHT-NoC: Blaming Hardware Trojans in NoC Routers22
Special Issue on Emerging Challenges With 3-D NAND Flash Storage20
Improvement of Functional Safety of the Level-Crossing Barrier Machine by a Noninvasive Angle-Detection Method19
Tipping the Balance: Imbalanced Classes in Deep-Learning Side-Channel Analysis18
Report on the 28th Asia and South Pacific Design Automation Conference18
Statistical Methods for Detecting Recycled Electronics: From ICs to PCBs and Beyond17
IEEE Connects You to a Universe of Information!17
Front Cover16
Celebrating Three Decades of IEEE/ACM International Symposium on Low Power Electronics and Design15
On the Impact of Uncertainties in Silicon-Photonic Neural Networks15
ISCA: Intelligent Sense-Compute Adaptive Co-Optimization of Multimodal Machine Learning Kernels for Resilient mHealth Services on Wearables14
The 2022 International Conference on Computer-Aided Design (ICCAD)13
An Open-Source 12-bit 10-kS/s Incremental ADC in 130-nm CMOS13
Special Issue on Wearable IoT Devices for Reliable Mobile Health Applications12
IC Phone Home!12
IEEE App11
edAttack: Hardware Trojan Attack on On-Chip Packet Compression11
FlooNoC: A Multi-Tb/s Wide NoC for Heterogeneous AXI4 Traffic10
IEEE Design&Test Publication Information10
Soft and Hard Error-Correction Techniques in STT-MRAM10
Hardware/Software Coexploration for Hyperdimensional Computing on Network-on-Chip Architecture9
IEEE Design & Test Publication Information9
Eavesdropping Attack Detection Using Machine Learning in Network-on-Chip Architectures9
Datapath Extension of NPUs to Support Nonconvolutional Layers Efficiently9
Table of Contents9
Get in the Conversation!9
Blank Page9
Special Issue on the 2021 Workshop on Top Picks in Hardware and Embedded Security8
Table of Contents8
Fault-Tolerant Neuromorphic Computing With Memristors Using Functional ATPG for Efficient Recalibration8
IEEE Design & Test Publication Information8
BiomedBench: A Benchmark Suite of TinyML Biomedical Applications for Low-Power Wearables7
FPGA-Chain: Enabling Holistic Protection of FPGA Supply Chain With Blockchain Technology7
SoC-GPIO-Based Dynamic Power Noise Control for Video Sensor Applications7
Remembering Arvind7
CLEAR Cross-Layer Resilience: A Retrospective7
IEEE App7
Evaluating 3D Flash Memory retention reliability under Temperature Elevation6
Voltage–Resistance-Adaptive MPPT Circuit for Energy Harvesting6
On the Relation Between Reliability and Entropy in Physical Unclonable Functions6
CaSA: End-to-End Quantitative Security Analysis of Randomly Mapped Caches6
Special Issue on Approximate Computing: Challenges, Methodologies, Algorithms, and Architectures for Dependable and Secure Systems6
A Survey on Machine Learning Accelerators and Evolutionary Hardware Platforms6
Traversal Packets: Opportunistic Bypass Packets for Deadlock Recovery6
Get in the Conversation!5
Attack of the AI Papers5
IEEE Design & Test Publication Information5
A Tutorial on Secure and Efficient Firmware Delivery5
A Brief 20-Year History and Future Perspectives on Sizing and Layout Synthesis of Analog/RF ICs5
Front Cover5
Special Issue on TinyML5
IEEE Membership5
Robust and Secure Systems5
20 Years of IEEE CEDA and More of EDA5
TechRxiv5
Recap of the 62nd ACM/IEEE Design Automation Conference (DAC62): The “Chips to Systems Conference”5
IEEE Design & Test Publication Information5
Dynamically Reconfigurable Network Protocol for Shape-Changeable Computer System5
Table of Contents5
Binary Forward-Only Algorithms5
Physical Design for Heterogeneous Integration: Challenges and Opportunities5
Circuits to Systems: Codesigning Efficient AI Hardware5
Front Cover4
Novel Technique for Manufacturing, System-Level, and In-System Testing of Large SoC Using Functional Protocol-Based High-Speed I/O4
Special Issue on Design and Test of Multidie Packages4
Recap of the 61st ACM/IEEE Design Automation Conference (DAC61): The “Chips to Systems Conference”4
A BIST Approach to Approximate Co-Testing of Embedded Data Converters4
The 28th IEEE European Test Symposium4
ISLPED 2023: International Symposium on Low-Power Electronics and Design4
Table of Contents4
Functional Verification of a RISC-V Vector Accelerator4
Using STLs for Effective In-Field Test of GPUs4
Special Issue Dedicated to the 2024 Symposium on Integrated Circuits and Systems Design (SBCCI)4
Estimating Code Vulnerability to Timing Errors Via Microarchitecture-Aware Machine Learning4
IEEE Membership4
IEEE Connects You to a Universe of Information!4
CAFEEN: A Cooperative Approach for Energy-Efficient NoCs With Multiagent Reinforcement Learning3
Residual Structural Traces in Logic Locking: Insights from Redundancy Analysis and Beyond3
Special Issue on Top Picks in Test and Reliability3
Heuristic-Based Algorithms for Low-Complexity AV1 Intraprediction3
IEEE Design & Test Publication Information3
A Global Self-Repair Method for TSV Arrays With Adaptive FNS-CAC Codec3
The Future of Design for Test and Silicon Lifecycle Management3
Edge AI—An Industry View3
Table of Contents3
Testing for Electromigration in Sub-5-nm FinFET Memories3
Strange Loops in Design and Technology: 59th DAC Keynote Speech3
Table of Contents3
Long-Wire Leakage: The Threat of Crosstalk3
Table of Contents3
SeMAP—A Method to Secure the Communication in NoC-Based Many-Cores3
Seamless Thermal Optimization of Parallel Workloads3
Report on the 2025 Embedded Systems Week (ESWEEK)3
IEEE Design & Test Publication Information3
Ethical Design of Computers: From Semiconductors to IoT and Artificial Intelligence2
EAVREF: An Evolutionary-Algorithm-Based Tool for Low-Power CMOS Voltage Reference Designs2
Special Issue on NOCS 20222
SoCProbe: Compositional Post-Silicon Validation of Heterogeneous NoC-Based SoCs2
Site-to-Site Variation in Analog Multisite Testing: A Survey on Its Detection and Correction2
IEEE Design & Test Publication Information2
Front Cover2
IEEE App2
Silicon Lifecycle Management (SLM): Requirements, Trends, and Opportunities2
This Stuff Is Great—Am I Right?2
Virtualizing USB Kernel Mode Debug (KMD) Class to Guest OS for Native OS-Like Debug Experience2
Recap of the 29th ACM/IEEE International Symposium on Low Power Electronics and Design (ISLPED’24)2
SAFER: Safety Assurances for Emergent Behavior2
Learning Your Lock: Exploiting Structural Vulnerabilities in Logic Locking2
Majority-Logic-Based Self-Checking Adder in Quantum-Dot Cellular Automata2
Analysis and Mitigation of DRAM Faults in Sparse-DNN Accelerators2
VioNet: A Hierarchical Detailed Routing Wire-Short Violation Predictor Based on a Convolutional Neural Network2
IEEE Foundation2
Special Issue on Wearable IoT Devices for Reliable Mobile Health Applications2
IEEE Membership2
Shaping Resilient AI Hardware Through DNN Computational Feature Exploitation2
3-D Ferroelectric NAND In-Storage Processing Architecture for Mass Spectrometry2
Leveraging RISC-V for HW/SW Codesign of Flexible and Efficient TinyML SoCs2
Special Issue on the 2023 International Symposium on Networks-on-Chip (NOCS 2023)2
Front Cover2
Special Issue on Emerging Challenges With 3-D NAND Flash Storage2
Is There an Answer?2
On the Origin of AI Species2
An EMG Denoising Method Based on Flexible Wearable Sensors2
Postquantum Cryptography for Internet of Things2
Guest Editors’ Introduction: SBCCI 20232
Rethinking SoC Verification for Secure Cross-Layer Interactions2
Building an Open-Source DNA Assembler Device2
Front Cover2
SBCCI 20222
GlucoseHD: Predicting Glucose Levels Using Hyperdimensional Computing2
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